微電子產業多採用多層互連結構來提高電子元件中電路的密度，使多層互連結構失效的主要原因之一為環境影響、熱與機械應力導致界面脫層。由於環境溫度對於多層互連結構脫層行為的影響相關知識仍不足，因此要預測互連結構之可靠度，已成為一大挑戰。為了節省研發所需的成本和時間，必須回到物理基本面找出一個可以描述界面脫層的物理模型，以預測產品的可靠度。界面脫層模型包含界面破壞力學理論、界面脫層驅動力之分析與界面破壞韌性及疲勞脫層之實驗分析，本研究發展之量測系統著重在不同溫度下的疲勞實驗，並以銅與環氧樹脂為目標界面，建立其疲勞裂紋成長模型。
本研究發展一套能配合溫箱使用並且量測材料受混合模式固定相位角下的疲勞成長特性之儀器，透過溫箱內加熱板與熱電偶的搭配來達到高於室溫且穩定環境溫度的目標；本實驗使用彈性基底樑理論，藉此從柔量值(compliance)反推出其相對應的裂紋長度，其中柔量值將由量測試件開口量與作用力來取得，最後經由解析解得到應變能釋放率，再由程式計算出下一周期的施力大小，來確保相位角固定。由加熱溫箱與實驗機台的配合，可得到銅與環氧樹脂界面在高於室溫且受疲勞負載下的疲勞特性常數。透過此實驗所得到的疲勞特性常數配合電子元件中界面缺陷成長模擬，可評估元件在高於室溫下之可靠性，減少研發所需成本與時間。

In this research, the fatigue growths of epoxy-Cu interface cracks under prescribed mode mixities and temperatures were investigated by using a novel mixed mode bending setup. In this setup, two voice coil motors are used to apply two dissimilar bending end-loads on a double cantilever beam (DCB) specimen. The specimen consists of two oxygen-free Cu strips bonded by epoxy. By using an beam-on-elastic-foundation-theory based analytical formula and the compliance method, the crack length and the strain energy release rate were calculated from the opening displacement of beam and the applied end forces. The control program calculates the crack length and phase angle for adjusting the applied end loads to maintain the prescribed mode mixity throughout the fatigue experiment. The temperature environment was kept constant by using a proportional-integral- derivative (PID) controller. By post-processing the experiment results, the subcritical fatigue growth responses of the Cu-epoxy interface were obtained. It was found that the steady-state cyclic fatigue delamination growth rate displays a power-law dependence on the applied strain energy release rate range. As the temperature increases, lower strain release rate is needed to maintain the same crack growth rate than in the lower temperature condition. The temperature-dependent crack growth model can be combined with delamination driving forces obtained for real structures containing the specific interface of interest to estimate the fatigue crack growth behavior and the corresponding structural reliability.

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