本研究首先探討以電鍍製作之銲錫隆點(Solder Bump)，經過不同可靠度試驗後，其剪力強度變化與破壞機制。之後將銲錫隆點進行覆晶接合，配合晶片與基板上的電路設計以量測電性變化，進一步探討經過不同試驗之後，銲錫接點阻抗變化與材料反應行為之關係。
由剪力強度測試結果得知，經過高溫時效、恆溫恆濕及多次重流試驗後，其剪力強度均下降，且剪力破斷位置皆位於鉛錫合金中，由此可知，經可靠度試驗後，銲錫與無電鍍鎳磷層間之結合強度仍優於鉛錫合金之剪力強度。
觀察銲錫隆點界面反應，初始重流(Reflow)後，銲錫與無電鍍鎳磷鍍層之界面會形成鎳-錫及少量銅-錫之介金屬化合物，經時效處理後，銲錫與鎳-錫介金屬化合物間會生成金-鎳-錫之介金屬化合物。
覆晶接合試片經不同試驗後，銲錫接點阻抗均上升。銲錫接點阻抗會隨著介金屬化合物之成長而增加，而介金屬化合物會隨時效時間或重流次數增加而成長。經恆溫恆濕試驗後，水氣由環境滲入接合界面及聚亞醯胺(Polyimide)中，使金屬界面間產生電化學腐蝕及氧化，造成接點阻抗上升。經過溫度循環試驗後，因為材料彼此間之熱膨脹係數的差異產生應力，造成裂縫及孔洞之生成及延伸，因此銲錫接觸面積減少，進而導致接點阻抗大幅度上升。

This research was to investigate the shear strength and failure mechanism of solder bumps produced by electroplating after different kinds of reliability tests. We proceeded to design the flip chip test vehicle in order to measure the bump resistance. Furthermore, the correlation between the resistance change of flip chip bonded solder bumps and the reaction behavior of materials was investigated.
According to the results of shear test, the shear strength of solder bumps degraded while the fracture occurred in the solder after multiple reflow, temperature storage and temperature-humidity tests. Therefore, the bonding strength between solder and electroless Ni-P layer was stronger than Sn-Pb alloy.
The SEM cross-section morphology revealed that Ni-Sn and a small amount of Cu-Sn intermetallic compounds formed at the interface between solder and Ni-P layer after reflow. Au-Ni-Sn intermetallic compounds formed between solder and Ni-Sn intermetallic compounds after heat treatment.
The resistance of flip chip bonded specimens increased after different reliability tests. The increase in resistance of solder bumps was accompanied by the growth of intermetallic compounds. The growth of intermetallic compounds was enhanced by thermal aging time and multiple reflow times. After temperature-humidity test, water vapor from environment penetrated into the interface and the polyimide absorbed moisture. The circuit corrosion and oxidation of solder result in an increase in bump resistance. After temperature cycling test, the stress induced by the mismatch between the coefficients of thermal expansion of different materials gave rise to the formation of cracks and voids. Furthermore, the crack propagation and voids coalescence resulted in a drastical increase in resistance.

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