中文摘要
　　隨著半導體元件朝向輕薄短小的趨勢，翹曲（warpage）與殘留應力（residual stresses）問題也日益受到重視。以往研究中，造成IC 構裝元件翹曲的主要原因均指向材料熱膨脹係數不同所造成的不均勻翹曲，卻因此忽略了環氧樹脂（EMC）本身固化收縮的材料特性，因而造成了利用電腦模擬分析時，容易低估成品翹曲量與殘留應力大小。本文主要即考量環氧樹脂固化收縮材料特性以及相關製程參數，一廣泛完整的研究分析。
　　環氧樹脂屬於熱固性塑膠材料，加熱時膠體會因為分子結構發生鍊結而產生固化反應（cure reaction）造成體積收縮。以往分析中，環氧樹脂因固化反應所造成的不均勻體積收縮而導致的翹曲變化通常被忽略不計。然而，當產品愈來愈輕薄，結構勁度不足的情況下，忽略此一效應將會導致翹曲量與殘留應力被低估，因此考慮此一因子進行分析有其必要性，而用來描述其行為的關係式即為P-V-T-C 關係式，代表環氧樹脂行為與壓力（pressure）、體積（volume）、溫度（temperature）、熟化率（degree of cure）相關。除此之外，製程參數也會對翹曲量與殘留應力大小造成影響，例如模溫、保壓壓力、固化時間（cure time）…等，本論文也將探討不同製程參數對翹曲與殘留應力之影響。
　　從本文研究中，可以得到加入P-V-T-C 關係式後，翹曲量的分析預測會比僅考量熱膨脹係數來得準確，同時，從實驗中也可以得到當固化壓力愈大時，其翹曲量亦隨之變大，此外，當溫度愈高時，其翹曲量亦隨之降低。

Abstract
　　Warpage and residual stresses problems play an important role in IC encapsulation processes. Previous research works have focused on stresses or warpage analyses with temperature changes between
constituent materials and neglect cure shrinkage effects. However, more and more studies indicate that estimation of residual stresses or warpage according to CTE was not accurate enough to predict IC packaging behavior. The EMC properties were obtained by various techniques: degree of cure by differential scanning calorimetery(DSC),
modulus by P-V-T-C testing machine. These experimental data were used to formulate cure-dependent elastic modulus and P-V-T-C
equation.
　　The purpose of this study is to find out the method of warpage estimation due to P-V-T-C equation of EMC. In this study, mold filling analyses were conducted to predict cure content within models.
Predicted warpage values were compared with experimental and numerical results.
　　Throughout fully investigation, the result shows that cure shrinkage of epoxy is a significant parameter for IC packaging. The P-V-T-C equation was successfully examined to verify that warpage is governed by thermal shrinkage and cure shrinkage. The cure dependent elastic modulus was also found to provide accurate results.

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