由於背光模組產業結構性的改變，背光模組開始使用發光二極體（Light Emitting Diode, LED）做為背光源，模組光學材料的應用上以平板型式的導光板（Light Guide Plate, LGP）為主，在白光LED發光效率提升的趨勢下，為了提升背光模組的高亮度、低成本、低耗電與輕薄化等，需將背光源的發光效能發揮至最佳化；因LED每瓦流明大幅提升，可減少LED的顆數進而降低背光模組的成本；但是，背光模組光學效益的提升不能只靠LED光源，需搭配新式光學材料與其他技術輔助。
有鑑於此，本文提出高亮度白光LED搭配新式微結構導光板應用於單短邊入光的背光模組，其LED使用顆數比傳統長邊入光模組減少62.5%，省電效率提升30%，均勻度增加3%。採用新型微結構導光板材料並搭配改善色偏問題的油墨及網點設計，利用該材料耐刮特性，藉以增加製程穩定性，達到畫面均勻性背光源目標，比傳統LED長邊入光模組設計具有更優異的光學表現與品味。另外，在模組散熱管理上，考量成本與效能，有效減少熱源集中並同時提升產品的可靠度，進而達成增益研究的開發目的。

Light-Emitting-Diode (LED) has gradually been applied to the backlight module as the main light source owning to LED’s power efficiency and the structural change of the backlight module, in which the main optical material of the backlight module is the Light Guide Plate (LGP). Based on the tendency towards the LED emitted efficiency improvement, the emitted efficiency of the backlight lighting source should be optimized for achieving the higher brightness, lower cost, lower power consumption and thinner backlight module. Due to the great improvement of LED brightness, it will economically decrease the number of LED quantity used for the backlight module to save the cost. However, to enhance the backlight module’s optical efficiency can not only rely on LED lighting source but also depends on some new better optical materials and techniques in design as well.
Hence, in comparison with the traditional “long-side” lighting of the backlight module, this thesis has proposed a new optimized design to include the “short-side” lighting scheme and the micro-structure light guide plate with the ink and pattern design for the backlight module. Results have verified that the new design with the high brightness of LED and the new micro-structure LGP will decrease the usage of LED by around 62.5% in quantity with the increase of the power saving efficiency of 30% and the uniformity of 3% accordingly. After adopting the new micro-structure LGP with the ink and pattern design for improving the color shift, it has increased the process stability successfully and achieved the target of the backlight uniformity. Furthermore, in terms of the thermal module management to reduce the heat and improve the reliability simultaneously, the result also shows to have achieved this target goal in this research development of the LED backlight module enhancement.

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