本研究主要藉由SEM-EDS與SEM-EBSD分析觀察銀鈀合金(97%Ag-3%Pd)/銀鈀金合金 (89%Ag-3%Pd-8%Au)打線在可靠度測試過後之界面反應及微觀組織。研究結果顯示，當進行高溫儲存試驗(HTST)、高加速溫濕試驗(HAST)後，銀鈀合金線會形成Ag3Al2、Ag2Al、Ag3Al等相，而銀鈀金合金線形成(Ag,Au)3Al2、(Ag,Au)2Al、(Ag,Au)3Al、(Ag,Au)4Al等相，且銀鈀金合金打線在介面處的介金屬化合物(Intermetallic Compound, IMC)生長速率、鋁墊隨時間消耗程度會快過合金型銀鈀打線。在HTST持溫500小時後，可以發現在銀鈀金合金型(Ag-3Pd-8Au)打線下的鋁墊已經反應耗盡，並且在介金屬化合物中出現裂縫(Crack)，而銀鈀合金型(Ag-3Pd)打線則在持溫1000小時，才有明顯的裂縫生成，但兩者裂縫生長速度均為緩慢。另外，較慢的銀-鋁間介金屬化合物生長速率及特定的介金屬相生成都有助於接點性質提升，而較複雜的介金屬化合物，將使可靠性質較為不佳，故銀鈀合金型(Ag-3Pd)打線的開發對於改善打線接合處的可靠度性質有正面幫助，未來或許可以成為合金型打線的主流材料之一。

In this research, we focused on the Ag-alloyed wire bonding reliability in interface. Owing to copper wires induced a higher stress to the bond pad and high oxidation voltage, these disadvantage implies the issue of reliability with copper wires. Thus, seeking a newly alternative materials is needed. Being similar with gold, silver has emerged as the first choice. When it comes to silver wires, the low tensile stress of pure silver, sulfuration and oxidation would lead to a decreasing reliability, so pure silver were not ideal for wire bonding. Alloying silver with gold and palladium can not only increase the tensile stress but also prevent the sulfuration and oxidation. As a result, we compared the interfacial reaction and microstructure in Ag-3Pd/Ag-3Pd-8Au bonding wires after HAST and HTST reliability tests by SEM-EDS and SEM-EBSD. Ag-3Pd-8Au has higher consumption of aluminum pad and growth rate of IMCs than Ag-3Pd under HAST and HTST. We suggested this phenomenon is probably owing to the gold addition. Ferurthmore, the Ag-3Pd-8Au wire came with multi-layer IMCs may cause the decreasing in reliability. Finally, the lower growth rate of IMCs and certain IMCs growth would provide a stable property of wire bonding. The Ag-3Pd bonding wires maybe become a main choice of material in wire bonding.

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