環氧樹脂(epoxy molding compound, EMC)普遍使用在電子封裝產品中，因此EMC的相關研究顯得相當重要。而封裝製程中的封膠製程後的翹曲量ㄧ直都是封裝工程師的困擾。由EMC-Cu與EMC-Si雙層板材料的翹曲實驗與模擬結果顯示：高模溫會導致較大的翹曲量，模壓對於翹曲量的影響則較不明顯。模擬的原理是利用EMC的P-V-T-C特性(即模壓、體積、模溫、熟化度之間的關係)。未加壓的後熟化實驗與模擬結果顯示：後熟化製程可減低翹曲量。模擬的原理是利用玻璃轉化溫度(Tg)因後熟化製程而改變的現象。
長時間、高溫的製程環境(後熟化製程)之下，塑膠封裝材料EMC會有黏彈性質的產生，所以在進行後熟化分析時，有必要將EMC材料考慮成黏彈性材料。但EMC材料在不同熟化度下的黏彈模型目前並沒有，因此，本論文最重要的目標即在建立包含熟化度的封裝材料黏彈模型。
在經由DMA的實驗之後，確定EMC材料的廣義麥斯威爾模型及WLF公式。而透過在常溫之下、對於不同熟化度材料的模數測量可得到熟化度與熟化度轉變因子之間的關係式。
WLF公式用來確定溫度 與溫度轉變因子 之間的關係。而上述熟化度與熟化度轉變因子的關係式用來確定熟化度 與熟化度轉變因子 之間的關係。這兩種關係式決定了與溫度及熟化度相關的轉變因子。因此，藉著這兩個關係式可以確定任何熟化度及溫度之下的鬆弛模數。

Epoxy molding compound (EMC) is a common material in electronic packages. Warpage after encapsulating in packaging process is always a problem to engineers. The experimental and simulation results of warpage of EMC-Cu and EMC-Si bi-laminates revealed that higher mold temperature caused larger warpage, and the packaging pressure effect upon warpage was less dominant. The simulation was based on P-V-T-C properties of EMC (, i.e. the relation between packing pressure, volume shrinkage, mold temperature and degree of cure).
The experimental and simulation results of bi-laminates during non-pressed post mold cure (PMC) revealed that PMC could reduce the warpage. The simulation was based on the phenomenon that Tg changes during PMC.
Under high-temperature for a long time such as PMC, EMC can behave like a viscoelastic material. Therefore viscoelasticity should be considered during the post mold cure process. Due to the lack of cure-dependent viscoelastic models, the objective of this thesis is therefore to construct a viscoelastic model with degree of cure as one of parameters.
By dynamic mechanical analyzer (DMA) testing, the generalized Maxwell's model and Williams-Ladel-Ferry (WLF) equation of Hitachi 9200 compound were identified. By the measuring the loss and storage moduli of differently cured polymer at room temperature, the equation relating the degree of cure to cure shift factor was also proposed.
WLF equation defines the relation between temperature and temperature shift factor(aT) while the forementioned shift equation defines the relation between degree of cure and cure shift factor(aC). These two relating equations define two kinds of shift factors. With these two relating equations, the relaxation modulus for any degree of cure and temperature can be defined.

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