IC塑膠構裝的注模膠封製程(Encapsulating Processes of IC Packaging)中，EMC在模具裡僅初凝固成形，其殘留應力相當大也造成EMC初成形後尺寸相當不穩定，更易於影響後續IC功能測試與可靠度測試，所以必須進行注模後烘烤製程，促使交連反應更趨近於穩定完整，發揮EMC被設計賦予的功能目的和適當的機械性質，而能夠保護IC晶片且構建電子構裝體(IC Packaging)達到穩定的結構。本論文主要針對EMC在注模後烘烤作業中，探討其熱機械性質的發展變化，利用DMA/ TMA和DSC儀器實驗所觀測的熱機械性質數據建構成Maxwell Model的數學模式化，亦即構建出EMC在注模後烘烤中熱機械性質的數學模式的構建方法(Methodology)，以方便在IC電子構裝體製程設計之初的工程預估及最後佳烘烤製程的設計。

本實驗結果發現：以較低的烘烤溫度，最終卻能得到較完整較高的彈性模數，顯然欲達成較佳效益的後烘烤結果，必須先了解EMC的聚合反應溫度與材料交連擴散的速率的對應關係。

EMC(Epoxy Molding Compound) is used to encapsulate IC on electronic packaging fields. There are some problems in the thermal process of curing EMC, such as package warpage, poor coplanarity of solder balls or lead, crack damages resulted from residual stress, delamination result from thermal stress… and so on. It is necessary for quality to minimize the warpage and deformation and improve potential damages. By the experiments of curing EMC to get the variants of thermal mechanical properties, we can modeling them by the mathematics equation of viscoelasticity and build up the methodology of modeling EMC. This study is to develop a methodology to calculate the modulus profiles during post-mold cure process and predict the EMC warpage caused by residual stress of incomplete cure and viscous stress during molding.

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