本研究的目的是在探討高溫銲料95Pb-5Sn及92.5Pb-5Sn-2.5Ag與銅銲接後，利用高溫熱儲存後評估顯微結構、界面層厚度及機械性質之影響。實驗結果將作為後續研究的理論基礎與比較。其中儲存溫度為200℃，儲存時間為1、25、100、225及400小時。
研究結果顯示，在95Pb-5Sn原材之析出物為β-Sn，且多由晶界析出，熱儲存後其晶粒大小有逐漸變大的趨勢，但析出物並無明顯成長；92.5Pb-5Sn-2.5Ag原材之析出物為β-Sn、Ag3Sn及ξ-Ag，熱儲存前後晶粒皆不明顯，但熱儲存後析出物有明顯地粗大化。95Pb-5Sn及92.5Pb-5Sn-2.5Ag之銲接試件具有相同的金屬間化合物組成，即為Cu3Sn，隨著熱儲存時間增加，金屬間化合物層越厚，且慢慢的產生剝離的現象。在100小時前，兩者的厚度相當，約在2~4μm；在100小時開始，92.5Pb-5Sn-2.5Ag厚度成長的比95Pb-5Sn的快。到400小時，95Pb-5Sn試件成長至約12μm，而92.5Pb-5Sn-2.5Ag試件已成長到約24μm。
在機械性質試驗中，未熱儲存前，92.5Pb-5Sn-2.5Ag接合強度較95Pb-5Sn接合強度高，其微硬度也比95Pb-5Sn高些，推斷是因為有Ag3Sn及ξ-Ag的析出使得銲料有強化效果。但從100小時後，92.5Pb-5Sn-2.5Ag強度開始比95Pb-5Sn強度低。各接點在經高溫熱儲存後強度皆有下降之趨勢，但微硬度改變不大。而破壞模式也從銲料模式轉變為混合模式，破斷主因為界面層Cu3Sn。
綜合本研究結果，高溫熱儲存下使金屬間化合物生長並開始產生剝離，使得局部弱化，接合強度下降，破壞也發生在金屬間化合物層。推斷金屬間化合物生成、接合強度及破斷模式皆會相互影響。

This research is aimed to investigate the microstructure, the interfacial IMC (Intermetallic Compound) layers and mechanical properties of 95Pb-5Sn/Cu joints and 92.5Pb-5Sn-2.5Ag/Cu joints after heat storage. The storage temperature is 200℃ while the storage times are 1, 25, 100, 225 and 400 hours respectively.
After heat storage, the grain size of 95Pb-5Sn increased gradually, but there’s no significant growth in the precipitation. In 92.5Pb-5Sn-2.5Ag, the grain size doesn’t change apparently after the heat storage, but the precipitations are significantly coarsened.
Only a layered Cu3Sn phase was formed at the 95Pb-5Sn/Cu and the 92.5Pb-5Sn-2.5Ag/Cu interfaces. Before 100 hours, the thickness of IMC layer in both specimens of 95Pb-5Sn and 92.5Pb-5Sn-2.5Ag were about the same. After 100 hours, the IMC layer in 92.5Pb-5Sn-2.5Ag grows faster than that in 95Pb-5Sn. Up to 400 hours, the Cu3Sn intermetallic compound layer is not only growing but also spalling.
In mechanical properties test, the joint strength and micro-hardness in 92.5Pb-5Sn-2.5Ag is higher than in 95Pb-5Sn before the heat storage because the precipitations provided strengthening effect. However, after 100 hours, joint strength in 92.5Pb-5Sn-2.5Ag becomes lower than in 95Pb-5Sn. The strength of all soldered joints decreases distinctly after heat storage at 200℃ for 400 hours, but the change of micro-hardness is not obvious. Also, the fracture modes are transformed from soldered modes to mix modes due to the intermetallic compounds layer.
The results show that, the IMC layer is growing and spalling, which means that the adhesion between Cu and Cu3Sn becomes weak. The growth of the intermetallic compounds, joints strength and fracture modes interact with each other.

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