超快雷射的將功率集中在非常短脈衝時間內有極大的尖端功率性質在非線性光學應用扮演非常重要的角色，如多光子激發螢光顯微術可重建樣品三維的螢光影像(multiphoton excitation fluorescence microscopy，MPEFM)、微機電系統(microfluidic device and microelectromechanical system，MEMS)應用中的集成電路(integrated circuit，IC)中結構精密通孔製作，或是光活性(photoactive)材料之光聚合反應，以超快雷射作為激發光源來建構實現三維微製造技術。
本論文主要藉由材料對雷射的非線性吸收形成光熱效應，以此效應開發模擬程式，模擬中考慮雷射光強的空間與時間分佈與材料隨的深度吸收變化，並可從單一材料擴展至多層材料進行模擬材料內溫度分佈隨著雷射脈衝時間變化，可用來優化雷射加工參數。近紅外(near-infrared，NIR)波長雷射可以穿透樣品深處使多光子激發螢光顯微鏡系統可重建高頻基板中的結構螢光影像，可作為非破壞檢測應用，除此之外透過物鏡聚焦使負光阻SU-8產生非線性雙光子吸收達到雙光子微影(two-photon lithography，TPL)製作三微結構，然而在TPL中以雷射加工過程中會發生非預期折射率的偏折，導致結構不正確，為了修正此問題，本文以SU-8自體激發螢光，其強度隨曝光參數而不同，因此利用重建的激發螢光訊號可以幫助雷射加工過程中的掃描路徑校正，在多光子激發螢光顯微鏡系統輔助下，具有不同三種雷射加工參數的堆疊微結構顯現出能有準確的軸向位置。

The ultrafast laser processing is an essential technique for micro/nano fabrication. The laser wavelength of near-infrared (NIR) region can penetrate deep in the specimen and initialize photochemical reaction by nonlinear two-photon absorption inside the focal volume of the objective. Together with the three-axis laser scanning mechanism, three dimensional (3D) and complex microstructures could be developed by two-photon lithography (TPL). SU-8 is a negative photoresist and has superior material properties such as high chemical resistance, low creep deformation, low thermal conductivity, and great optical transparency above 360 nm. It can achieve high aspect ratio structure and has been widely used for microfluidic device and microelectromechanical system (MEMS) applications. However, the laser beam might pass through the structure which was fabricated with different laser parameter. TPL would suffer the refractive index change during laser processing and result inaccurate structure. This paper presents the laser processed SU-8 structures exhibit two-photon fluorescence which intensity is varied with different exposure dose. The reconstructed 3D fluorescence information could thus assist laser scanning path correction during laser processing. A three-stack microstructure with different processing parameters per stack is shown to have accurate thickness and axial position with the two-photon excited fluorescence assistance.

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