本實驗是將錫鋅系無鉛銲錫（Sn8.5Zn0.5Ag0.06Al0.1Ga）錫球與BGA基版（Cu/Ni/Au）接合後，以剪力和拉力測試了解界面行為，進ㄧ步利用表面黏著技術，再將BGA試片和印刷電路板（OSP/Cu）接合，經過不同可靠度測試後，探討顯微組織、機械性質、熱性質和電性變化，並且與商業用的Sn37Pb、Sn3Ag0.5Cu銲錫球做比較。

　　從剪力和拉力測試結果可以得知，Sn37Pb的剪力強度和拉力強度會因為Ni3Sn4增厚和出現在界面的(Au,Ni)Sn4而下降，並且由延性破斷轉變成脆性破斷。Sn3Ag0.5Cu和Sn8.5Zn0.5Ag0.06Al0.1Ga的剪力強度和拉力強度，隨著時效熱處理時間增加而下降緩慢，並且皆是破斷在銲錫裡面。

　　BGA試片和印刷電路板接合後的試片，經過高溫儲存測試，Sn8.5Zn0.5Ag0.06Al0.1Ga與OSP/Cu印刷電路板生成的層狀介金屬化合物AgZn3和Cu5Zn8，隨著時效熱處理時間增加，形成不規則狀，造成電阻增加。由摔落測試結果，可以看出Sn8.5Zn0.5Ag0.06Al0.1Ga試片所能承受比較多次的摔落，並且裂縫沿著AgZn3 及AuZn3附近延伸，Sn37Pb試片比Sn3Ag0.5Cu試片承受多次的摔落，而且裂縫發生在介金屬化合物中。由於熱膨脹係數的差異，經過溫度循環測試後，會有熱應力集中而發生裂縫，導致錫球接點接觸面積大幅減少造成電阻上升。

　This study investigated the bonding behavior between Sn-Zn series lead-free solder and substrate. The bonding strength of the solder ball was measured by shear and pull test. The BGA package was connected to the OSP/Cu print circuit board. After the reliability tests, the microstructure, mechanical property, thermal property and variation of electrical resistance were studied. The properties were compared for Sn8.5Zn0.5Ag0.006Al0.1Ga, Sn37Pb and Sn3Ag0.5Cu solder balls.

　The experimental results revealed that the shear and pull strengths of Sn37Pb decrease with the growth of Ni3Sn4 and (Au,Ni)Sn4 at the interface formed between Sn37Pb and the Cu/Ni/Au substrates. The ductile fracture became the brittle fracture because of Au embrittlement. The shear and pull strength of Sn3Ag0.5Cu and Sn8.5Zn0.5Ag0.006Al0.1Ga decreases with thermal aging time, and ductile fractures exist in both of cases.

　Two layers of AgZn3 and Cu5Zn8 intermetallic compounds formed at the interface between Sn8.5Zn0.5Ag0.006Al0.1Ga and OSP/Cu. After High Temperature Storage Test, the electrical resistance increased as a result of the formation of tow layers of AgZn3 and Cu5Zn8 intermetallic compounds. Drop test results showed that the joints Sn8.5Zn0.5Ag0.006Al0.1Ga solder ball performed better than Sn37Pb and Sn3Ag0.5Cu. The crack propagated along AgZn3 and AuZn3. The life of Sn37Pb is better than Sn3Ag0.5Cu, and the crack occurred in the intermetallic compound.

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