電子元件常會因晶片、基板或電路板的熱膨脹係數的差異，而在使用上產生熱應力與應變，而造成元件的疲勞損壞。在覆晶電子構裝中，因錫球連接晶片與基板，因此承受於兩者之間產生的熱應力常會造成錫球產生破壞。因此，如何提高錫球的可靠度便顯得格外重要。
本文建立一三維覆晶構裝模型，考慮錫球材料性質為黏塑性，液態底填封膠為黏彈性，其餘晶片與基板均假設為彈性，使用有限元素分析法進行熱應力分析，藉以觀察覆晶構裝中各元件受溫度循環負載變化下的應力與應變情形。
而覆晶構裝各材料的選擇與尺寸的設計，亦影響到錫球所承受的應變大小，因此採用田口式參數設計方法，經由田口式直交表的實驗結果，找出最佳的參數設計組合，期使錫球的最大等效應變達到最小化的目標。

An electronic device often cause damage because of the thermal stress and strain,which results from the variation of temperature。In a Flip-Chip Package,the solder balls which locate between the chip and the substrate especially easy to cause fatigue damage by the strain。
To observe the stress and strain state in the Flip-Chip Package，we can build a three dimension Finite Element Model and apply a temperature cycle loading to simulate the real situation。The Taguchi Method can be used to help us to understand the effect of the design factors in the FC package，and find the optimum factors combination to reduse the thermal strain on the solder balls.

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