| 研究生: |
謝政翰 Hsieh, Jeng-Han |
|---|---|
| 論文名稱: |
不可維修產品在型I設限下之最適採樣計劃-以IC產品為例 |
| 指導教授: |
黃宇翔
Huang, Y. S. |
| 學位類別: |
碩士 Master |
| 系所名稱: |
管理學院 - 工業與資訊管理學系 Department of Industrial and Information Management |
| 論文出版年: | 2004 |
| 畢業學年度: | 92 |
| 語文別: | 中文 |
| 論文頁數: | 46 |
| 中文關鍵詞: | 混合式保固政策 、韋伯分配 、貝氏決策分析 |
| 相關次數: | 點閱:87 下載:1 |
| 分享至: |
| 查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
隨著市場競爭愈來愈激烈且IC 產品可靠度的日益增進,如何選用合適壽命試驗之抽樣計畫是很重要的一個決策問題。對廠商而言,一個較佳的壽命抽樣試驗計畫可以幫助其於IC 試驗時降低試驗進行的時間與耗費的成本,甚至節省產品允收後上架的時間;而對消費者而言通過壽命試驗的產品能夠增加其消費的慾望,進而刺激消費,因此如何選擇一個最適的產品壽命試驗抽樣計畫能使廠商所付出的試驗成本最小就是本研究的重心所在。本研究主要設定在IC 產品壽命服從雙參數韋伯分配且假設其尺度(scale)與形狀(shape)參數皆為隨機變數下,利用貝氏決策分析模式將其分為事前、事中與事後分析三個階段,然後進行期望抽樣試驗成本方程式的建置,其中考量拒收成本、允收成本、保固成本、試驗成本等相關成本因素對抽樣試驗所造成的影響,以幫助其得到最適參數的壽命抽樣試驗計畫,使得廠商進行此類抽樣試驗時成本達到最小,並且提供試驗準則讓決策者有所依循。
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