肥粒體不銹鋼具有成本低廉、良好加工性及延展性等優點，為了製備含銅肥粒體抗菌不銹鋼，以電化學方法共鍍銅鎳合金，經過1050 ℃/12 hr高溫熱處理後成功讓銅滲入基材表面，製備出表面合金化抗菌不銹鋼，並透過電子顯微鏡觀察，在鄰近試片表面橫截面處發現富銅相析出，且具有抗菌效果。銅、鎳離子還原電位差異非常大，是造成合金共鍍較為困難的主因。本實驗中，電鍍採用三極系統，以飽和甘汞電極做為參考電極，白金電極作為輔助電極，430不銹鋼作為工作電極，利用恆電位儀（Potentiostat）進行循環伏安量測，觀察在不同電位下肥粒體不銹鋼表面之氧化與還原現象，實驗結果發現以0.5 M硫酸銅混合2 M胺基磺酸鎳作為電解液，隨著負電位提高，析鍍產物由銅轉為銅鎳合金，並藉由X光繞射儀（X-ray diffractometer）結果發現在負電位增加的過程中，銅之（111）繞射峰具有分離情況，說明後續鎳的析鍍使晶格發生變化。在－1.0 VSCE控制電位下得到銅鎳合金，其銅鎳組成比例約為4:1。以定電位方式進行電鍍試驗後，利用掃描式電子顯微鏡（Scanning electron microscope）觀察試片之鍍層形貌，以能量散射光譜儀（Energy-dispersive X-ray spectroscopy）分析鍍層的化學組成，發現銅鎳合金傾向以無序生長的樹狀結構（Dendritic structure）析鍍於基材表面，且越靠近枝晶末端，銅含量越高。樣品經低氧分壓高溫熱處理後，銅擴散進入基材中，由抗菌測試得知，抗菌效果隨著試片縱深深度增加而降低，耐點蝕能力也大幅下降。

In order to prepare copper-containing fertilizer granular antibacterial stainless steel, copper-nickel alloy was co-plated by electrochemical method. After high-temperature heat treatment, copper was successfully infiltrated into the substrate. Through electron microscope observation, copper-rich phase precipitation was found in the cross-section of the piece surface, and has antibacterial effect. In this experiment, a three-electrode system was used for electroplating, with a saturated calomel electrode as a reference electrode, a platinum electrode as an auxiliary electrode, and 430 stainless steel as a working electrode, and potentiostat was used for cyclic voltammetry measurement and copper-nickel co-plating, After high-temperature heat treatment copper diffuses and antibacterial testing, it is found that the surface of the sample has a 99.9% antibacterial rate, while the corrosion resistance decreases due to the increase in copper content.

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