本研究是描述的是一種可以利用溫度差發電的熱電能源採集器，目標為利用台積電中的矽鍺0.18 μm BiCMOS製程設計並製造出1.2 mm×1.2 mm的高輸出電壓熱電能源採集器晶片並且設計出適合該晶片的封裝。透過數值模擬分析，蝕刻窗大小是33 μm×2 μm的熱電能源採集器有最高的輸出電壓係數30.02 V/cm2K。在晶片完成鋁箔膠帶封裝後，蝕刻窗大小是33 μm×3 μm的熱電能源採集器在17度的溫差下有76.29 mV的輸出電壓和18.22 V/cm2K的輸出電壓係數，相較於尚未封裝的晶片依然保留72.1%的輸出電壓，大約28 %的溫差再封裝中散失並且低於前人的研究。根據數值模擬與封裝實驗結果，在20 K的溫差下熱電能源採集器晶片在沒有封裝及有封裝下可以分別輸出2.3 V 與1.7 V的輸出電壓。

This work describes a thermoelectric energy generator (TEG) which generates electrical power by temperature difference. This thesis aims at designing and fabricating a TEG with high output voltage and adaptable packaging. The 1.2 mm×1.2 mm TEG chip is by TSMC SiGe 0.18 μm BiCMOS process. The simulation results show that the TEG with 33 μm×2 μm etching window size has the highest voltage factor at 30.02 V/cm2K. By using the packaging of aluminum tape, the output voltage of the TEG of 3 μm etching window width 76.29 mV at 17 K temperature difference, and the voltage factor is 18.22 V/cm2K which is 72.1 % of the TEG without packaging. This is due to about 28 % temperature difference loss at the packaging, and that is less than the previous works. According to the simulation result and experiment result, the output voltage of TEG chip is 2.3 V without package and the output voltage of TEG chip will be 1.7 V with package at 20 K temperature difference.

Chen M. D., “Structure Design and Performance Analysis of SiGe Thermoelectric Energy Harvesters,” M.S. Thesis, National Cheng Kung University 2017.
Chen Z., Che F., Ding M. Z., Ho D. S. W., Chai T. C. and Rao V. S., “Drop Impact Reliability Study of High Density Fan-Out Wafer Level Package,” IEEE Electronics Packaging Technology Conference (EPTC), Vol 18, pp. 771-778, 2016.
Kanimba E., Pearson M., Sharp J., Stokesd D., Priya S. and Tian Z, “A Modeling Comparison Between a Two-stage and Three-Stage Cascaded Thermoelectric Generator,” Journal of Power Sources, Vol. 365, pp. 266-272, 2017.
Kouma N., Nishino T. and Tsuboi. O, “A High-Output-Voltage Micro-Thermoelectric Generator Having High-Aspect-Ratio Structure,” Journal of Micromechanics and Microengineering, Vol. 23, pp. 114005, 2013.
Kripesh V., Rao V. S., Kumar A., Sharma G., Houe K. C., Xiaowu Z., Mong K. Y., Khan N. and Lau J., “Design and Development of a Multi-Die Embedded Micro Wafer Level Package,” IEEE Electronic Components and Technology Conference, Vol. 58, pp. 1544-1549, 2008.
Kuo K. H., Chiang J., Chang K., Shu J., Chien F. L., Wang K. and Lee R., “Studying the Effect of Stack up Structure of Large Die Size Fan-In Wafer Level Package at 0.35 mm Pitch with Varying Ball Alloy to Enhance Board Level Reliability Performance,” IEEE Electronic Components and Technology Conference (ECTC), Vol. 66, pp. 140-146, 2016.
Lee C. and Xie J., “Design and Optimization of Wafer Bonding Packaged Microelectromechanical Systems Thermoelectric Power Generators with Heat Dissipation Path,” Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, Vol. 27, pp. 1267-1271, 2009.
Lee H. B., Yang H. J., We J. H., Kim K., Choi K. C. and Cho B. J., “Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method,” Journal of Electronic Materials, Vol. 40, pp. 615–619, 2011.
Qiao J., Jin M., He W., Chien W. T. K. and Zhao S., “Comprehensive Wafer Level Package Die Processing Service Quality Control Enhancement,” IEEE Industrial Engineering and Engineering Management (IEEM), pp. 1684-1688, 2015.
Roth, R., Rostek, R., Cobry, K., Kohler, C., Groh, M., and Woias, P., “Design and Characterization of Micro Thermoelectric Cross-Plane Generators with Electroplated and Reflow Soldering,” Journal of Microelectromechanical Systems, Vol. 23, pp. 961-971, 2014.
Strothmann T., Yoon Seung W. and Lin Y., “Encapsulated Wafer Level Package Technology (eWLCS),” IEEE Electronic Components and Technology Conference (ECTC), Vol. 64, pp. 931-934, 2014.
Strasser M., Aigner R., Franosch M., and Wachutka G., “Miniaturized Thermoelectric Generators Based on Poly-Si and Poly-SiGe Surface Micromachining,” Sensors and Actuators A: Physical, Vol. 97–98, pp. 535-542, 2002.
Sullivan O., Gupta M. P., Mukhopadhyay S. and Kumar S., “On-Chip Power Generation Using Ultrathin Thermoelectric Generators,” Journal of Electronic Packaging, Vol. 137, pp. 0110051-0110057, 2014.
Trung N. H., Toan N. V. and Ono T., “Flexible Thermoelectric Power Generator with Y-Type Structure using Electrochemical Deposition Process,” Applied Energy, Vol. 210, pp. 467-476, 2018.
Wang J. Y., “Development of a SiGe Thermoelectric Energy Harvester Chip by TSMC CMOS Process and Dry Etching Post Process,” M.S. Thesis, National Cheng Kung University 2017.
Wojtas N., Schwyter E., Glatz W., Kühne S., Escher W. and Hierold C., “Power Enhancement of Micro Thermoelectric Generators by Microfluidic Heat Transfer Packaging,” Sensors and Actuators A: Physical, Vol. 188, pp. 389-395, 2012.
Yang S. M., Lee T. and Jeng C.A., “Development of a Thermoelectric Energy Harvester with Thermal Isolation Cavity by Standard CMOS Process,” Sensors and Actuators A: Physical, Vol. 153, pp. 244-250, 2009.
Yang S. M., Cong M., and Lee T., “Application of Quantum Well-like Thermocouple
to Thermoelectric Energy Harvester by BiCMOS Process,” Sensors and Actuators A:
Physical, Vol. 166, pp. 117-124, 2011.
Yu C. K., Chiang W. S., Liu N. W., Lin M. Z., Fang Y. H., Lin M. J., Lin B. and Huang M., “A Unique Failure Mechanism Induced by Chip to Board Interaction on Fan-Out Wafer Level Package,” IEEE Reliability Physics Symposium (IRPS), pp. 4A6.1-4A6.4, 2017.
Yu X., Wang Y., Liu Y., Li T., Zhou H., Gao X., Feng F., Roinila T. and Wang Y., “CMOS MEMS-based Thermoelectric Generator with an Efficient Heat Dissipation Path,” Journal of Micromechanics and Microengineering, Vol. 22, pp. 105011, 2012.
Ziouche K., Yuan Z., Lejeune P., Lasri T., Leclercq D. and Bougrioua Z., “Silicon-Based Monolithic Planar Micro Thermoelectric Generator Using Bonding Technology,” Journal of Microelectromechanical Systems, Vol. 26, pp. 45-47, 2017.
Zoller T., Nagel C., Ehrenpfordt R. and Zimmermann A., “Packaging of Small-Scale Thermoelectric Generators for Autonomous Sensor Nodes,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 7, pp. 1043-1049, 2017.