本研究目的在於探討添加1～10 wt% In元素對Sn-3Ag-2Sb無鉛銲料熔點及微結構的影響，並進行150 ˚C高溫熱儲存試驗以評估銲料等溫低週疲勞之可靠度表現。
將自製銲料Sn-3Ag-2Sb-xIn(x=1,5,10 wt%)製成直徑約1.15 mm之錫球，與Cu基板銲接成單點剪切試件，之後再進行150 ℃高溫儲存處理，熱儲存時間分別為225、625小時。實驗結果顯示添加In入銲料可以有效的降低熔點，由Sn-3Ag-2Sb的223.1 ℃下降至192.9℃(10 wt% In)，且固液相區間亦隨之擴大。微結構方面，Sn-3.5Ag以及Sn-3Ag-2Sb銲料組成皆為Ag3Sn與β-Sn所組成之網狀共晶組織。添加1 wt% In銲料中之In元素會取代Ag3Sn中的Sn元素而形成Ag3(Sn, In)；含量提高至5 wt%則會形成Ag2(In, Sn)與深色化合物InSb；In高達10 wt%時Ag2(In, Sn)成份中的In元素比例將會提高，且InSb化合物數量會增加。然而於5、10 wt% In銲料當中並無發現Ag3Sn化合物。其中InSb化合物呈現二種形貌－板狀及團塊狀析出物，另外一種化合物Ag2(In,Sn)，其形貌為不規則塊狀。
等溫低週疲勞測試中，在±0.020 mm位移量下，銲點剪切強度隨著In含量提高而上升，由Sn-3Ag-2Sb共晶銲料的42.3 N上升為46.7 N(1 wt%)、70.0 N(5 wt%)、80.4 N(10 wt%)，未經熱儲存之銲點疲勞壽命大致上隨In的添加而增加，10 wt% In有較佳的疲勞壽命，因銲接點之塑性應變量隨著In的添加而減少，塑性應變愈少則會有較佳的疲勞壽命，而最大荷重下降速率也隨著In的添加而增加。銲點經過熱儲存後，由於銲料軟化會導致破斷韌性提高，故1 wt% In銲點之疲勞壽命會較剛銲接條件下之試件來的高，但是隨著熱儲存時間延長，界面金屬層Cu6Sn5成長會逐漸增厚，故5、10 wt% In銲料會因銲點破壞模式由銲料內部演變成銲料與界面的混合模式，最後再轉變成界面破斷模式，此時疲勞壽命將會減少。

關鍵字：無鉛銲料、Ag2In、低週疲勞、Sn-Ag-Sb-In

The goal of this research is to evaluate the effect of In additions (0~10 wt%) on the melting point and microstructure of Sn-Ag-2Sb lead-free solder. The reliability of low cycle fatigue of the solder joint is estimated by the thermal storage test for 150˚C.
Sn-3Ag-2Sb-xIn in form of solder balls with 1.15 mm in diameter are fabricated. Solder balls were re-flowed with Cu substrate in the form of single lap shear specimen, and then annel in 150℃for 225 and 625 hours, respectively. Experimental result show the melting points of Sn-Ag-Sb-xIn solder are decreased with higher In additions. The melting points are 223.1℃(Sn-3Ag-2Sb) and 192.9℃(10 wt% In). The range between solidus and liquidus pasty will expand with the addition of indium. Microstructures of the Sn-3.5Ag and Sn-3Ag-2Sb solders are similar and can be characterized as consisting of β-Sn dendrite and interdenritic eutectic network. In atoms are almost solved in the β-Sn when adding 1 wt% In into the Sn-Ag-Sb solder, and In atoms may replace Sn of Ag3Sn compounds to be Ag3(Sn,In). The Ag2(In,Sn) and InSb compounds are observed as the content of In addition increased to 5 wt%. For Sn-3Ag-2Sb-10In, the percentage of indium in Ag2(In,Sn) compounds is increased, and the amount of InSb is increased. Ag3Sn compounds aren’t found in 5 wt%In and 10 wt%In solders. From the 3-D observations of Sn-Ag-Sb-In solder, the morphology of InSb can be concluded to two types : plate-like and piece-like, but the shapes of Ag2(In,Sn) compounds’ cannot be determined.
In the condition with constant displacement of 0.020mm, shear strength of the as-soldered joints is increased with higher In additions. The shear strengths are 42.3 N(Sn-3Ag-2Sb), 46.7 N(1 wt% In), 70.0 N(5 wt% In) and 80.4 N(10 wt% In). Fatigue life of the as-soldered joint approximately increases with greater In additions, and 10 wt% In solder has better fatigue life. The reason is the plastic strain of the solder joint decreases with higher In additions. The lesser plastic strain the better fatigue life and the rate of load-drop is increased with higher In additions. After 150˚C thermal storage, fatigue life will improve because of the softening of solder joints. So the fatigue life of 1 wt% In solder joints are higher than as-soldered. The thickness of the Intermetallic Compound(IMC) are also increased after thermal storage. The fracture modes of 5、10 wt% In solder joint transit from solder fracture mode to mixture mode then into IMC fracture mode with increasing indium additions and storage time. In the meanwhile, fatigue life would be decreased.

Key word：lead-free solder、Ag2In、low cycle fatigue、Sn-Ag-Sb-In

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