載流子遷移率是為影響薄膜電晶體軟性電路效能好壞之重要因素,其值非常容易受外在施力以及電路運作溫度影響。因此在設計薄膜電晶體之軟性電路時,外在施力與電路運作溫度為不可或缺的思考因素。然而目前針對設計薄膜電晶體之軟性電路的現有擺放演算法,僅僅在元件擺放時考慮外在施力的因素而未將電路運作時的溫度影響列入考慮。缺乏了對於電路運作溫度考慮下的元件擺放演算法,將容易使得載流子遷移率在電路運作時發生大幅度的變化進而導致整體電路效能下降。因此,這篇論文中我們提出了第一個同時針對運作溫度與外在施力並行考慮之軟性電路元件擺放演算法,藉此來降低電路中載流子遷移率之變化率。其中我們同時提出以線性規劃以及以最小權重最大流演算法將影響載流子遷移率最巨之關鍵元件分散擺放。由實驗結果顯示,我們的演算法可以比以往僅考慮外在施力的擺放演算法更進一步的降低載流子遷移率。

Mobility is the primary device parameter affecting circuit performance in flexible thin- film transistor (TFT) technologies, and is particularly sensitive to the change of mechanical strain and temperature. However, existing algorithms only consider the effect of mechanical strain in cell placement of flexible TFT circuit. Without taking temperature into consideration, mobility may be dramatically decreased which leads to circuit performance degradation. This thesis presents the first work to minimize the mobility variation caused by the change of both mechanical strain and temperature. Experimental results show that the proposed algorithms can effectively and efficiently reduce the mobility variation.

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