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研究生：	鍾君勵 Chung, Chun-lee
論文名稱：	含鉛/無鉛錫球變形動力學穩態潛變分析 Steady Creep Analysis of Lead/Lead Free Solder Joints Using Deformation Kinetics
指導教授：	李超飛 Lee,C.F.
學位類別：	碩士 Master
系所名稱：	工學院 - 工程科學系 Department of Engineering Science
論文出版年：	2004
畢業學年度：	92
語文別：	中文
論文頁數：	92
中文關鍵詞：	潛變、變形動力學、剪應力、剪應變、溫度循環
外文關鍵詞：	Thermal Cycle, Shear Stress, Shear Strain, Creep, Deformation Kinetics
相關次數：	點閱：151 下載：3
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　　應用1981年Valanis及Lee[1]所提議之變形動力學理論，對90Pb-10、63Sn-37Pb、Sn、Sn-3.5Ag、Sn-0.7Cu、Sn-3Ag-0.5Cu及
Sn-10In-3.1Ag等Solder Joint作溫度、剪應力及剪應變率之間關係分析，及銲料行為間之比較。

　　90Pb-10Sn及63Sn-37Pb銲錫塊(Solder Joint)進行的實驗試件為雙樑結構試件，而Sn、Sn-3.5Ag、Sn-0.7Cu、Sn-3Ag-0.5Cu及Sn-10In- 3.1Ag銲錫塊(Soder Joint)進行的實驗試件為簡單剪力試驗，從對這些銲錫塊材料參數的調變過程中，發現即使是相同銲料，也會因試件大小及型態不同致使參數值在同一溫度下相異，因此由基體型態(Bulk Specimen)參數轉換至銲錫塊(Solder Joint Specimen)之參數必需經過有系統的調變過程，調整時先決定參數，再來是或者。在某一溫度下之參數決定後，以原溫度參數去決定另外溫度之參數，其中不隨溫度改變，最後得出參數隨溫度變化關係式。

　　分析上述各種銲錫塊(Solder Joint Specimen)其抗潛變能力之高低必須將配合能柵傾斜度一起比較，另外發現 Sn-10In-3.1Ag之銲錫塊與其他無鉛銲錫能柵傾斜度趨勢有明顯差異但是卻和含鉛銲料相似。

　　This thesis discuss the behaviors(shear strain, shear stress) with various solder joints in different temperature which applied with deformation kinetic(Valanis and Lee,1981).

　　Solder Joints,90Pb-10Sn ,63Sn-37Pb ,were tested with double beam specimens ,and solder joints Sn, Sn-3.5Ag, Sn-0.7Cu, Sn-3Ag-0.5Cu, and Sn-10In-3.1Ag were tested with simple shear test specimens.

　　I changed the parameters of solder joint specimens step by step to find the optimal values. There are some different parameter values between Bulk specimens and solder joint specimens. At first, I Defined the parameter k1, and then k1 or cutoff shear stress.change with temperature.

　　To Analysis the creep behaviors among those solder joints must be with the parameters k1 and the slop of energy barrier . By the way, I found the parameter the slop of energy barrier of Sn-10In-3.1Ag which was much different about another solder joints.

目錄
中文摘要………………………………………………………………………I
英文摘要……………………………………………………………………II
誌謝………………………………………………………………………III
目錄………………………………………………………………………IV
表目錄……………………………………………………………………VII
圖目錄……………………………………………………………………VIII
符號說明…………………………………………………………………XII

第一章 緒論……………………………………………………………1
1-1 前言…………………………………………………………………1
1-2 研究動機與目的……………………………………………………2
1-3 文獻回顧……………………………………………………………2

第二章 變形動力學穩態潛變率方程式………………………………6
2-1 一維變形動力學理論方程式…………………………………………6
2-2 三維穩態潛變本構方程式……………………………………………7
2-2-1單軸拉伸之穩態潛變本構方程式……………………………………7
2-2-2純剪之穩態潛變本構方程式…………………………………………8
2-2-3 一維與三維本構方程式之 參數轉換……………………………10
2-3拉/扭工程截取應力值關係式…………………………………………10 
2-4  、 、 與Sn/Pb組成比之關係………………………………12
2-4-1 與Sn/Pb組成比之關係…………………………………………12
2-4-2  與Sn/Pb組成比之關係…………………………………………13
2-4-3  與Sn/Pb組成比之關係…………………………………………14

第三章 Deformation Kinetic對90Pb/10Sn及63Sn/37Pb
 Solder Joints之研究及討論…………………………………….16
3-1 剪潛變參數之決定…………………………………………………16
3-2 90Pb-10Sn銲錫實驗結果………………………………………………17
3-2-2 阻障層(黏著層)……………………………………………………17
3-2-3 實驗過程及其結果…………………………………………………18
3-2-4 90Pb-10Sn Bulk Specimen與Solder Joint參數轉換原則………18
3-2-5 90Pb-10Sn Solder Joint參數值之決定……………………………19
3-3 63Sn-37Pb銲錫實驗結果………………………………………………22
3-3-1 實驗過程及其結果…………………………………………………22
3-3-2 63Sn-37Pb Bulk Specimen與Solder Joint參數轉換原則……22
3-3-3 63Sn-37Pb Solder Joint參數值之決定…………………………23

第四章 Deformation Kinetic對Sn、Sn-3.5Ag、Sn-    
0.7Cu、Sn-3Ag-0.5Cu、Sn-10In-3.1Ag Solder Joints之研究及討論…26
4-1 Sn之材料參數估算……………………………………………………26
4-2 Sn-3.5Ag之參數估算…………………………………………………28
4-3 Sn-0.7Cu、Sn-3Ag-0.5Cu及Sn-10In-3.1Ag之參數估算…………30

第五章 變形動力學對Solder Joint抗潛變能力之評估…………………33
5-1 以 值評估Solder Joint之抗潛變能力……………………………33
5-2 能柵傾斜度 對銲材抗潛變之能力分析…………………………34
5-2-1  對T之敏感度……………………………………………………34  
5-2-2  對T之敏感度……………………………………………………35
5-2-3 不同銲料能柵傾度之比較…………………………………………36
5-3 抗潛變能力之綜合評估………………………………………………36
5-4 變形動力學在ANSYS有限元素套裝軟體之應用……………………37
5-4-1 含純錫銲料雙樑試件FEM分析……………………………………37

第六章 結論………………………………………………………………40

參考文獻……………………………………………………………………89
                                    

[1]Valanis, K. C., and Lee C. F.,“Deformation Kinetics Theory of Steady-State Creep in Metals,” Int. J. Solid and Structures, Vol.17, pp.589-604, 1981.

[2]Valanis, K. C.,“Deformation Kinetics in Three Dimensions,” Int. J. Engng Sci., Vol.22, No.8-10, pp.979-988, 1984.

[3]Pao,Y.-H., Badgley,S., Govila,R., Baumgartner,L., Allor,R.,and Cooper,R.,“Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling,”Transaction of the ASME,Vol.114, pp.135-144,1992.

[4] Pao,Y.-H., Govila,R., Badgley,S.,and Jih,E.,“An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints,”Journal of Electronic Packaging,Vol.115,pp.1-7, 1993.

[5] Pao,Y.-H., Badgley,S., Jih,E., Govila,R.,and Browning,J., “Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints,”Journal of Electroic Packaging,Vol.115,pp.147-152, ,1993.

[6] Pao,Y.-H., Badgley, S., Jih, E.,and Govila, R., “Thermomecha- nical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints,”Fatigue of Electronic Materials ,Philadelphia,ASME,pp.60-79,1994.

[7] Song,H.G., Morris,J.W.,and Hua,F.,“Anomalous Creep in Sn-Rich Solder Joints,” Materials Transactions. Vol. 43, No.8, pp. 1847-1853. 2002.

[8] Song,H.G., Morris,J.W.,and Hua,F.,“The Creep Properties of Lead- Free Solder Joints,” JOM. Vol. 54, No. 6, pp. 30-32. 2002.

[9] Yeh,M.S.,“Effects of Indium on the Mechanical Properties of Ternary Sn-In-Ag Solders,” Metallurgical and Materials Transactions A. Vol. 34A, No.2,pp.361-365. 2003.

[10]Pao,Y.-H., Chen,K.L.,and Kuo,A.Y.,“A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components under Thermal Cycling,”Mat.Res.Soc.Symp. Proc.Vol.226,pp.23-28, Materials Research Society,1991.

[11]Pao,Y.-H., Govila,R.,and Badgley,S.,“Thermal Fatigue Fracture of 90Pb/10Sn Solder Joints,”Advances in Electronic Packaging,ASME,pp.291-300, 1992.

[12] Mohamed, F.A., Murry, K.L.,and Morris,J.W.,Jr.,“Harper-Dorn Creep in Al, Pb, And Sn, Met.Trans.,Vol.4,pp.935-940,1973.

[13] Wiese,S., Schubert,A., Walter,H., Dudek,R., Feustel,F., Meusel,E.,and Michel,F., “Constitutive Behavior of Lead-Free Solders vs. Lead-Containing Solders-Experiments on Bulk Specimens and Flip-Chip Joints,”Electronic Components and Technology Conference,2001.

[14] Li,L., Jang,J.W.,and Allmen,B.,“Shear Property and Microstructure Evaluation of Pb-free Solder Bumps under Room Temperature and Multiple Reflow/High Temperature Aging,”International Symposium on Advanced Packaging Materials,pp.347-353,2001.

[15] Lee,C.F., Chang,M.K.,and Chung,W.K., “Deformation Kinetics of Steady Creep in Sn/Pb Solder Alloys with Applications,”Journal of Mechanics,Vol.20,No.2,pp.35-41, 2004.

[16]張明凱,”變形動力學之銲錫材料的穩態潛變行為,”成功大學工
程科學系碩士畢業論文,2001年

[17]鍾維光,”不同鉛錫比銲材穩態潛變行為之變形動力學研究,” 成功大學工程科學系碩士畢業論文,2002年

[18]李昌澤, ”無鉛與含鉛銲錫材料變形動力學穩態潛變行為比較,”成功大學工程科學系碩士畢業論文,2003年

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校外：2004-07-12公開

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