本論文為『SMD元件之自動化光學及電性檢測機台設計與分析』，此研究著重於生產線上之SMD元件自動光學檢測和電性檢測機台。將研究分為兩大主題進行研究整合；在生產線上之電性檢測機台，其電子產品隨著輕、薄、短、小的設計，雖然增加生產量，但檢測方面也面臨技術上的一大挑戰；故在生產線上，藉由探針檢測與產線改良，完成一電性檢測機台，在AOI自動光學檢測機台，機台架構藉由現有的技術，經過機械結構設計、精度分析、改良等技術，提升機台精度；軟體方面，在影像處理程式的開發上，本論文將以Microsoft Visual Studio 2005作為程式開發的工具，發展影像檢測系統，以自動搜尋功能將待測晶片輸送至CCD鏡頭正下方，透過影像比對辦識，檢測晶片反向、倒置、缺料及其他異常等狀況。

本論文結合AOI外觀檢測及電性檢測等功能，設計一IC檢測機台；將可協助國內半導體測試設備研發，具有提升學術研究與產業應用價值。

This research paper is aiming to develop a “Design and Analysis of Automatic Optical Inspection System and Integrated Circuit Tester for Surface Mounted Devices”. This paper is divided into two parts and is carried out its integrated research. Integrated Circuit Tester on production line, the development of electronic products has become lighter, thinner, shorter and smaller, though the production has also increased its output, the detecting system is therefore facing its technical challenge by employing a testing probe and improving the production line in order to set up a Integrated Circuit Tester. Furthermore AOI worktables, basing on the existing technology, the structure of the platform will be improved its precision by mechanical structure design, precision analysis and amendment, as well as to upgrade the software of image processing on the platform. Microsoft Visual Studio 2005 will be utilized to develop the program in the research. The image analyzing system will detect the inversion, upside down, underfilled and other abnormalities while the chip is delivered under the CCD lens by auto-searching function.
This paper has combined AOI and ICT basing on its functional analyzing technology set up a Integrated Circuit Tester. The developed technology is expected to be able to improve the production speed and increase the precision.

1.ROHM台灣代理商網頁，http://www.rohm.com.tw/products/discrete/diode/
2.N. J. Cedrone, and W. Hills, and R. J. Grenzebavk, and Winchester,"Air-Assist Accumulating and Transfer Unit for an Electronic Device Test Handler ", USA Patent, Patent No.4781494, 1988.
3.T. Kainuma, and N. Masuda, and H. Nakajima, and N. Igarashi,and Y. Nansai , "IC Testing Apparatus", USA Patent, Patent No.6257319 B1, 2001.
4.D. W. Woltjen,and Manchester,and MO., "Multi-Motion Parts Handler", USA Patent, Patent No.4036374, 1977.
5.N. J. Cedrone, and W. Hill, and Mass, "Vacuum Pick and Place Mechanism for Integrated Circuit Test", USA Patent, Patent No.4801234, 1989.
6.K. H. Lee, and S. B. Kim, "Device for Seating Semiconductor Device in Semiconductor Test Handler ", USA Patent, Patent No.6831296 B1, 2004.
7.莊長光，廖連亨，黃明輝，”可檢測被動元件正反面之送料盤”，中華民國專利，公告編號524419，2003。
8.李育忠，陳冠斌，何臣蜀，吳英男，”外觀檢測裝置及其檢測方法”，中華民國專利 ，公告編號522217，2003。
9.黃德崑，”晶粒分選機之迴轉分選裝置”，中華民國專利，公告編號439570，2001。
10.林芳旭，”測試包裝機之晶片極性反轉結構”，中華民國專利，公告編號
M350807 ，2009。
11. Otsu, N., "A Threshold Selection Method from Gray-Level Histograms, " IEEE
Transactions on Systems, Man, and Cybernetics, Vol. 9, No. 1, 1979, pp. 62-66.
12.KEITHLEY Model 2400 Series SourceMeter® User’s Manual.
13.Microchip TaiWan研討會PDF講義
http://techtrain.microchip.com/webseminars/documents/QVGA_101707.pdf
14.Microchip TaiWan研討會PDF講義
http://techtrain.microchip.com/webseminars/documents/GUI_arch_101707.pdf
15.施慶隆，劉晏維，PIC18Fxx2微控制器原理與實作 ，宏友圖書，1994
16.謝新協，表面黏著型發光二極體取放機構之研製，國立中原大學機械工程學系，2002。
17.黃順章，影像檢測技術在晶片包裝紙帶沖壓製程的應用，碩士論文，虎尾科技大學機械工程學系，2004。
18.黃瑞宗，機器視覺應用於托盤內積體電路板雷射蓋印之高速高精度自動檢測，碩士論文，逢甲大學資訊電機工程，2009。
19.陳昭雄、鄭光宏，應用影像視覺於超薄型表面載式電感器之瑕疵品辨識，科學與工程技術期刊第二捲第二期，2006。