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研究生: 謝文淵
HSIEH, WUN-YUAN
論文名稱: 六方氮化硼厚度對侷域表面電漿結構的影響
Influence of Hexagonal Boron Nitride Thickness on Localized Surface Plasmon Structures
指導教授: 周昱薰
Chou, Yu-Hsun
學位類別: 碩士
Master
系所名稱: 理學院 - 光電科學與工程學系
Department of Photonics
論文出版年: 2025
畢業學年度: 113
語文別: 中文
論文頁數: 89
中文關鍵詞: 六方氮化硼 、侷域表面電漿 、二維材料 、激子 、光致發光
外文關鍵詞: Hexagonal Boron Nitride, Localized Surface Plasmon, Two-Dimensional Materials, Exciton, Photoluminescence
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  • 本研究目的在探討六方氮化硼(hexagonal boron nitride, h-BN)作為間隔層,其厚度變化對侷域表面電漿(localized surface plasmon, LSP)結構之光學性質影響,並進一步了解其對 TMDC(如:WSe2與 MoS2)激子與金屬奈米粒子間耦合效率的調控效果。研究核心在於提升光致發光(PL)效率與增強LSP共振現象,以促進奈米光電元件之發展。
    本研究使用機械剝離法取得單層 WSe2 與 MoS2,並轉移至含不同厚度 h-BN 的基板上製成異質結構,以奈米銀粒作為 LSP 來源。實驗部分透過光致發光量測、原子力顯微鏡(AFM)與光學顯微鏡分析樣品表面結構與發光特性;同時搭配 COMSOL 模擬,分析等效折射率、傳播距離、波導侷限係數、模態體積與雷射閾值增益等參數,深入探討不同 h-BN 厚度對光場分佈與侷限性的影響。
    實驗結果顯示,適當厚度的 h-BN 能有效減少非輻射淬滅效應,提升激子與 LSP 的交互作用效率,進而增強 PL 訊號。模擬分析也指出,h-BN 厚度會影響電場集中度與模態體積,從而改變耦合強度與共振行為。整體而言,約 10 ~ 20 nm範圍的 h-BN 厚度最有利於 LSP 與激子的強耦合,為未來設計高效率、低功耗的奈米光電元件提供關鍵指引。

    This research systematically investigates the influence of hexagonal boron nitride (h-BN) spacer layer thickness on the optical performance and exciton–plasmon coupling behavior in heterostructures composed of two-dimensional (2D) transition metal dichalcogenides (TMDCs) and silver nanoparticles. By employing monolayer WSe2 and MoS2 as the excitonic materials and incorporating AgNPs as localized surface plasmon (LSP) sources, we fabricated a series of heterostructures with varying h-BN thicknesses to explore their effect on photoluminescence (PL) enhancement and electromagnetic field confinement. Both experimental and simulation approaches were utilized to gain comprehensive insight into the interactions within these nanostructures.
    Experimentally, samples were prepared via mechanical exfoliation of TMDCs, followed by transfer onto SiO2/Si substrates pre-coated with h-BN films of different thicknesses. AgNPs were subsequently deposited to induce LSP resonance. Optical characterization was performed using PL spectroscopy, atomic force microscopy (AFM), and optical microscopy. Meanwhile, numerical simulations using COMSOL Multiphysics provided insights into parameters such as effective refractive index, propagation length, mode volume, waveguide confinement factor, and laser threshold gain.
    Results demonstrate that appropriate h-BN thickness is crucial for achieving strong exciton–plasmon coupling while minimizing non-radiative quenching. Thinner h-BN layers (~5–10 nm) were found to significantly enhance PL intensity, indicating improved coupling efficiency and optimal field overlap. In contrast, excessively thick h-BN layers reduced the field strength experienced by the TMDCs, leading to diminished enhancement. Simulations corroborated experimental trends and revealed that thin h-BN not only maximized electric field localization but also minimized mode volume and threshold gain, which are essential for applications such as plasmonic nanolasers.
    This study highlights the importance of spacer layer engineering in exciton–plasmon systems and provides a critical guideline for designing highly efficient, low-power optoelectronic devices. The findings can be applied in the development of quantum light sources, plasmon-enhanced sensors, and compact photonic circuits.

    中文摘要 I Abstract II 致謝 VII 目錄 IX 表目錄XIII 圖目錄XIV 第一章 緒論 1 1-1前言 1 1-2研究動機與目的 1 第二章 實驗原理 3 2-1實驗簡介 3 2-2激子(Exciton) 3 2-3表面電漿(Surface Plasmon) 4 2-4表面電漿子 4 2-5表面電漿極化子(Surface Plasmon Polaritons, SPPs) 4 2-5.1侷域表面電漿子(Localized Surface Plasmons, LSPs) 9 2-6耦合(coupling) 11 2-6.1弱耦合(weak coupling) 11 2-6.2強耦合(strong coupling) 11 2-6.3拉比分裂(Rabi splitting) 12 2-7二維材料 13 2-8過度金屬二硫族化物(TMDCs) 13 2-8.1晶體結構 14 2-8.2能帶結構 15 2-8.3光學特性 16 2-8.4晶體缺陷 16 2-8.5彌補TMDC晶體缺陷 17 2-9機械剝離法 19 第三章 實驗方法與步驟 20 3-1 實驗設計與流程概述 20 3-2 樣品製程 21 3-2.1基板的準備與清洗 21 3-2.2 單層二維材料製備 21 3-2.3轉移二維材料 23 3-3COMSOL模擬設定 24 3-3.1等效折射率 25 3-3.2傳播距離(propagation length) 25 3-3.3波導侷限係數(waveguide confinement factor) 26 3-3.4雷射閾值增益 27 3-3.5模態體積 27 3-4實驗量測 28 3-4.1光致發光量測系統的光路設計 28 3-4.2光致發光量測 29 3-5實驗儀器介紹 29 3-5.1光學顯微鏡(Optical Microscopy, OM) 29 3-5.2光譜儀(Spectroscope) 30 3-5.3光譜儀感測器 31 3-5.4旋轉塗佈機 32 3-5.5熱蒸鍍機(Thermal Evaporator) 32 3-5.6原子層沉積(Atomic Layer Deposition, ALD)系統設備 33 3-5.7原子力顯微鏡(Atomic Force Microscope, AFM) 34 3-6實驗材料與儀器的廠牌及型號 35 第四章 結果及討論 37 4-1材料分析 37 4-1.1單層WSe2 37 4-1.2單層MoS2 38 4-1.3六方氮化硼(h-BN) 38 4-1.4奈米銀粒 39 4-2僅以六方氮化硼保護材料的異質結構 40 4-3上方疊上奈米銀條的異質結構 43 4-4 COMSOL模擬WSe2侷域表面電漿結構 45 4-4.1介電層材料(Al2O3)厚度比較 46 4-4.2保護層(h-BN)厚度比較 47 4-5實驗分析(WSe2)48 4-5.1h-BN厚度最厚的WSe2異質結構 48 4-5.2h-BN厚度中等的WSe2異質結構 50 4-5.3h-BN厚度最薄的WSe2異質結構 52 4-5.4無h-BN的WSe2異質結構 54 4-5.5不同厚度h-BN對WSe2異質結構的影響 55 4-6 Comsol模擬MoS2侷域表面電漿結構之保護層(h-BN)厚度比較 56 4-7實驗分析(MoS2) 57 4-7.1h-BN厚度最厚的MoS2異質結構 58 4-7.2h-BN厚度中等的MoS2異質結構 59 4-7.3h-BN厚度最薄的MoS2異質結構 60 4-7.4不同厚度h-BN對MoS2異質結構的影響 62 第五章 結論與未來工作 63 5-1結論 63 5-2未來工作 63 參考文獻 65

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