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研究生： 李侃峰
Lee, Kang-Feng
論文名稱： 一個整合軟硬體並應用於機電系統之共同設計架構
A Codesign Methodology for Electromechanical Systems with Integrated Software and Hardware
指導教授： 楊世銘
Yang, Shih-Ming
學位類別： 博士
Doctor
系所名稱： 工學院 - 航空太空工程學系
Department of Aeronautics & Astronautics
論文出版年： 2007
畢業學年度： 95
語文別： 英文
論文頁數： 118
中文關鍵詞： 整合 、共同設計架構 、機電系統
外文關鍵詞： Electromechanical, Integrated, Codesign
相關次數： 點閱：67  下載：4 
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    • 託科技進步之賜，新世代系統間之輪替情形越來越明顯。系統設計時程必須大幅縮短才能有效地與既定時程相配合與應用。由於積體電路之微小化，體積輕巧但架構複雜之電子相關產品成為全球市場主流，在此競爭架構內，為符合此趨勢，系統設計中之同步設計架構(Codesign)，成為系統發展利器。根據此架構，本文提出一改良同步設計架構，並利用較高層級之設計，使得其流程可以適用於任何設計需求並符合初始設計需求。所提出之同步設計架構，不僅符合跨領域應用之需求，例如：有線系統、無線系統與機電系統，更將系統設計中之重複使用性與系統內部設計協調性一併納入考慮範圍。
    有線系統之同步設計架構整合了軟體、硬體與介面設計，實作驗證之結果顯示該架構能有效提升系統設計速度、重複使用性與系統內部設計協調性，並改善利用傳統或其他設計方法的限制。較有線架構多了無線通訊協定之無線架構，於無線標籤識別系統之實作中，該架構提供一系統觀點，使得無線系統環境較易掌控，且有助於達到系統設計之要求。應用機電系統架構能於有限時間內改善傳統機電設計架構之缺點。於磁控式濺鍍系統實作中，機電系統架構有效減低設計時程與各設計間的等待時間。這些實作系統充分表現同步設計架構的跨領域優勢與提供系統設計過程更多的可見性。

    Conventional design processes are known lack of hardware and software co-simulation and co-synthesis capability. Codeign, rapid system prototyping and concurrent engineering have thus been proposed to improve the design process of engineering systems; however, they are often restricted in specific application domain. This dissertation aims at presenting a high level abstract codesign methodology to meet the design requirement and specifications in electromechanical systems, such that the design process is reusable, interoperable and compatible to cross-field applications.
    Codesign methodology not only considers the mutual influence of hardware and software early in the design process to reduce time and cost, but also evaluates the design trade space to enhance design quality. The effectiveness of the codesign methodology are validated by three design implementations. For the example of a touch panel controller, the implementation on wired system indicate that the design speed, reusability and interpretability are improved. For the example of an RFID system, the implementation on wireless system offers a system view to handle the fastest growing wireless applications. For the example of a sputter cathode, the implementation of the codesign methodology is shown to achieve high performance. The codesign methodology can be applied to engineering systems by reusable, interoperable and compatible design process. The high level abstract codesign methodology has emerged as a way of bringing general purpose solutions to design process from concepts to practice.

    ABSTRACT …………………………………………………………… i CONTENTS ……………………………………………………………ii LIST OF TABLES………………………………………………………iv LIST OF FIGURES………………………………………………………v CHAPTER I INTRODUCTION ………………………………………………1 1.1 Motivation and Objective………………………………………1 1.2 Literature Review………………………………………………2 1.3 Outline……………………………………………………………5 II CODESIGN METHODOLOGY……………………………………8 2.1 Introduction………………………………………………………8 2.2 Codesign Models Review…………………………………………8 2.3 Codesign Model Evolution……………………………………10 2.4 Summary……………………………………………………………13 III A WIRED SYSTEM BY CODESIGN……………………………20 3.1 Introduction……………………………………………………20 3.2 Human Input System……………………………………………20 3.2.1 Wired interface based on resistive touch screen sensors………21 3.2.2 Wired Interface Codesign…………………………………22 3.3 Implementation and Verification……………………………24 3.3.1 System specification and architecture……………24 3.3.2 Hardware and software design…………………………25 3.3.3 Interface and verification……………………………28 3.4 Implementation of Available Models………………………31 3.5 Summary……………………………………………………………32 IV A WIRELESS SYSTEM BY CODESIGN………………………50 4.1 Introduction……………………………………………………50 4.2 Wireless system………………………………………………50 4.3 Wireless Application…………………………………………51 4.3.1 RFID System………………………………………………51 4.3.2 RFID System Codesign……………………………………54 4.4 Implementation and Verification……………………………55 4.5 Summary……………………………………………………………56 V AN ELECTROMECHANICAL SYSTEM BY CODESIGN…………67 5.1 Introduction……………………………………………………67 5.2 Electromechanical System……………………………………68 5.3 Implementation and Verification……………………………75 5.4 Summary……………………………………………………………82 VI SUMMARY AND CONCLUSIONS………………………………109 REFERENCES……………………………………………………………111 LIST OF TABLES Table Page 1.1 Comparison of the codesign model 7 3.1 Ptolemy domains [Ptolemy II 5.0.1] 33 4.1 RFID operating frequencies 57 4.2 RFID communication format 58 5.1 Percentage error between element PLANE13 and PLANE53 83 5.2 Average magnetic flux density at different angles 84 5.3 Results of the target erosion in the hybrid magnet set 85 LIST OF FIGURES Figure Page 2.1 A general software and hardware system 15 2.2 Sequential system design 16 2.3 Abstract models communicating through interconnections 17 2.4 A process of software and hardware concurrent design 18 2.5 An example of high level abstract and configurable architecture for subsystem or component design 19 3.1 The codesign methodology for a wired system 34 3.2 A high level abstract and configurable architecture for system definition 35 3.3 A process of hardware design and manufacture 36 3.4 Operation of ADS7845 [Texas Instruments, SBAS104] 37 3.5 A 5-wire touch screen construction [Texas Instruments, SBAA036] 38 3.6 A pin-to-pin diagram from the touch screen to ADS7845 39 3.7 A pin-to-pin diagram from PIC16C745 to USB connector 40 3.8 Connection net lists for PCB 41 3.9 A virtual PCB layout model 42 3.10 A process of software design and test 43 3.11 The 4-corner calibration 44 3.12 Installation interface of software 45 3.13 Software GUI control panel 46 3.14 A process of the hardware/software interface design and codesign 47 3.15 Firmware development environment-MPLAB IDE 48 3.16 The circuit scheme for 4-8-wire touch screen controller 49 4.1 A codesign architecture for wireless system 59 4.2 Components of an RFID system 60 4.3 Level of tracking in RFID system 61 4.4 Architecture of the RFID system design 62 4.5 A process of middleware design 63 4.6 The algorithm of security system 64 4.7 RFID middleware virtual simulation 65 4.8 (a) Read data from tag and (b)write data to tag 66 5.1 A codesign architecture for electromechanical system 86 5.2 The diagram of DC, RF and MF sputtering 87 5.3 The moving path of electrons in the orthogonal magnetic (B), oriented perpendicularly to the page, and electrical (E) fields 88 5.4 The erosion pattern of a rectangular magnetron cathode 89 5.5 Target at pre-and-post sputtering processes 90 5.6 A process of finite element model design 91 5.7 The finite element model of a cathode, (a) 2-D model and (b) meshed model 92 5.8 A process of physical model design 93 5.9 A process of model simulation 94 5.10 The 2-D magnetic flux line distribution 95 5.11 The 2-D magnetic flux line distribution and the target erosion shape 96 5.12 The different magnet set, (a) angle method and (b) Heras method 97 5.13 The 2-D magnetic flux distribution of different magnet set 98 5.14 The 2-D magnetic flux distribution at different angles 99 5.15 The magnet set and cooling guider 100 5.16 The arrangement of original magnet set 101 5.17 The arrangement of inclined magnet set 102 5.18 The geometry of the hybrid magnet set 103 5.19 The hybrid magnet set 104 5.20 The installed magnet set 105 5.21 The sputtered target 106 5.22 The cross section profile of the sputtered target 107 5.23 The measurement of the sputtered target 108

    Allara, A., Bombana, M., Fornaciari, W. and Salice, F., “A Case Study in Design Space Exploration: the Tosca Environment Applied to a Telecommunication Link Controller,” Design & Test of Computers, IEEE, vol.17, issue 2, pp. 60-72, 2000.
    Amerongen, J. V., “The Role of Control in Mechatronics,” Engineering Science and Education Journal, vol. 9, issue 3, pp. 105-112, 2000.
    Arató, P., Mann, Z. A. and Orban, A., “Algorithmic Aspects of Hardware/software Partitioning,” ACM Trans. on Design Automation of Electronic Systems, vol. 10, issue 1, pp. 136-156, 2005.
    Auslander, D. M., “What is Mechatronics?,” IEEE/ASME Trans. on Mechatronics, vol. 1, issue 1, pp. 5-9, 1996.
    Bolsens, I., Man, H. J. D., Lin, B., Rompaey, K. V., Vercauteren, S. and Verkest, D., “Hardware/Software Co-Design of Digital Telecommunication Systems,” Proc. of the IEEE, vol. 85, issue 3, pp. 391-418, 1997.
    Brandtner, T., “Chip-Package Codesign Flow for Mixed-Signal SiP Designs” IEEE Design & Test of Computers, vol. 23, issue 3, pp. 196-202, 2006.
    Carchiolo, V., Malgeri, M. and Mangioni, G., “Hardware/software Synthesis of Formal Specifications in Codesign of Embedded Systems,” ACM Trans. on Design Automation of Electronic Systems, vol. 5, issue 3, pp. 399-432, 2000.
    Chapman, B., Glow Discharge Processes, John Wiley & Sons, 1980.
    Dimitris, P. L. and Demetre, J. E., “Two-Dimensional Simulation of Polysilicon Etching with Chlorine in a High Density Plasma Reactor,” IEEE Trans. on Plasma Sci., vol. 23, no. 4, pp. 573-580, 1995.
    Dubois, H., Sentieys, O., Chillet, D. and Philippe, J. L., “Teaching Hardware/software System Codesign Using CAD Tools: A Case Study in Image Synthesis,” IEEE Transactions on Education, vol 43, issue 3, pp. 277-283, 2000.
    Engström, C., Berlind, T., Birch, J., Hultman, L., Ivanov, I. P.,Kirkpatrick, S. R. and Rohde, S., “Design, Plasma Studies, and Ion Assisted Thin Film Growth in an Unbalanced Dual Target Magnetron Sputtering System with a Solenoid Coil,” Vacuum, vol. 56, pp. 107-113, 2000.
    Giusto, P. and Demmeler, T., “Rapid Design Exploration of Safety-Critical Distributed Automotive Applications via Virtual Integration Platforms,” Journal of Systems and Software, vol.70, issue 3, pp. 245-262, 2003.
    Glidden, R., Bockorick, C., Cooper, S., Diorio, C., Dressler, D., Gutnik, V., Hagen, C., Hara, D., Hass, T., Humes, T., Hyde, J., Oliver, R., Onen, O., Pesavento, A., Sundstrom, K. and Thomas, M., “Design of Ultra-Low-Cost UHF RFID Tags for Supply Chain Applications,” IEEE Communications Magazine, vol. 42, issue 8, pp. 140-151, 2004.
    Gogniat, G., Auguin, M., Bianco, L. and Pegatoquet, A., “A Codesign Back-end Approach for Embedded System Design,” ACM Trans. on Design Automation of Electronic Systems, vol. 5, issue 3, pp. 492-509, 2000.
    Gupta, R. K., “Co-Synthesis of Hardware and Software for Digital Embedded Systems,” Ph.D. dissertation, Stanford Univ., Stanford, CA, 1993.
    Heras, N., Torrado, A., Barandiarán, J. M. and Goikoetxea, J., “Magnetic Design of a Cathodic Arc and Sputtering Polyvalent Source for Vapor Deposition,” IEEE Trans. on Magn., vol. 30, no. 6, pp. 4683-4685, 1994.
    Hood, W., Hoffman, M., Malley, J., Myers, C., Ong, R., Rundquist, E., Scanlan, L., Shirley, F. and Uyemura, D., “Sanders RASSP Program Overview,” The RASSP Digest, Vol. 2, pp. 1-32, 1995.
    Iosad, N. N., Jackson, B. D., Polyakov, S. N., Dmitriev, P. N. and Klapwijk, T. M., “Reactive Magnetron Sputter-Deposition of NbN and (Nb,Ti)N Films Related to Sputtering Source Characterization and Optimization,” J. Vac. Sci. Technol., vol. 19, no. 4, pp. 1840-1845, 2001.
    Iosad, N. N., Jackson, B. D., Klapwijk, T. M., Polyakov, S. N., Dmitriev, P. N. and Gao J. R., “Optimization of RF- and DC-Sputtered NbTiN Films for Integration with Nb-Based SIS Junctions,” IEEE Trans. on Applied Superconductivity, vol. 9, no. 2, pp. 1716-1719, 1999.
    Iosad, N. N., Klapwijk, T. M., Polyakov, S. N., Roddatis, V. V., Kov’ev, E. K. and Dmitriev, P. N., “Properties of DC Magnetron Sputtered Nb and NbN Films for Different Source Conditions,” IEEE Trans. on Applied Superconductivity, vol. 9, no. 2, pp. 1720-1723, 1999.
    Isermann, R., “Modeling and Design Methodology for Mechatronic Systems,” IEEE/ASME Transactions on Mechatronics, vol. 1, issue 1, pp. 16-28, 1996.
    Ismail, T.B., Abid, M., O’Brien, K. and Jerraya, A. A., “An Approach for Hardware-Software Codesign,” Proc. of Int. Workshop on Rapid System Prototyping, pp 73-80, 1994.
    Jang, S. K., Kim, S. D., Lee, J., Choi, G. Y. and Ra, J. B., “Hardware-software Co-implementation of a H.263 Video Codec” IEEE Trans. on Consumer Electronics, vol. 46, issue 1, pp. 191-200, 2000.
    Jerraya, A. A. and Wolf, W., “Hardware/Software Interface Codesign for Embedded Systems,” IEEE Computer, vol. 38, no. 2, pp. 63-69, 2005.
    Kalavade, A. and Lee, E. A., “A Hardware-Software Codesign Methodology for DSP Applications,” IEEE Design & Test of Computers, vol. 10, issue 3, pp. 16-28, 1993.
    Kashiwagi, M. and Ido, S., “Computational Analyses of a Magnetron Sputtering System with a Ferromagnetic Target,” Vacuum, vol. 53, pp. 33-36, 1999.
    Kent, K. B. and Serra, M., “Hardware Architecture for Java in a Hardware/Software Co-Design of the Virtual Machine,” Euromicro Symposium on Digital System Design, pp. 20-27, 2002.
    Kerr, C. I. V., Roy, R. and Sackett, P. J., “Requirements Management: an Enabler for Concurrent Engineering in the Automotive Industry,” International Journal of Production Research, vol. 44, issue 9, pp. 1703-1717, 2006.
    Keutzer, K., Newton, A.R., Rabaey, J. M. and Sangiovanni-Vincentelli, A., “Design of Integrated Circuits and Systems,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 19, issue 12, pp. 1523-1543, 2000.
    Kordon, F. and Luqi, “An Introduction to Rapid System Prototyping,” IEEE Transactions on Software Engineering, vol. 28, no. 9, pp.817-821, 2002.
    Korzekwa, R., Lehr, F. M., Krompholz, H. G. and Kristiansen, M., “The Influence of Magnetic Fields on Dielectric Surface Flashover,” IEEE Trans. on Electron Devices, vol. 38, no. 4, pp. 745-749, 1991.
    Krikke, J., “T-Engine: Japan's Ubiquitous Computing Architecture Is Ready For Prime Time,” IEEE Pervasive Computing, vol. 4, issue 2, pp. 4-9, 2005.
    Lin, T. H., Kaiser, W. J. and Pottie, G. J., “Integrated Low-Power Communication System Design for Wireless Sensor Networks,” IEEE Communications Magazine, pp. 142-150, 2004.
    Madisetti, V. K., “Electronic System, Platform, and Package Codesign,” IEEE Design & Test of Computers, vol 23, issue 3, pp. 220-233, 2006.
    Marchioro, G. F., Daveau, J. M., Ismail, T. B. and Jerraya, A. A., “Transformational Partitioning for Codesign,” IEEE Proc-Compur. Digit. Tech., vol. 145, no. 3, pp. 181-195, 1998.
    Martin, P. J., “Filtered Arc Evaporation,” Surf. Coat. Technol., vol. 9, no. 1, pp. 51-58, 1993.
    Mattox, D. M., “A Concise History of Vacuum Coating Technology,” http://www.svc.org, 2000.
    McCann, P. J. and Roman, G. C., “Compositional Programming Abstractions for Mobile Computing,” IEEE Trans. on Software Engineering, vol. 24, issue. 2, pp. 97-110, 1998.
    Micheli, G. D. and Gupta, R. K., “Hardware/Software Co-Design,” Proc. of the IEEE, vol. 85, no. 3, pp. 349-365, 1997.
    Minestrini, M., Ferrario, M. Kulinski, S. and Tazzari, S., “Magnetron Sputtering Configuration for Coating 1.3GHz Cavities with a Nb Film,” IEEE Trans. on Magn., pp. 968-970, 1993.
    Moreau J. P., di Crescenzo, P. and Pople, L., “Hardware Software System Codesign Based on SDL/C Specifications.” Microelectronic Engineering, vol. 54, issue 1-2 , pp. 181-191, 2000.
    Newman, N., Cole, B. F., Garrison, S. M. and Char, K., “Double Gun Off-Axis Sputtering of Large Area Yba2Cu3O7-δ Superconducting Films for Microwave Applications,” IEEE Trans. on Magn., vol. 27, no. 2, pp. 1276-1279, 1991.
    Noguera, J. and Badia, R. M. “HW/SW Codesign Techniques for Dynamically Reconfigurable Architectures,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 10, issue 4, pp.399-415, 2002.
    Reyneri, L. M.; “Implementation Issues of Neuro-fuzzy Hardware: Going toward HW/SW Codesign,” IEEE Transactions on Neural Networks, vol. 14, issue 1, pp. 176-194, 2003.
    Reyneri L. M., “A Simulink-based Hybrid Codesign Tool for Rapid Prototyping of FPGA's in Signal Processing Systems,” Microprocessors and Microsystems, vol. 28, issue 5-6, pp. 273-289, 2004.
    Riekki, J., Salminen, T. and Alakarppa, I., “Requesting Pervasive Services by Touching RFID Tags,” IEEE Pervasive Computing, vol.5, issue 1, pp. 40-46, 2006.
    Rossnagel, S. M., “Sputter Deposition for Semiconductor Manufacturing,” IBM Journal of Research and Development, vol. 43, 1/2, 1999.
    Sahraoui, A.E.K.; Romdhani, M.; Jeffroy, A. and Dechazelles, P., “A Multi-formalisms Approach for Codesign in the Development of Avionics” IEEE Aerospace and Electronic Systems Magazine, vol. 11, issue 5, pp. 33-38, 1996.
    Sakamura, K. and Koshizuka, N., “The eTRON Wide-Area Distributed-System Architecture for E-Commerce,” IEEE Micro, vol. 21, issue 6, pp. 7-12, 2001.
    Schaumont, P., Ching, D. and Verbauwhede, I., “An Interactive Codesign Environment for Domain-specific Coprocessors,” ACM Trans. on Design Automation of Electronic Systems, vol. 11, issue 1, pp. 70-87, 2006.
    Shidoji, E., Nemoto, M., Nomura, T. and Yoshikawa, Y., “3D Simulation of Target Erosion in DC Magnetron Sputtering,” Jpn. J. Appl. Phys., vol. 33, no. 7B, pp. 4281-4284, 1994.
    Shon, C. H., Lee, J. K., Lee, H. J., Yang, Y. and Chung, T. H., “Velocity Distribution in Magnetron Sputter,” IEEE Trans. on Plasma Sci., vol. 26, no. 6, pp. 1635-1644, 1998.
    Siegmund, R. and Muller, D., “Automatic Synthesis of Communication Controller Hardware from Protocol Specifications,” IEEE Design & Test of Computers, vol. 19, issue 4, pp.84-95, 2002.
    Slomka, F., Dorfel, M. Munzenberger, R. and Hofmann, H., “Hardware/Software Codesign and Rapid Prototyping of Embedded Systems,” IEEE Design & Test of Computers, vol.17, issue 2, pp. 28-38, 2000.
    Song, L., Parhi, K. K., Kuroda, I. and Nishitani, T., “Hardware/Software Codesign of Finite Field Datapath for Low-Energy Reed-Solomon Codecs,” IEEE Trans. on VLSI Systems, vol. 8, issue 2, pp. 160-172, 2000.
    Srivastava, M. B. and Brodersen, R. W., “SIERA: A Unified Framework for Rapid-Prototyping of System-Level Hardware and Software,” IEEE Trans. on Computer-Aided-Design of Integrated Circuits and Systems, vol. 14, no. 6, pp. 676-693, 1995.
    Swirbel, T., “Zero-Defect Sputter Deposition Metallization Method for High-Volume Manufacturing of Grafted Multilayer Thin Film Models,” IEEE Trans. on Components, pp. 1060-1065, 1992.
    Takahashi, T., Ikeda, N. and Naoe, M., “Improvement of Toroidal Plasma (TP) Type Sputtering for Depositing Co-Cr Films on Plasma-Free Substrates,” IEEE Trans. on Magnetics, vol. 26, no. 5, pp. 1611-1613, 1990.
    Thepayasuwan, N. and Doboli, A., “Layout Conscious Approach and Bus Architecture Synthesis for Hardware/software Codesign of Systems on Chip Optimized for Speed,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 13, issue 5, pp. 525-538, 2005.
    Thomas, D. E., Adams, J. K. and Schmit, H., “A Model and Methodology for Hardware-Software Codesign,” IEEE Design & Test of Computers, pp. 6-15, 1993.
    Thomas, C., Bickerstaff, M. A., Davis, L. M., Prokop, T., Widdup, B., Zhou, G., Garrett, D. and Nicol, C., “Integrated Circuits for Channel Coding in 3G Cellular Mobile Wireless Systems,” IEEE Communications Magazine, vol. 41, issue 8, pp. 150-159, 2003.
    Tominaga, K., Ao, T., Sato, Y., Mori, I., Kusaka, K. and Hanabusa, T., “Magnetic Field Dependence of AlN Film Properties in DC Planar Magnetron Sputtering with Opposed Targets,” Vacuum, vol. 51, pp. 549-553, 1998.
    Varma, A. K., Glaser, A. and Franzon, P. D., “CAD Flows for Chip-package Coverification,” IEEE Trans. on Advanced Packaging, vol 28, issue 1, pp. 96-101, 2005.
    Wang, R. and Yang, S., “The Design of a Rapid Prototype Platform for ARM Based Embedded System,” IEEE Trans. on Consumer Electronics, vol. 50, no. 2, pp. 746-751, 2004.
    Wiangtong, T., Cheung, P. Y. K. and Luk, W., “Hardware/software Codesign: a Systematic Approach Targeting Data-intensive Applications,” IEEE Signal Processing Magazine, vol. 22, issue 3, pp. 14-22, 2005.
    Wiese, P., “In the Beginning,” IEE Manufacturing Engineer, vol. 74, issue 4, pp. 164-165, 1995.
    Wolf, W., “A Decade of Hardware/software Codesign,” IEEE Computer Society, vol 36, issue 4, pp. 38-43, 2003.
    Yang, Y., Bhaskar, K. and Prasanna, V. K., “Issues in Designing Middleware for Wireless Sensor Networks,” IEEE Network, vol. 18, issue 1, pp. 15-21, 2004.
    Zakarian, A., Rushton, G. J., “Development of Modular Electrical Systems”, IEEE/ASME Transactions on Mechatronics, vol. 6, issue 4, pp. 507-520, 2001.
    Zhang, T., Chakrabarty, K. and Fair, R. B., “Design of Reconfigurable Composite Microsystems Based on Hardware/software Codesign Principles,” IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol 21, issue 8, pp. 987-995, 2002.
    Http://vhdl.org/vi/codesign/Welcome.html, 2005.

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