本文利用有限元素分析軟體ANSYS，來模擬三維覆晶塑封球柵陣列構裝體上無散熱板、平板型、平板型含軟墊型及鋁擠型的散熱板型式，於受自然對流與強制對流的環境中的熱傳行為分析與在熱循環測試下的熱應變分析，構裝體主要含有八個組件，分別為散熱板、凸塊、錫球、晶片、填膠、熱通孔、基板及印刷電路板。
在熱傳分析方面，假設晶片產生穩定發熱量為0.03W/mm3，封裝體與周圍大氣接觸初始溫度為50℃，當溫度變化達到穩定平衝後，量測晶片表面溫度。得到晶片表面溫度後再計算出熱阻值 。經由熱阻值便可以判斷及預測電子元件散逸熱量的情形。為了預測及分析電子元件的散熱量情形就需提供良好可靠的熱阻值資料以供設計之用。
在熱應力分析方面，凸塊、錫球材料為黏塑性以Anand模型模擬；填膠材料為黏彈性以Maxwell模型模擬；散熱板、晶片、熱通孔、基板及印刷電路板以彈性模型模擬，模擬構裝體在125℃ ~ -40℃熱循環負載的凸塊、錫球應變行為。

This research is using 3-dimensional model simulation to analyze the thermal-mechanical and heat transfer behavior of FC-PBGA package by applying finite element analysis of the commercial software ANSYS 9.0. these type included with and without heat sink, lid and heat sink on FC-PBGA. FC-PBGA package model consists of eight parts, they are heat spreader, bump solder, solder ball, chip, molding compound, thermal via, substrate and PCB board.
For heat transfer analysis, the heat dissipation per volume unit of chip is 0.03℃/mm3 ,the beginning temperature of FC-PBGA package and surrounding area is 50℃. When it reaches steady state, analysis of heat transfer, at the same time we must codsider analysis the maximum temperature on the chip, calculate the thermal resistance.
For the analysis on thermal-mechanical behavior, the viscoplastic behavior of solder ball is modeled using Anand model, the viscoelastic behavior of molding compound is simulated by Maxwell model, the other are using linear elastic model to simulate, As a result, analysis of transformation behavior of FC-PBGA can be carried out under a 125℃ ~ -40℃ heat cycling environment.at the same time we must codsider analysis the maximum equivalent strain in order to find the weakness part of assembly.

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