本研究係探討銅/錫鋅系無鉛銲錫/銅組合在電流密度650A/cm2
電遷移試驗下，其陰陽兩極界面及銲錫基地的反應情形。另也同時進行時效熱處理，以了解在通電流過程中焦爾效應（Joule effect）對電遷移反應之影響。錫鋅系無鉛銲錫包含了Sn-8.6Zn、Sn-4.5Zn、Sn-2.5Zn及Sn。
　　經由掃描式電子顯微鏡（SEM）及電子微探儀（EPMA）分析經
通電後的試片，在兩極界面處或在基地中所發現的介金屬化合物會因為鋅含量降低而生成不同介金屬化合物。在鋅含量較高的試片（Sn-8.6Zn）中，隨著通電時間的增加，在兩極界面處生成連續的Cu5Zn8，而陰極端的厚度則較陽極端厚且銅鍍層也消耗得較劇烈。當鋅含量降低時（Sn-4.5Zn），隨著通電時間的增加，並無連續層的出現，但在基地中所生成的介金屬化合物離陰極界面較遠。當錫鋅比例為Sn-2.5Zn時，不僅在基地中有銅鋅介金屬化合物，在界面處亦有銅錫介金屬化物的出現。當銲錫為純錫時，經216小時通電後，在基地及界面處即有銅錫化合物的產生。不同銲錫成份經時效熱處理後，僅在Sn-8.6Zn及Sn-4.5Zn界面處發現有銅鋅介金屬化合物，並無銅錫介金屬化合物的出現。
　　在時效熱處理時，銅原子是經由晶界擴散與鋅反應形成介金屬
化合物；在通電效應下，由於電場的作用使得原子可經由晶粒擴散。

　　The electro-migration behavior of Cu/Sn-Zn series solder/Cu under a current density of 650A/cm2 was investigated in this work. Meanwhile, the role of thermo-migration was investigated by the thermo-aging experiment. The Sn-Zn series solders investigated include Sn-8.6Zn, Sn-4.5Zn, Sn-2.5Zn and Sn.
　　The SEM and EPMA results obtained showed that, different compounds were formed on decreasing the zinc content of the solder. For high Zn content solder, Sn-8.6Zn, a continuous layer of Cu5Zn8 was observed and the copper layer of cathode side were consumed greatly after a current stressing for 456 hours. In the case of Sn-4.5Zn, Cu5Zn8 was further formed in the matrix near the cathode side. However, for the Sn-2.5Zn solder, Cu5Zn8 was found in the matrix and Cu6Sn5 was found at the interface. For pure Sn, Cu6Sn5 and Cu3Sn were found in the matrix and at the interface after a current stressing of 216 hours, respectively. Under the thermo-aging test, Cu5Zn8 was just found at the interface of Sn-8.6Zn and Sn-4.5Zn.
　　Under the thermo-aging test, the copper diffused along the grain boundary to react with zinc. It can be observed that under the action of the electric field, the atoms diffused to react with zinc through the grain.

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