本研究的目的在探討添加1~5wt.%In對Sn-3Ag-2Sb(簡稱SAS)無鉛銲料微結構、硬度及界面層之影響，同時利用銅線對接試件及高溫熱儲存評估銲點機械性質與抗熱性之影響。
研究結果顯示，SAS銲料中添加In使Ag3Sn化合物形成Ag3(Sn,In)。SASxIn(x=1~10wt.%)銲料，在As-cast的情況下Ag3(Sn,In)化合物生成過程中會隨In含量的增加，Sn原子被In原子所取代的比例會逐漸提升而逐漸趨向Ag2(In,Sn)。經高溫熱儲存後化合物中Sn原子被In原子取代情況更為顯著；3wt.%In以上的有明顯的InSb析出於基地中，InSb的數量會隨著In添加量的增加而增加。SASxIn與Cu基板銲接後，界面會生成Cu6(Sn,In)5化合物。In添加量達3wt.%時界面層上方會有石蓮花狀的Ag2(Sn,In)形成。IMC層厚度隨著In含量及熱儲存時間的增加而變厚。
As-cast的條件下，In元素提供SAS銲料固溶及析出強化，In含量越多之銲料硬度越高。熱儲存後銲料硬度皆有下降的趨勢，其中In添加量超過3wt.%以上的銲料硬度，在625hrs熱儲存後都比SAS3In還來得低，其中SAS10In最為嚴重。
銲點機械性質方面包含銲料銲點結合、剪切強度及疲勞壽命，都會隨著In添加量增加而提升。經625hrs熱儲存後銲點結合和剪切強度皆有下降的趨勢。疲勞壽命在625hrs熱儲存後，SAS1In~SAS3In/Cu因為銲點軟化導致破壞韌性的提高，所以疲勞壽命會隨著熱儲存的時間增加而提升。In添加量在3wt.%以上之銲點因為熱儲存的時間增加，界面層逐漸增厚，造成界面應力集中效應，導致破壞由銲料模式轉變成混合或界面模式，此時疲勞壽命將大幅度降低。
綜合本研究銲料界面層、硬度、合強及剪切強度、疲勞壽命之變化，研究結果顯示SAS3In銲料有較佳之性質。

This research are to evaluate the effects of 1~5wt.% Indium additions on microstructure, hardness and interfacial reaction with Cu substrate of Sn-2Ag-3Ag(SAS) lead-free Solder alloys. Tensile and thermal storage tests were used to estimate the adhesive strengths and thermal resistance of SASxIn solder joints.
Experimental results show that addition of indium into SAS solder results in formation of intermetallic compounds of Ag-Sn-In and InSb in matrix in addition to eutectic of Sn riched β phase and Ag3Sn. Sn atoms in Ag3Sn compound are substituted by In atoms in SASxIn solder system as indium content and/or thermal storage time is increased. A structural and morphological transformation of Ag3Sn to Ag3(Sn,In), Ag2(Sn,In)and finally Ag2(In,Sn) was occurred. Cu6Sn5 formed in IMC layer is transformed to Cu6(Sn,In)5 and thickens with the increases of thermal storage time.
Mechanical properties of SASxIn solder joints including low cycle fatigue life, adhesive and shear strength were increase with increasing In addition, but decrease during thermal storage. After 150℃ thermal storage, fatigue life will improve because of the softening of solder joint. So the fatigue life of SAS1In~SAS3In/Cu solder joints are higher than as-soldered. Solder joints with 4wt.% indium or above, the fracture modes form solder mode transited to mix mode even IMC mode by IMC layer grown. In the meanwhile, fatigue life would be decreased.
With compare of interfacial behavior, hardness, mechanical properties of SASxIn, The SAS3In solder alloy has better behaviors.

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