本研究主要利用影像處理技術來實現PCB微盲孔品質之圓孔幾何量測，並以微盲孔的內徑與外徑作為量測對象。研究中在硬體方面可結合個人電腦、AOI機台、打光裝置與CCD攝影機取像設備；在軟體方面結合了影像前處理、孔位編號與檢測結果顯示等方法進行系統實現。實驗中首先是將影像像素數目與實際長度之間的關係換算出每一個pixel所對應之實際尺寸大小(單位為：µm/pixel)，接著可實際擷取一張8.5mmX8.5mm大小之檢測板，求取其孔位誤差靶標圖，並利用自動對焦函數取得外徑之最清晰影像，再根據內徑遮罩大小做第二次的內徑對焦，計算兩者位置距離可得到盲孔深度。接著利用外徑之影像來計算盲孔品質之幾何特徵，根據此資訊即可判斷盲孔品質之好壞。在單一孔徑上的整體檢測速度約在10秒內，檢測精度約在5µm。
最終可利用C#程式建構出人機介面，可將PCB板上的圓孔孔徑等資訊清楚地顯示出來，包括孔徑之圓心座標、面積、半徑、真圓度與兩孔徑的圓心距離大小等幾何尺寸，以顯示鑽孔之品質。

In this research, an Automatic Optical Inspection (AOI) system based on image processing technology applied in PCB inspection of micro blind vias quality is designed and developed. It combines the hardware equipment including personal computers, AOI machines, lighting devices and CCD cameras with software technology including image pre-processing, vias labeling and detection results to achieve system implementation. At first, the relationship between the number of image pixels and the actual physical size for blind vias is used to calculate the actual size(unit: μm/pixel) for each pixel. The experimental test board is the actual size of 8.5mmX8.5mm , we can get the vias inaccuracy target diagram. And then, auto-focus function is used to obtain the outside diameter of the clearest image, and execute second focus according to the size of inside diameter mask. The depth of blind vias is calculated by those two position difference. And the outside diameter is used to calculate geometric characteristics for blind vias quality. According to these information, we can judge the quality of blind vias. The overall detection rate is about 10 seconds and the measurement accuracy is within 5μm.
Finally, through C # program we can build human-machine interface of inspection and make the information of PCB vias diameter including the aperture center coordinates, area, radius, roundness and calculation size of the aperture center of a circle with the two distance appear obviously in order to present the quality of drilling.

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