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研究生: 蔡文信
Tsai, Wen-Hsin
論文名稱: 高功率脈衝磁控濺鍍之電源開發與應用
Development and Application of High-power Impulse Magnetron Sputtering Power Supply
指導教授: 楊宏澤
Yang, Hong-Tzer
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電機工程學系碩士在職專班
Department of Electrical Engineering (on the job class)
論文出版年: 2019
畢業學年度: 107
語文別: 中文
論文頁數: 92
中文關鍵詞: 脈衝電源供應器切換式直流電源供應器高功率脈衝磁控濺射系統
外文關鍵詞: High-power pulse power supply, switched DC power supply, high-power impulse magnetron sputtering
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  • 本論文研究之高功率脈衝磁控濺鍍之電源開發與應用(High-power Impulse Magnetron Sputtering,HiPIMS)具有六種控制模式,分別為正/負直流電壓模式、單極性正/負脈衝電壓模式與對稱式/非對稱式雙極性控制模式。此電源供應器可分為二部分,一為直流電源供應器部分,另一為脈衝切換單元部分。在直流電源供應器部分,是由三相 220V/60Hz 之輸入電源,經內部高頻切換為升壓型直流電源供應器,它具有低漣波及可控性較高的優點,所開發之HiPIMS電源供應器,其輸出電壓範圍0~1000V,電流最高0~310A,功率0~10kW,主要利用IGBT元件所構成之全橋式轉換電路與脈波寬度調變(Pulse Width Modulation ,PWM)技術以調整輸出電壓、電流與功率。在脈衝切換單元部分,其主要電路架構為一組由IGBT元件所構成之全橋式轉換電路所組成。本文經由電阻測試,以佐證該方法之可行性,經由硬體實現與波型實測,說明本方法於電漿負載供電穩定及電漿系統研發上具有參考價值。

    In recent years, the high power impulse magnetron sputtering (HiPIMS) technique has been vastly employed in machinery industry, aerospace defense industry, metal products industry, packaging industry and textile coating industry. This technique can solve the shortcomings of the direct current magnetron sputtering which improve the deposited layer quality.
    The HiPIMS power supply unit were designed and studied in this thesis. The developed power supply unit has many unique features which enables the power supply to generate high density plasma and high degree of target ionization.

    摘 要.........................I Extended Abstract.........................III 致謝.........................VI 目 錄.........................VII 表目錄.........................X 圖目錄.........................XI 第一章 緒論.........................1 1-1研究動機與目的.........................1 1-2論文大綱.........................7 第二章 HiPIMS電源供應器與電漿原理紹.........................9 2-1簡介......................... 9 2-2電漿之原理及應用.........................9 2-2-1電漿之生成機制與分類.........................10 2-2-2電漿之特性.........................13 2-3電漿電源供應器種類.........................15 2-4直流電漿產生器工作原理.........................16 2-5 HiPIMS電源介紹.........................24 2-5-1高功率脈衝電源系統.........................25 2-5-2時間週期(duty cycle).........................26 2-6高功率脈衝磁控鍍膜.........................27 第三章 HiPIMS電源供應器架構與設計.........................29 3-1簡介.........................29 3-2控制電路設計.........................32 3-3三相電源輸入部分.........................36 3-3-1濾波器.........................36 3-3-2突波電流保護器.........................36 3-3-3三相整流器.........................36 3-3-4濾波電容.........................37 3-4硬體電路實體圖.........................37 3-5直流電源供應器輸入部分.........................38 3-5-1控制單元.........................40 3-5-2遠端通訊系統.........................40 3-5-3輸出保護電路.........................40 3-5-4電弧感應器偵測.........................40 3-5-5 PLC控制電路.........................40 3-6全橋式轉換器之基本工作原理.........................41 3-7脈衝切換單元之工作原理.........................49 3-7-1 IGBT驅動電路.........................51 3-8直流電壓控制模式.........................53 3-9單極性脈衝電壓控制模式.........................55 3-10雙極性脈衝電壓控制模式.........................58 第四章 實驗與測試結果.........................60 4-1本章簡介.........................60 4-2實驗結果與討論.........................60 4-3 HiPIMS電阻負載測試.........................60 4-4電壓控制模式電阻負載測試.........................68 第五章 結論與未來方向.........................87 5-1結論.........................87 5-2未來研究方向.........................87 參考文獻.........................89

    [1] P. Raman, I. Shchelkanov, J. McLain, M. Cheng, D. Ruzic, I. Haehnlein, B. Jurczyk, R. Stubbers, and S. Armstrong, "High Deposition Rate Symmetric Magnet Pack for High Power Pulsed," Surface and Coatings Technology, pp. 1-6, December 2015.
    [2] R. Wei, J. J. Vajo, J. N. Matossian, and M. N. Gardos, "Aspects of plasma-enhanced magnetron-sputtered deposition of hard coatings on cutting tools," Surface and Coatings Technology, pp. 465-472, 2002.
    [3] V. Kouznetsov, K. Macák, J. M. Schneider, U. Helmersson, and I. Petrovb, "A novel pulsed magnetron sputter technique utilizing very high target power densities," Surface and Coatings Technology, pp. 290-293, December 1999.
    [4] 蔡錫昌,俊尚科技,http://www.junsun.com.tw/index.php/zh/ component/k2/itemlist/category/2-2018-02-06-02-48-40.html.
    [5] Q. Luo, S. Yang, and K. Cooke, "Hybrid HIPIMS and DC magnetron sputtering deposition of TiN coatings: Deposition rate, structure and tribological properties," Surface and Coatings Technology, pp. 13-21, 2013.
    [6] J. Shoeb and M. J. Kushner, "Polymer Cleaning From Porous Low-k Dielectrics in He/H2 Plasmas," IEEE TRANSACTIONS ON PLASMA SCIENCE, vol. 39, no. 11, pp. 2828-2829,November 2011.
    [7] F. Lisco, A. Shaw, A. Wright, F. Iza, and J. Walls, "Surface Activation of Rigid and Flexible Substrates for Thin Film Photovoltaics using Atmospheric Pressure Plasma," pp. 2204-2209, 2016.
    [8] G. Cho, Y.-J. Kim, E. H. H. Choi, and H. . S. Uhm, "Propagation of Plasma Diffusion Wave According to the Voltage Polarity in the Atmospheric Pressure Plasma Jet Columns," IEEE TRANSACTIONS ON PLASMA SCIENCE, vol. 42, no. 11, pp. 3539-3548, November 2014.
    [9] T. Tesar, R. Musalek, J. Medricky, and J. Cizeka, "On growth of suspension plasma-sprayed coatings deposited by high enthalpy plasma torch," Surface and Coatings Technology, pp. 1-11.
    [10] J. D. Sethian, M. Myers, I. D. Smith, V. Carboni, J. Kishi, D. Morton, J. Pearce, B. Bowen, L. Schlitt, O. Barr and W. Webster, "Pulsed Power for a Rep-Rate, Electron Beam Pumped KrF Laser," IEEE TRANSACTIONS ON PLASMA SCIENCE, vol. 28, no. 5, pp. 1333-1337, October 2000.
    [11] S. Xiu, Z. Liu, J. Wang, and S. Member, "Vacuum-Arc Behaviors of a Coil-Type Axial-Magnetic-Field Contact at Contact Gap of 60 mm," IEEE TRANSACTIONS ON PLASMA SCIENCE, vol. 36, no. 1, pp. 208-214, February 2008.
    [12] N. I. Avtomonov, V. D. Naumenko,, D. M. Vavriv, S. Member, K. Schünemann, A. N. Suvorov, and V. A. Markov, "Toward Terahertz Magnetrons: 210-GHz Spatial-Harmonic Magnetron With Cold Cathode," IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 59, no. 12, pp. 3608-3611, December 2012.
    [13] Z. Zhou, L. Dai, Y. Wang, and F. Lin, "The Lifetime of a High-Current Triggered Vacuum Switch with Multi-Gap," on Discharges and Electrical Insulation in Vacuum, pp. 185-188, 2012.
    [14] 董家齊、陳寬任,奇妙的物質第四態─電漿,科學發展,編號 354, pp. 52-59, 6 2002.
    [15] H. Zong, X. Mu, and M. Sun, "Physical principle and advances in plasmon-enhanced upconversion luminescence," Applied Materials Today, pp. 1-15, 24 December 2018.
    [16] 黃書瑋,以 SF6/O2/Ar 感應偶合電漿蝕刻碳化矽材料,中華大 學,機械與航太工程研究所,碩士學位論文,民國96年。
    [17] J. L. Vossen and W. Kern, "Thin Film Processes II," Academic Press, Inc., Bonton, 1991.
    [18] 張家豪、魏鴻文、翁政輝、柳克強、李安平、寇崇善、吳敏文、曾錦清、蔡文發、鄭國川,電漿源原理與應用之介紹,物理雙月刊(廿八卷二期), pp. 440-451, 2006.
    [19] 沈國良,應用於交直流電漿之直流脈衝電源供應器,私立中原大學,電機工程學系,碩士學位論文,民國91年。
    [20] Q. Luo, S. Yang, and K. Cooke, "Hybrid HIPIMS and DC magnetron sputtering deposition of TiN coatings: Deposition rate, structure and tribological properties," Surface and Coatings Technology, pp. 13-21, 2013.
    [21] P. Raman, I. A. Shchelkanov, J. McLain, and D. N. Ruzic, "High power pulsed magnetron sputtering: A method to increase deposition rate," Journal of Vacuum Science and Technology, vol. 33, no. 3, pp. 1-10, 2015.
    [22] K. Yukimura, H. Ogiso, S. Nakano, and A. P. Ehiasarian, "High-Power Inductively Coupled Impulse Sputtering Glow Plasma," IEEE TRANSACTIONS ON PLASMA SCIENCE, vol. 39, no. 11, pp. 3085-3094, November 2011.
    [23] 蘇政揚,調控脈衝電壓及脈衝波間隔時間對高功率脈衝磁控濺鍍系統製備氮化鈦薄膜性質研究,國立清華大學,工程與系統科學所,碩士學位論文,民國100年。
    [24] 石崇甫,利用高功率脈衝磁控濺鍍製備氮氧化鋁薄膜於抗反射鍍膜之應用,逢甲大學,光電學系,碩士學位論文,民國105年。
    [25] R. Machunze, A. Ehiasarian, F. Tichelaar, and G. Janssen, "Stress and texture in HIPIMS TiN thin films," Thin Solid Films, pp. 1561-1565, 2009.
    [26] 施効谷,高功率脈衝磁控濺射沉積氮化鉻薄膜之性質研究,明道大學,材料科學與工程學系,碩士學位論文,民國101年。
    [27] Q. Luo, S. Yang and K. Cooke, "Hybrid HIPIMS and DC magnetron sputtering deposition of TiN coatings: Deposition rate, structure and tribological properties," Surface and Coatings Technology, pp. 13-21, 2013.
    [28] G. Eichenhofer, I. Fernandez, and A. Wennberg, "Industrial Use of HiPIMS up to Now and a Glance into the Future, A Review by a Manufacturer Introduction of the hiP-V hiPlus Technology," Universal Journal of Physics and Application, vol. 11, no. 3, pp. 73-79, 2017.
    [29] 梁適安,交換式電源供應器理論與實務設計,全華科技圖書股份有限公司,民國95年。

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