電子產品的微小化是時代的潮流。而隨著微小化的發展，銲錫接點的尺寸也因此減小，單位面積所通過之電流通量也越來越大。為理解銲錫材料在高荷電行為及可靠度表現，本研究針對Sn-Pb合金以及Sn-Zn、Sn-Ag和Sn-Cu等無鉛銲料進行探討。
　　實驗結果顯示當以固定速率提高施加電流達一臨界值 (熔斷臨界電流)，或施加一固定電流達臨界通電時間 (通電壽命)，試片均會因熔斷造成短路。上述之熔斷臨界電流以及通電壽命之大小順序皆為Sn-9Zn > Sn-3.5Ag > Sn-0.7Cu >> Sn-37Pb，與銲錫塊材之電阻係數高低呈反比關係。即電阻係數較小之銲錫合金具較佳之高荷電性質。
　　另外，本研究亦進行於固定負載電流 (熔斷臨界電流之70%) 之循環通電斷電實驗，調查各試料循環壽命 (臨界熔斷次數) 及可靠度。結果顯示循環壽命長短之趨勢則為：Sn-3.5Ag > Sn-0.7Cu >> Sn-9Zn > Sn-37Pb。此現象與銲錫之熔點及微觀組織特徵有關。四種銲錫合金中，Sn-37Pb韋伯模數為0.83，破壞率型態為初期破壞型。Sn-3.5Ag韋伯模數為1.15，破壞形式較偏向於偶發破壞型；Sn-9Zn及Sn-0.7Cu的韋伯模數則為1.25及1.45，破壞形式為磨耗破壞型。
　　總而言之，Sn-3.5Ag、Sn-0.7Cu及Sn-9Zn等合金之高荷電性能均較Sn-37Pb為佳，皆可考慮為高荷電應用條件下之無鉛化取代銲料，其中又以Sn-0.7Cu之可靠度最為優良。

　　The miniaturization of electronic product is a trend of nowadays. Consequently, the size of solder joint will reduce and thus the current density will become higher. This study aimed to investigate the properties and reliability of binary eutectic tin-based alloys under high electrical current stressing, including Sn-Pb, Sn-Zn, Sn-Ag, and Sn-Cu.
　　Results show that the solder strips were fused and thus led to a short circuit when suffering some situations, (1) the stressed current is raised with a constant increasing rate and reaches a critical value (i.e. critical current to fusion), (2) the strips are stressed with a constant current for a critical time (i.e. critical time to fusion) and (3) the strips are stressed with a on-off current for critical number of cycles (i.e. critical cycles to fusion). Both the critical current to fusion and critical time to fusion decrease in turn from Sn-Zn, Sn-Ag and Sn-Cu to Sn-Pb. Notably, Sn-Pb show much lower critical current and shorter critical time to the former three specimens. This is closely related to the electrical resistance of the solders.
　　As for the On-Off current conditions, the critical cycles to fusion of the Sn-Ag specimen is higher than that of the Sn-Cu specimen, which is in turn much higher than that of the Sn-Zn specimen and also the Sn-Pb specimen, which has the lowest number of cycles to fusion. Also, the calculated Weibull modulus is 1.45 for Sn-Cu, 1.25 for Sn-Zn (both of these two are wear-out failure mode), 1.15 for Sn-Ag (random failure mode) and 0.83 for Sn-Pb (initial failure mode). Besides electrical resistance, the melting point and microstructural feature also influence the performance of solders under on-off current stressing.
　　In short, the promising lead-free solders investigated in this study, Sn-Cu Sn-Ag and Sn-Zn, exhibit better performance under high electrical current stressing than the Sn-Pb solder. Among these, Sn-Cu possesses the highest reliability and can be considered as the potential replacement for Sn-Pb.

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