由於目前製程的技術一直朝向元件縮小化。換言之，同一面積下可以擺放更多元件。另一方面，元件又朝向高頻發展。要在晶圓量測的過程中，從這些又小又快的元件中找出瑕疵品，以確保產品的良率，進而節省支出成本。這就是晶圓測試探針卡公司，為什麼肯研發或代理高速高頻多晶片探針卡的原因。
　　透過本文，可以大略了解到探針卡以及探針。接著在研製的過程中，首先使用模擬軟體HFSS(高頻結構模擬)來決定出一些結構上的規格。之後透過材料特性以及機械特性，認識製作探針的初步程序，並利用模擬參數以及製程技術的互相配合與比較，藉此探索探針研製的可行性。

　　The current trend is towards device miniaturization. In other words, there will be placed more devices in the same area. Besides, the current trend is towards high frequency. In the process of wafer-level testing, we can find the tarnish from these small and quick devices to ensure the yield of the products and then save cost. This is why the probe card manufacturers are willing to study or act for the high-speed, high-frequency, and high-parallel probe card.
　　In this paper, we realize the probe card and probe approximately. In the process of study and fabrication, we decide the scale of the structure for HFSS in the first place. Second, we realize the initial procedure of the probe fabrication by the material characteristics and mechanical properties, and study the feasibility of probe fabrication by the cooperation and comparison of the simulation parameters and fabrication techniques.

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