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研究生： 許琳
Hsu, Lin
論文名稱： Sn-Cu及Sn-Cu-Zn光伏銅帶之模組界面組織特性與通電機制研究
A Study on Characteristics of Microstructures and Electrical Mechanism of Sn-Cu and Sn-Cu-Zn Photovoltaic Copper Ribbon Modules
指導教授： 呂傳盛
Lui, Truan-Sheng
洪飛義
Hung, Fei-Yi
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學及工程學系
Department of Materials Science and Engineering
論文出版年： 2016
畢業學年度： 104
語文別： 中文
論文頁數： 88
中文關鍵詞： 光伏模組 、介金屬化合物 、Sn-Cu 、Sn-Cu-Zn合金
外文關鍵詞： Photovoltaic modules, IMC, Sn-Cu, Sn-Cu-Zn
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    • 本研究選用Sn-xCu(x=0.3, 0.7, 2.5, 5wt.%)四種銲錫合金做為光伏模組的鍍錫層，以Sn-0.7Cu合金製成之光伏模組具有最低電阻值，但經過72 hr通電後，界面IMC快速成長，大量消耗銀膠層，導致其體電阻值上升約52%。因此後續利用兩種不同方式進行優化實驗。
    第一個改善方式為成分調整，將Zn元素添加於前述實驗中電性最佳之成分(Sn-0.7Cu)，形成Sn-Cu-Zn系統之光伏模組。添加0.2Zn於Sn-0.7Cu合金中能有效抑制模組界面IMC過度成長，使其電阻值較Sn-0.7Cu光伏模組低。在72 hr通電後，Sn-0.7Cu-0.2Zn光伏模組之體電阻僅上升約9.5%，有效改善Sn-0.7Cu光伏模組在長時間通電後電阻大幅上升的問題。第二個改善實驗為改變鍍層附著於銅帶之方式，以電鍍取代原先之熱浸鍍。以電鍍製成之光伏銅帶其鍍層厚度可降低為原先之1/3 (30 μm→10 μm)，藉由電鍍得到較薄的鍍層，於回銲後減少銀原子擴散到銲錫合金的量，進而提升模組之導電性質。上述兩組優化光伏模組於通電前後其剝離力值皆符合工業應用標準。
    Sn-0.7Cu-0.2Zn光伏模組具有最低電阻值(0.021 Ω)，且在長時間通電後電阻值僅上升0.002 Ω，雖然電鍍製成之光伏模組擁有較厚的殘留銀膠層，但其界面IMC平均厚度較厚，導致整體電阻值較高，因此抑制界面IMC成長為降低光伏模組體電阻之最有效方式。

    Sn-Cu alloys have been recognized as the most promising Pb-free candidates for its well wettibility and lower cost. This study chooses Sn-xCu(x=0.3, 0.7, 2.5, 5 wt.% ) to use in photovoltaic (P.V.) modules, and researches on the applicabilityofSn-xCu/Cu P.V. modules by measuring resistance, microstructure and pull-off test. The result showed that Sn-0.7Cu is the most suitable solder applied in P.V. modules. But after current test, the resistance of Sn-0.7Cu modules increases 52%. In order to fix this problem, we tried two improved experiments.
    The first improved experiment is changing solder in modules. Adding 0.2Zn in Sn-0.7Cu could inhibit the growth of IMC that could promote the conductivity of modules. After current test, the resistance of Sn-0.7Cu-0.2Zn modules only increases 9.5% which confirms the true of adding 0.2Zn would stabilize the IMC at interface. The second improved experiment is changing experimental process of P.V. ribbon. Using electroplating to replace hot-dipped could decrease the thickness of solder layer which would decrease the consumption of Ag paste and increase the conductivity of modules.
    Sn-0.7Cu-0.2Zn modules have the lowest resistance (0.021 Ω). After 72hr current test, the resistance only increases 0.002Ω. Although PSC modules have the thickest Ag paste after reflowed, the IMCs at interface still over grow after current test. To sum up, depressing the growth of IMC is the best way to enhance conductivity.

    中文摘要 I 英文延伸摘要 III 致謝 XII 目錄 XIII 圖目錄 XVII 表目錄 XXI 第一章 前言 1 第二章 文獻回顧 3 2-1 銲錫合金應用與無鉛化發展 3 2-2 光伏導帶於太陽能電池的應用 3 2-2-1 太陽能電池介紹 3 2-2-2 光伏導帶回銲溫度對太陽能模組的影響 4 2-3 運用於光伏導帶之無鉛銲錫合金 5 2-3-1 Sn-Ag與Sn-Ag-Cu合金 5 2-3-2 Sn-Cu合金 6 2-3-3 Sn-Cu-Zn合金 6 2-4 接合材之界面反應 7 2-4-1 界面接合動力學 7 2-4-2 Sn-Cu合金與光伏模組界面行為 7 2-4-3 Sn-Cu-Zn合金與光伏模組界面行為 8 2-5 光伏模組剝離力可靠度評估 9 2-6 通電對光伏模組的影響 10 2-7 研究目的 10 第三章 實驗方法與步驟 19 3-1 銲錫材料分析 20 3-1-1 銲錫合金製作 20 3-1-2 微觀組織解析 20 3-1-3 合金導電率量測 20 3-2 光伏銅帶模組製備 21 3-2-1 熱浸鍍製程光伏銅帶 21 3-2-2 電鍍製程光伏銅帶 21 3-2-3 光伏模組製作 22 3-3 光伏銅帶及其模組織界面微觀組織分析 23 3-4 光伏銅帶模組之剝離力測試 23 3-5 光伏銅帶模組通電測試 24 3-5-1 通電實驗配置 24 3-5-2 體電阻量測 24 3-5-3 通電試片之界面微觀組織分析 24 第四章 實驗結果與討論 30 4-1 Sn-xCu光伏模組 30 4-1-1 合金微觀組織及電性分析 30 4-1-2 光伏銅帶界面微觀組織 30 4-1-3 光伏模組界面微觀組織 31 4-1-4 光伏模組之剝離力測試 33 4-1-5 光伏模組體電阻及通電後界面微觀組織 34 4-2 Sn-0.7Cu-0.2Zn光伏模組 35 4-2-1 合金微觀組織及電性量測 35 4-2-2 光伏銅帶界面微觀組織 35 4-2-3 光伏模組之剝離力測試 36 4-2-4 光伏模組界面微觀組織 36 4-2-5 光伏模組之體電阻及通電後界面微觀組織 37 4-3 電鍍Sn-Cu光伏模組 38 4-3-1 PSC光伏銅帶界面微觀組織 38 4-3-2 PSC光伏模組之界面微觀組織及剝離力測試 39 4-3-3 PSC光伏模組之體電阻及通電後界面微觀組織 40 4-4 Sn-xCu合金中Cu含量對於應用在光伏模組中的影響 40 4-5 Zn添加於Sn-0.7Cu光伏模組之影響 41 4-6 銲錫鍍層厚度對於光伏模組之影響 42 4-7 光伏模組通電機制 43 第五章 結論 84 參考文獻 85

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