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研究生：	張協智 Chang, XIE-ZHI
論文名稱：	利用田口方法進行疊合封裝體可靠度之最佳化設計 Optimal Design of PoP Package Reliability by Using Taguchi Method
指導教授：	陳榮盛 Chen, Rong-Seng
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系 Department of Engineering Science
論文出版年：	2012
畢業學年度：	100
語文別：	中文
論文頁數：	110
中文關鍵詞：	Darveaux理論、單一因子設計法、田口品質設計法
外文關鍵詞：	Darveaux theory, the one factor at a time design, Taguchi quality method
相關次數：	點閱：76 下載：7
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為了滿足消費者對電子產品之小尺寸與多功能等需求，並考量製造成本與良率，疊合封裝(Package on Package,PoP)乃是成長最迅速的3D堆疊封裝技術之一，即利用多個測試好的封裝體在厚度方向透過迴焊(reflow)方式堆疊起來，以達到邏輯運算與記憶體存取之系統整合。
本文採用ANSYS12.0進行分析，並根據JEDEC規範將疊合封裝體施予-40°C~125°C的溫度循環負載。其中錫球選用亞蘭德模型，及使用Darveaux理論來預測疊合封裝體之疲勞壽命，再以全域/局部分析模組與全域直接精細模型模組分別進行模擬與比較，確認全域/局部分析模組之可行性，並達到節省運算所需資源與時間。其次，利用單一因子分析法來觀察各控制因子對封裝體疲勞壽命之影響，發現雙層基板熱膨脹係數與封膠熱膨脹係數是影響較大的因子。最後，以田口品質設計法求得最佳參數組合，並與原始製程參數設計作比較，則構裝體之疲勞壽命提升59%，即由2157循環變為3421循環，故對PoP封裝體之可靠度有明顯改善。

In order to meet consumer’s preference for small size and versatility of electronic products as well as the considerations for manufacturing cost and yield, Package on Package(PoP) has become one of the most rapid growing 3D stacking technologies of package, in which the PoP is constructed by stacking individually assembled and tested packages in the thickness direction through the reflow process to achieve the integration of logic operations and memory access of the system.
This paper adopts ANSYS12.0 software with the global/local approach for analysis. Based on the JEDEC code, the PoP is subjected by a thermal cycle of -40℃~125℃. The material property of solder is assumed to be Anand’s model, and the Darveaux theory is applied to predict the fatigue life of the PoP. Then the fine-mesh model method and the global/local model method are applied separately for simulation and comparison. Accordingly, the feasibility of the global/local model method is confirmed so as to achieve the goal for saving resources and times in computing.
Afterwards, the one factor at a time design method is applied to observe the effect of each control factor on the fatigue life of the package and it is found that the CTE of the double-layer substrate and moulding compound has more significant impact on the package.
Finally, the optimal combination of parameters is obtained by the Taguchi quality design and certain results are compared with those obtained by the original design. As a result, it shows that the fatigue life of the package has 59 % increases from 2157 circles to 3421 circles. Namely, the reliability of the PoP has been significantly improved.

中文摘要	Ⅰ
Abstract	Ⅱ
誌謝	Ⅳ
目錄	Ⅴ
表目錄	Ⅹ
圖目錄	XIV
第一章 緒論	1
1-1 前言	1
1-2 研究動機與目的	2
1-3 文獻回顧	2
1-4 研究方法	5
1-5 章節提要	6
第二章 理論基礎	7
2-1 研究主題	7
2-2 疊合封裝體(Package on Package, PoP)簡介	7
2-3亞蘭德黏塑性本構模型	9
2-4 Darveaux模型	11
2-5全域/局部模組分析法	13
2-6 田口品質設計法	15
2-6-1 直交表（Orthogonal Array）	16
2-6-2 信號雜訊比(Signal to Noise Ratio)	16
2-6-3 反應表和反應圖	17
2-6-4 變異分析(ANOVA)	17
2-6-5 信賴區間	20
第三章 PoP疊合封裝有限元素分析方法與評估	26
3-1 疊合封裝體	26
3-1-1 疊合封裝體模型之建立	26
3-1-2 PoP封裝體之基本假設	27
3-1-3 模型之邊界條件與溫度循環負載	28
3-2  PoP封裝體全域模組/局部模組之探討	29
3-2-1全域模型位移收斂分析	29
3-2-2 全域模型之關鍵錫球判定	30
3-2-3 PoP全域模型分析結果之探討	31
3-3 PoP封裝體局部模型之建立與分析	31
3-3-1 PoP封裝體局部模型之幾何收斂分析	32
3-3-2 PoP封裝體局部模型之網格收斂分析	32
3-3-3全域/局部模組之多循環負載穩定分析	33
3-4 PoP封裝體直接精細模組之探討	33
3-4-1 PoP直接精細網格收斂分析	33
3-4-2 直接精細網格模組之多循環負載穩定分析	34
3-5 全域精細與全域/局部分析法之誤差與效率評比	34
3-6 PoP封裝體原始設計疲勞壽命	34
第四章 單一因子分析	65
4-1 一次一因子設計	65
4-2 疊合封裝體局部模型含下層關鍵錫球之幾何收斂分析	66
4-2-1 疊合封裝體局部模型含下層關鍵錫球之網格收斂分析	66
4-2-2 疊合封裝模型之對下層關鍵錫球多循環負載穩定分析	67
4-2-3 全域精細與全域/局部分析法於下層關鍵錫球之誤差	67
4-3 一次一因子之分析結果	68
4-4 結果與討論	72
第五章 田口品質工程分析	89
5-1 田口實驗設計法	89
5-1-1 品質特性選定	89
5-1-2 控制因子	89
5-1-3 田口直交表選定	90
5-2 確認關鍵錫球處	90
5-3 實驗模擬結果	91
5-3-1 因子效應	91
5-4 變異分析	92
5-5 最佳化預測與模型確認實驗	93
第六章 結論與未來研究方向	103
6-1 結論	103
6-2未來研究方向	107
參考文獻	109

                                    

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校內：2015-07-19公開
校外：2016-07-19公開

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