隨著LED發光效能之提升，使得LED日漸受光源市場青睞。然而，LED之發展過程也如同ICs之發展過程一樣，皆為日益嚴重的散熱問題所困擾。故本研究利用ANSYS有限元素分析軟體，輔之以田口設計方法，為LED模組作熱分析。
　　本研究使用四種不同參數及三種參數水準，分別探討其對接面溫度及LED最大位移量之影響;四種參數分別為MCPCB金屬層厚度、MCPCB金屬層材料、MCPCB介電層厚度及螺絲數目。對於接面溫度，MCPCB金屬層厚度影響最大，MCPCB介電層厚度影響最小。對於LED最大位移量，MCPCB金屬層材料影響最大，MCPCB介電層厚度影響最小。田口增益設計模型相對於參考模型，接面溫度降低3.6％，且螺絲數目減少之增益效果，但LED最大位移量會增加0.002mm。

　　Following the improvement in luminous of light emitting diodes’(LEDs) luminous, LEDs favored by the light source market day by day. However, as the evolution of ICs, the evolution of LED also encounters the serious heat dissipation problems. So this research utilize ANSYS finite element analysis software and Taguchi methods to do analyze thermal features of LED cooling module.

　　Four kinds of different parameters and three kinds of parameter levels are used to probe parameters’ influence on junction temperature and LEDs’ largest displacement, separately. The four parameters are thickness of MCPCB’s metal layer, materials of MCPCB’s metal layer, thickness of MCPCB’s dielectric layer, and the number of screws respectively. For junction temperature, the influence of metal layer’s thickness is the greatest, the influence of dielectric layer’s thickness is the smallest. For LEDs’ greatest displacement, the influence of metal layer’s material is the greatest, the influence of dielectric layer’s thickness is the smallest. In Taguchi improve module, the junction temperature can be reduced by 3.6%, the number of the screws can also be reduced, but LEDs’ greatest displacement will increase 0.002mm.

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