在產品的生產過程中，進料品質保證(Incoming Quality Assurance，IQA)和出廠品質保證(Outgoing Quality Assurance ，OQA)是兩個相關但獨立的概念。它們在品質控制的不同階段擔負著不同的作用。 以半導體產業為例，通過進行IQA，半導體代工廠可以在材料進入產品生產流程之前檢查和測試材料的品質，確保材料滿足所需的品質和規格要求。生產資料通常包括文字生產資訊和電路設計檔，通過結合文字生產資訊和電路設計檔，半導體製造商可以檢驗IQA資料的正確性。本研究中，我們以積體電路設計中常見的元件-裂紋阻擋結構(Crackstop)為例，基於其特定特徵來建立圖像識別過程。通過開發一個檢驗系統並生成相關的檢驗報告，我們可以驗證資料的正確性，這種方法可確保生產過程的品質和可靠性，最終可提高產品的整體品質。

In the production process of a product, Incoming Quality Assurance (IQA) and Outgoing Quality Assurance (OQA) are two related yet independent concepts that fulfill distinct roles at different stages of the quality control process. Within the semiconductor industry, IQA enables semiconductor foundries to inspect and test the quality of materials before their incorporation into the production process. This verification ensures that the materials conform to the required quality and specification standards. Production data generally encompasses textual production details and circuit design files. By amalgamating textual production information with circuit design files, semiconductor manufacturers can corroborate the accuracy of IQA data. In this research, our focus is on a component in integrated circuit design known as the Crackstop structure. We establish an image recognition process grounded in its specific attributes. This involves the development of an inspection system and the generation of pertinent inspection reports. Through an analysis of these generated reports, we can validate the accuracy of the data.This approach guarantees the quality and dependability of the production process, ultimately leading to an enhancement in the overall product quality.

[1] J. Kim, S. Ahn, K. Choe, A. Saleh, and M. Alimam, “A novel framework for checking and automating DRC Rules”, 2022 IEEE 31st Microelectronics Design & Test Symposium (MDTS), Albany, NY, USA, May 23-26, 2022, pp. 1-3.
[2] Shoko Saito, Masaru Miyazaki, Mitsuo Sakurai, Takahisa Itoh, Kazumasa Doi,Norioko Sakurai, Tomoyuki Okada, “A study of applications scribe frame data verifications using design rule check”, Photomask and Next-Generation Lithography Mask Technology XX. SPIE, June 28, 2013, pp. 191-196.
[3] Calma Company, “GDSII Stream Format Manual”,1987 [online] Available: http://bitsavers.informatik.uni-stuttgart.de/pdf/calma/GDS_II_Stream_Format_Manual_6.0_Feb87.pdf.
[4] S. DiBartolomeo, “All about calma's gdsii stream format”, Artwork Conversion Software,2011, [online] Available: https://www.artwork.com/gdsii/gdsii/
[5] A. Singla, B. Lippmann, and H. Graeb, “Verification of Physical Chip Layouts Using GDSII Design Data”, 2019 IEEE 4th International Verification and Security Workshop (IVSW), Rhodes, Greece, July 01-03, 2019, pp. 55-60.
[6] M. A. Rabie, N. A. Polomoff, and S. Pozder, “Optimizing Die Corner and Optical Groove Corner Crackstop Support Structures for Mitigating Dicing and CPI Risks”, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, June 01 - July 04, 2021, pp. 1391-1398.
[7] N. A. Polomoff and M. A. Rabie, “The Influence of Layer thickness on Crackstops' Mechanical Strength and Robustness”, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, June 01 - July 04, 2021, pp. 62-71.
[8] Yen-Chi Lee and Jyi-Tsong Lin, “A new approach to wafer sawing: stealth laser dicing technology”, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, October 21-23, 2015, pp. 348-350.
[9] M. Štorga and M. Randić, “Recognition of symbols and topology in the image of a DC circuit diagram based on contours and skeletons”, 2021 44th International Convention on Information, Communication and Electronic Technology (MIPRO), Opatija, Croatia, September 27 - October 01, 2021, pp. 1026-1031.
[10] R. C. Hsu, D. -Y. Chan, W. -C. Lai and C. -T. Liu, “An improved automatic initial snaxel selection with corner tracing for object contour extraction in medical image”, 2011 Visual Communications and Image Processing (VCIP), Tainan, Taiwan, November 06-09 2011, pp. 1-4.
[11] L. Licev, J. Tomecek, and M. Babiuch, “Object recognition for industrial image”, Proceedings of the 2014 15th International Carpathian Control Conference (ICCC), Velke Karlovice, Czech Republic, May 28-30, 2014, pp. 320-325.
[12] M. Günay, M. Köseoğlu, and Ö. Yıldırım, “Classification of Hand-Drawn Basic Circuit Components Using Convolutional Neural Networks”, 2020 International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Ankara, Turkey, June 26-28, 2020, pp. 1-5.
[13] Rachala, Rohith Reddy, and Mahesh Raveendranatha Panicker. “Hand-Drawn Electrical Circuit Recognition Using Object Detection and Node Recognition”, SN Computer Science, vol. 3, no. 3, Apr. 2022, pp. 244.
[14] B. Edwards and V. Chandran, “Machine recognition of hand-drawn circuit diagrams”, 2000 IEEE International Conference on Acoustics, Speech, and Signal Processing, Proceedings (Cat. No.00CH37100), Istanbul, Turkey, June 05-09, 2000, pp. 3618-3621 vol.6.
[15] T. Y. Zhang and C.Y. Suen, “A Fast Parallel Algorithm for Thinning Digital Patterns”, Commun. ACM, 27(3), pp. 236-239.
[16] Tommy Huang, “卷積神經網路(Convolutional neural network, CNN) — 卷積運算、池化運算”, “ 卷積神經網路”, 2018, https://chih-sheng-huang821.medium.com/卷積神經網路-convolutional-neural-network-cnn-卷積運算-池化運算-856330c2b703.
[17] Yeh James, “[資料分析&機器學習] 第5.1講: 卷積神經網絡介紹(Convolutional Neural Network) ”, “資料分析&機器學習”,2017, https://medium.com/jameslearningnote/資料分析-機器學習-第5-1講-卷積神經網絡介紹-convolutional-neural-network-4f8249d65d4f.
[18] Robert Scheffler, “On the recognition of search trees generated by BFS and DFS”, Theoretical Computer Science, Volume 936, 2022, pp. 116-128.
[19] M. Rabie et al., “Innovative Design of Crackstop Wall for 14nm Technology Node and Beyond”,2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 - June 01, 2018, pp. 460-466.
[20] M. A. Rabie and N. Polomoff, “Optimization of Through Crackstop via using finite element modeling”, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, Germany, April 03-05, 2017, pp. 1-5.
[21] Nicholas A. Polomoff, Mohamed Rabie, Victoria L. Calero Diaz Del Castillo, Danielle Degraw, Michael Hecker, “Crack trapping in semiconductor device structures”,US10068859B1, 2017, https://patents.google.com/patent/US10068859B1.
[22] Tze-Liang Lee, Shih-chung Chen, Ming-Soah Liang, and Chen-Hua Yu, “Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities”, US6876062B2, 2002, https://patents.google.com/patent/US6876062B2/en.
[23] Ming-Hui Yang and Hsin Wei Chiu, “DOUBLE SEAL RING”, US9093308B2 , 2013, https://patents.google.com/patent/US9093308B2.
[24] H. Lucas and H. Gabrielli, “Gdspy’s Documentation,” Gdspy ,2023, https://gdspy.readthedocs.io/en/stable/.
[25] Siemens, Caliber Documentation, Siemens.com, 2023, https://eda.sw.siemens.com/en-US/ic/calibre-design/physical-verification/.
[26] KLayout Tool, KLayout Documentation, KLayout , 2023, https://www.klayout.de/doc/code/class_Technology.html.
[27] CairoSVG, Cairosvg Python Library,CairoSVG,2021, https://cairosvg.org/
[28] Scikit-image, scikit-image Python Library, Scikit-image, 2023 ,https://scikit-image.org/.
[29] Reportlab, ReportLab Docs, Reportlab, 2023, https://docs.reportlab.com/.
[30] OpenCV, OpenCV docs, OpenCV, 2023, https://docs.opencv.org/.