摘要
本研究目的在於Sn-1.5Ag-0.7Cu銲料中添加0.05wt%之Ni(SACN)後，進一步添加不同比例的第五合金元素銻(Sb,0~2wt%)，探討Sb的添加量對其熔點分布與微結構之影響，並探討不同銲點形貌(桶狀、柱狀)之剪切試驗及等溫低週疲勞試驗評估銲料的機械性質與可靠度表現。
銲點微結構主要為網狀共晶組織包圍β-Sn基地，隨著Sb的添加網狀共晶組織之結構也隨之瓦解，並於Sb添加量為0.5wt%時有最細緻的網狀共晶組織。IMC層厚度於添加量0.5wt%時厚度由3.61μm降低至2.5μm，可有效改善Ni添加產生過厚的IMC層。
剪切試驗方面，桶狀及柱狀銲點的剪切強度皆隨著Sb的添加量增加而上升，桶狀銲點的剪切強度比柱狀銲點高10N，由於柱狀銲點受力時可以均勻分布應變於銲點，減少銲點應力集中的現象，使銲點的破壞引向較軟質的銲料內部而具有較高的延性。
低週疲勞試驗方面，銲點的疲勞壽命於Sb添加量0.5wt%時達到最高，原因在於網狀共晶組織較為緻密，且剪切試驗中SACN-05Sb有最佳之延性以及不差的剪切強度。而形貌不同的桶狀與柱狀銲點之疲勞壽命曲線與裂紋成長模式亦不相同，柱狀銲點由於改善尖角效應之缺陷，呈現較佳的破裂韌性，能抵抗裂紋傳播，因此於疲勞表現相對優異。柱狀銲點Sb添加量於1.0wt%以下時裂紋會由銲料內部生成開展，並引導至IMC層。添加1.5wt%以上的Sb時會使裂紋從IMC與銲料之間的介面生成，並轉往銲料內部成長。綜合本研究分析，Sb添加量於0.5~1.0wt%時可以改善銲料延性，並提升剪切強度，抑制迴銲後IMC層厚度，而柱狀銲點在抗疲勞性質較為優越，桶狀銲點則具有較佳的抗剪切性能。

Extended Abstract
Effect of Sb Addition on Low Cycle Fatigue Properties
of Sn-Ag-Cu-Ni Lead-Free Solder Joints

Kun-Jie, Yang
Hwa-Teng, Lee
Department of Mechanical Engineering, National Cheng Kung University

SUMMARY
Additions of Sb(0.5, 1.0, 1.5, 2.0wt%) to Sn-1.5Ag-0.7Cu-0.05Ni (SACN) were investigated for their influence on melting point and microstructure. The mechanical properties and reliability of different solder joint morphology (barrel and cylinder) were evaluated by shear test and isothermal low cycle fatigue test.
The results showed that the microstructures of the solders with low Sb additions consists of plate-like Ag3Sn and Cu6Sn5 eutectic compound within a β-Sn matrix. The Ag3Sn and Cu6Sn5 compounds were fine when 0.5wt% Sb was added to SACN solder. The size of Ag3Sn and Cu6Sn5 compounds increased as the more Sb addition. When 0.5wt% Sb added, the thickness of the IMC layer is reduced from 3.61 μm to 2.5 μm, which can effectively improve the reliability of solder joints.
The increase in antimony content may enhance the shear strength of the barrel and cylinder type solder joints as a result of Sb solid solution strengthening. The shear strength of the barrel solder joints is 10N higher than the columnar solder joints. The reason was cylinder type solder joints fixed the sharp corner found in solder profile of barrel type and reduced the stress concentration, made the crack lead to a soft solder inside instead.
In the low cycle fatigue test, the fatigue life of solder joints was highest when the content of Sb was 0.5wt%. In different solder profile, the fatigue life and crack growth pattern were different. The cylinder type solder joints exhibit better fracture toughness and resistance to crack propagation due to the improvement of the sharp corner effect. When the amount of Sb was less than 1.0wt%, the cracks were generated by the inside of the solder. When 1.5% or more of Sb was added, cracks were generated from the interface between the IMC and the solder and made a brittle fracture inside the IMC.
From all the results of this study, the mechanical properties of SACN are improved significantly when the Sb addition is at the range of 0.5~1.0wt%. The cylinder type solder joints have more resistant to fatigue.

Key words: Lead-free solder, Solder profile, Low-cycle fatigue test, Fatigue crack
INTRODUCTION
　In Surface Mount Technology (SMT), Sn-Ag-Cu(SAC) lead-free solder has become the mainstream of the solder alloy in the electronic industry because of lower melting temperature and excellent mechanical properties. To keep the mechanical properties, Ag content must be 3~4wt%, silver costs accounted for 40% ~ 50% in the solder, which greatly improves the solder alloy raw material cost and the relative cost is 3~4 times than Sn-37Pb. Therefore, the development of low Ag content (<2wt%) SAC lead-free solder will be a great practical value in the competitive electronic assembly industry. Low Ag content SAC solders with better performance in shock resistance and cheaper price have drawn more and more attention.
The reduction of Ag content in SAC solder has a great influence on the thermal properties, wettability and reliability, especially affects the shear strength of the solder joints. Previous studies mentioned that doping Ni in low Ag SAC solder had enhanced the hardness and adhesive strength and refined the solder structure. But it also reported that Ni additions would increase the thickness of IMC layer in as-soldered condition. Other studies reported that additions of Sb can significantly suppress the thickness of IMC layer and have considerable improvement in solder reliability.
　The reliability of the solder joint also depends on solder profile. However, the studies on the solder profile on the solder joint reliability is quite limited. Thus this study used Sb as an additive to improve the mechanical properties of Sn-1.5Ag-0.7Cu-0.05Ni(SACN) solder joints and find out the fatigue behavior of different solder profile.
MATERIALS AND METHODS
　In this study, we concentrate on the effect of various Sb additions (0~2.0 wt%) in the SACN solder joints on the microstructure, shear strength, thickness of IMC layer and behavior of low cycle fatigue. The specimens were soldered by reflowing in 270℃ and then cooled in air. Next, the specimens were placed in a furnace for thermal storage to simulate the operation in the electronics industry. Shear test and low cycle fatigue test were carried out on Shimadzu AG-I 5kN Precision Universal Testers. The metallographic specimens were cut from large bulk samples and involved a wet grind and polish with 1μm diamonds. By using the hardness difference between the precipitates and β-Sn base, the β-Sn base was removed and the hard precipitates were left and observed by OM.
RESULTS AND DISCUSSION
　DSC measurement showed that addition of Sb in the melting point of SACN solder was not much affected. It is still suitable for the current reflow process of the solder at 2.0wt% or lower Sb additions. When Sb was added to 0.5 wt%, the DSC curve of solder was similar to eutectic solder, which made the SACN-05Sb solder fine eutectic in the microstructure of solder joint. The addition of Sb will be soluble in β-Sn, and replace the Sn atoms in Ag3Sn to form a homogeneously dispersed strengthening phase Ag3(Sn,Sb). The shear strength of the solder joint will be increased by solid solution strengthening. The initial thickness of IMC layer was also thinner than SACN solder because the solid solution of Sb atoms changed the diffusion rate of Sn atoms. It also made SACN-05Sb have the best fatigue behavior either in barrel or cylinder type solder profile.
　The fatigue test on different solder profile show that the barrel type solder had higher load performance than cylinder type solder because of the sharp corner effect. The sharp corner effect made the failure occurred in brittle IMC and crack propagation fast. On the other hand, the cylinder type solder showed lower load performance but better ductility and excellent fatigue behavior in fatigue test because the damage occurred in the solder inside.
CONCLUSIONS
1. The addition of Sb in the SACN solder leads to a slight increase in the melting point of the solder. When 0.5wt% Sb is added, the fine eutectic would distribute over the microstructure of solder joint.
2. The initial thickness of the IMC layer with 1.0wt% Sb added is the thinnest. The thickness of the IMC layer tends to thicken gradually with the addition of Sb. Shows that it can effectively restrain the thickness of IMC layer when the addition of Sb is below 1.0 wt%.
3. After addition of 0.5wt%Sb, the shear strength and ductility of SACN solder improved obviously. It also makes SACN-05Sb the best fatigue performance both in barrel or columnar joints.
4. Barrel type solder joint has higher shear strength than cylinder type because of the failure occurred in IMC layer. Cylinder type solder joints has better fatigue behavior because of damage will occur in the solder inside.
Thus, the fatigue behavior and mechanical properties of SACN solder will be enhanced when 0.5~1.0wt% Sb is added.

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