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研究生： 羅清信
Lo, Ching-Hsin
論文名稱： 超薄型細間距球柵陣列之翹曲和可靠度分析
Analysis of Warpage and Reliability of Very Thin Profile Fine Pitch Ball Grid Array
指導教授： 黃聖杰
Hwang, Sheng-Jye
學位類別： 碩士
Master
系所名稱： 工學院 - 機械工程學系
Department of Mechanical Engineering
論文出版年： 2023
畢業學年度： 111
語文別： 中文
論文頁數： 160
中文關鍵詞： 先進 IC 封裝 、殘留應力 、RDL 、P-V-T-C 、黏彈 、可靠度
外文關鍵詞： Advanced IC packaging, Residual stress, RDL, P-V-T-C, Viscoelasticity, Reliability
相關次數： 點閱：52  下載：0 
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    • 摘要 I EXTENDED ABSTRACT III 致謝 LIV 目錄 LV 圖目錄 LIX 表目錄 LXV 符號說明 LXVII 第一章 緒論 1 1-1 前言 1 1-2 IC 封裝介紹 3 1-2-1 封裝材料特性簡介 3 1-2-2 IC封裝製程 4 1-3 翹曲、變形現象 9 1-4 殘留應力(residual stress) 11 1-5 文獻回顧 12 1-5-1 翹曲變形與殘留應力 12 1-5-2 可靠度分析 15 1-6 研究動機與目的 22 1-7 論文架構 24 第二章 理論基礎與實驗量測 26 2-1 模流分析理論 26 2-2 翹曲應變分析理論[19] 31 2-3 體積收縮理論 35 2-4 黏彈理論[19, 31] 36 2-5 材料量測實驗 40 2-5-1 流變儀實驗 41 2-5-2 DSC(differential scanning calorimetry) 實驗 42 2-5-3 P-V-T-C實驗 43 2-5-4 DMA(dynamic mechanical analyzer)實驗[18] 44 2-6 高分子材料模型 48 2-6-1 黏度模型 48 2-6-2 反應動力模型[7] 51 2-6-3 P-V-T-C模型[30, 31] 54 2-6-4 黏彈模型 58 2-7 複合材料等效理論 64 2-7-1 等效材料混合定律(mixture rule of equivalent materials) 64 2-7-2 等效參考溫度 65 2-8 可靠度分析理論[35, 84] 67 2-8-1 疲勞破壞 67 2-8-2 塑性應變疲勞模型 68 第三章 模流與後熟化分析 71 3-1 網格建模與模流軟體 72 3-2 實體幾何結構 72 3-3 網格模型 75 3-3-1 建模流程 76 3-4 材料性質設定 81 3-5 基板疊層翹曲分析 85 3-6 模流與翹曲分析 88 3-6-1 邊界條件設定 90 3-6-2 製程參數設定 91 3-6-3 模流分析結果 94 3-6-4 翹曲分析結果 102 3-7 後熟化分析 104 3-7-1 環境溫度和邊界條件設定 104 3-7-2 翹曲分析結果 106 3-7-3 後熟化製程實驗翹曲結果 109 第四章 熱循環與可靠度分析 112 4-1 實體幾何與網格模型 113 4-1-1 映射材料性質建模(trace import modeling) 114 4-1-2 保形建模(conformal modeling) 115 4-1-3 建模型式之收斂性分析比較 116 4-2 熱循環與翹曲分析 123 4-2-1 陰影疊紋(Shadow Moirė) 125 4-2-2 JEDEC Standard 128 4-2-3 熱循環分析邊界條件設定 128 4-2-4 熱循環條件和設定 129 4-2-5 熱循環分析結果 131 4-3 可靠度分析 137 4-3-1 Ramberg-Osgood 模型 137 4-3-2 可靠度計算 138 第五章 結論與未來展望 141 5-1 結論 141 5-2 未來展望 144 參考文獻 145 索引 154

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