本研究的目地，主要是探討由自行設計與製作的銅粉燒結式均溫板，在具負載力量下的熱傳導效能量測，其中包含內部增設銅柱後，以增加均溫板可承受負載力量與熱傳導量的性能測試。同時，量測在具有負載壓力下，以同尺寸的銅塊來驗證均溫板的熱傳導效能與均溫性，並可從中得到最佳的負載力量。實驗設計中，各別有三組受測件，即是銅塊、無銅柱均溫板與具銅柱均溫板，在局部熱源面積及相同熱沉元件與負載力量的系統下，比較三組受測件之接觸熱阻值與擴散熱阻值，並再由經驗公式估算均溫板的有效毛細結構及蒸氣流之熱傳導係數與其熱傳量極限。從實驗結果得知，施以相同的負載力量時，自製均溫板的熱傳導效能與均溫性是遠優於銅塊；而比較內部增設銅柱與無銅柱之均溫板的熱傳導效能，其在不同的負載力量時，各別有其最佳的量測值，可分別作為後續使用均溫板之最佳扣具力量的依據。由此可知，以均溫板作為應用於局部熱源面積及高功率的電子產品內，將是解決電子產品因局部積熱而導致元件損壞的最佳方法之一。

This work has its own designed and manufactured copper powder sintered-type vapor chamber. In this paper, the performances of heat transfer and temperature uniformity were evaluated under different load forces and powers for three testing cases, the vapor chambers with and without copper pillars and a pure copper block with the size as the chamber. In the analysis, the comparisons of contact thermal resist and diffuse thermal resist were made and their effects the conductivity to were also evaluated. Furthermore, the empirical formulas were used to estimate the effective wick structures, the effective thermal conductivity of vapor and the limit of heat transfer rate. From the experimental results, the performances of heat transfer and temperature uniformity of vapor chambers are superior to those of the copper block. Under different load forces, the vapor chambers with and without copper pillars have their own optimum measured values, whose results could offer the optimum values of proper buckle force. From this study, it was found that the vapor chamber could be used to solve the problem of thermal damage caused by the locally accumulated heat of electric components.

1.日本熱管技術協會編, “熱管技術理論實務 (HEAT PIPE TECHNOLOGY)”, 熱傳導新科技應用, 1986.03, pp1-3
2.江家昇、林哲偉、蔡明杰, “均熱型散熱技術”, 電子與材料雜誌特輯 第22期, 工研院機械工業研究所, pp41-48
3.Xiaojin Wei, Kamal Sikka,“MODELING OF VAPOR CHAMBER AS HEAT SPREADING DEVICES”, IEEE, IBM Microelectronics, pp.578-585 (2006)
4.Amir Faghri,“HEAT PIPE SCIENCE AND TECHNOLOGY”, Taylor & Francis, Publishers since 1798, INTRODUCTION
5.G. P. PETERSON,“AN INTRODUCTION TO HEAT PIPES-Modeling、Testing and Applications”, Department of Mechanical Engineering Texas A & M University College Station, pp1-6
6.B. Tong, T. Wong and K. Ooi, “Closed-Loop Pulsating Heat Pipe, Applied Thermal”,Engineering, ISSN 1359-4311 21, 2001, pp. 1845–1862
7.Y. Zhang and A. Faghri, J. Thermophy. 17(3), pp.340-347 (2003)
8.J. Ku ,“Recent Advances in Capillary Pumped Loop Technology”,AIAA Paper No. 97-3870, 1997
9.陳嘉瑞、陳宗耀、陳孟壕、王邦吉、蔡志然,“高效能板式熱管之研發”, 科技交流專題, 國家太空中心, pp.40-47
10.工業技術研究院 微系統科技中心,“高效為型均熱片”, Micro Cooling Technology, 產品發表專刊
11.Unni Vadakkan, Gregory M. Chrysler, James Maveety, Muri Tirumala,“A Novel Carbon Nano Tube base Wick Structure for Heat Pipes/Vapor Chamber”,23rd IEEE SEMI-THERM Symposium, pp.102-104 (2007)
12.ATS.COM,“Vapor Chambers and Their Use in Thermal Management”, THE NEWSLETTER FOR THE THERMAL MANAGEMENT OF ELECTRONICS, ISSUE 8, VOLUME 1, SEPTEMBER 2007, Page 1-5
13.Hideaki Imura, Yasushi Koito,“THE ADVANCED COOLING TECHNOLOGY OF MICROPROCESSOR UNITS USING A VAPOR CHAMBER”,International Nano and MEMS Workshop, November 23-24, pp.43-51 (2005)
14.Shwin-Chung Wong, Jia-Da Wu, Wei-Lun Han,“EXPERIMENT ON A NOVEL VAPOR CHAMBER”, IEEE (2008), Department of Power Mechanical Engineering, pp.75-78
15.FORETHERMA ADVANCED TECHNOLOGY CO., LTD ,“Complex Steps Type Vapor Chamber ”, form http://www.foretherma.com.tw/
16.AUGUX Corporation,“Vacuum Vapor Chamber ”, form http://www.augux.com.tw/
17.G. P. PETERSON,“AN INTRODUCTION TO HEAT PIPES-Modeling、Testing and Applications”, Department of Mechanical Engineering Texas A & M University College Station, pp35-41
18.Cary, V.P,“Liquid-Vapor Phase Change Phenomena”, Hemisphere, Washinton, D.C, 1992
19.Cahn, R. W.,“Recrystallization、Grain Growth and Texture”, ASM Seminar Series, American Society for Metals, Metals Park, Ohio, pp. 99-128(1966)
20.Amir Faghri,“Heat Pipe Science and Technology”,Taylor ＆ Francis Washington, Pubilishers since 1798, pp.67
21.Peterson, G. P.,“An Introduction to Heat Pipe”, Wiley, New York, 1994, pp.44-74
22.Chi, S. W.,“Heat Pipe Theory and Practice”, McGraw-Hill, Washington, New Your, pp.85(1976)
23.G. Canti, G. Piero,“Thermal Hydraulic Characterization of Stainless Steel Wick for Heat Pipe Applications”, Rev. Gen. Therm., Vol.37, 1998, pp.5-16
24.J. F. Despois, A. Mortensen,“Permeability of open-pore Microcellular Materialia”, Acta materialia, Vol.53, 2005, pp.1381-1388
25.K. P. Trumble,“Spontaneous infiltration of non-cylindrial porosity：close-packed spheres”, Acta materialia, Vol.46, No.7, 1998, pp.2362-2367
26.林岳儒, 黃坤祥,“粉末特性對燒結式熱導管散熱性能的影響”, 工業材料雜誌, 熱管理材料與應用技術專刊, pp.88-94(2005)
27.Chi, S. W.,“Heat Pipe Theory and Practice”, McGraw-Hill, Washington, New Your, pp.34-38(1976)
28.Busse, C. A.,“Theory of Ultimate Heat transfer Limit of Cylindrical Heat Pipes”, Inst. J. Heat and Mass Transfer. Vol.16, pp169-186 (1973)
29.Anon, “Heat Pipes-Performance of Capillary-Driven Design”, Data Item No.70012, Engineering Science Data Unit, London, Sept. 1979
30.P. D. DUNN, D. A. REAY,“HEAT PIPES”, Pergamon, Elsevier Science Ltd., Fourth Edition, pp.85-89 (1995)
31.Chi, S. W.,“Heat Pipe Theory and Practice”, McGraw-Hill, Washington, New Your, pp.91(1976)
32.松山芳治, 三谷裕康, 鈴木壽(著), 賴耿陽(譯),“粉末冶金學概論”, 科學技術用書, 復漢出版社, pp.84-129 (1977)
33.Xiaojin Wei, Kamal Sikka,“MODELING OF VAPOR CHAMBER AS HEAT SPREADING DEVICES”, IEEE, IBM Microelectronics, pp.578-585 (2006)
34.Maxwell J.C.,“A Treatise on Electricity and Magnetism”, Vol.1, 3rd edition, reprinted by Dover, New York, 1954
35.Krane, Matthew John M.,“Constriction Resistance in Rectangular Bodies” , ASME, J. Electronic Packing, Vol.113, pp.392-396 (1991)