以陶瓷粉體為填充劑的複合材料，被廣泛的使用在各種高效能電子元件散熱的研發上,例如EMC封裝材料、散熱片、散熱膏、相轉移材料等。本研究即使用實驗室自行合成之氮化鋁陶瓷粉體作為複合材料的填充劑，希望藉由氮化鋁優秀的性質，更有效地增進複合材料的熱傳導性質。吾人以兩種製程：滲透與混煉製程，比較對EMC材料熱傳導的影響，並利用低黏度的矽酮樹脂製作相同條件的導熱片做為對照。主要的操作變因有促進劑的種類、熱壓與否、高分子基材的改變、兩種填充劑粒徑混合、粒徑分佈以及溶劑的使用。滲透製程上，目前以使用26.19μm氮化鋁粉體，添加液態硬化促進劑再經由熱壓可以得到熱傳導值最高為4.8 W/m-K。混煉製程方面，以兩種粒徑填充劑混合的EMC試片，在大、小粒徑填充劑粉體粒徑分佈集中的條件下，其熱傳導值能大幅超越使用單一粒徑填充劑的試片；而使用溶劑混合製作的EMC試片，有利於填充劑粉體的分散以及環氧樹脂填補粉體間的空隙，熱傳導值較未使用溶劑的試片高，但溶劑殘留形成氣泡也降低了熱傳導提升的程度。兩種粒徑填充劑混合製作的EMC試片，其熱傳導值的大幅提升，展現了本實驗室自行合成的氮化鋁粉體具有優越的導熱性，應用於高導熱複合材料的製作上，對於材料的熱傳導性質將更能有所突破。

　　The composites filled with ceramic powders are widely used for the development of thermal dissipation in variety of high efficient electronic devices . For example, epoxy molding compound, thermal pads, thermal grease and phase change materials, etc. In this research, we use AlN (aluminum nitride) powders synthesized by our lab as the filler, and hope to enhance thermal conductive properties effectively by excellent thermal properties of aluminum nitride. By two manufacturing processes : impregnation and hot mixing to compare the influence on EMC, and utilizing silicone which is with low viscosity to make thermal pads in the same conditions for comparison. The main variables are kinds of catalysts, hot pressing, change of polymer matrix, mixing of fillers with two kinds of particle size, particle size distribution and using of the solvents. For impregnation manufacturing processes, the highest thermal conductivity of the EMC samples made by using 26.19μm aluminum nitride powders, adding liquid catalyst and hot pressing is to reach 4.8W/m-K at present. For mixing manufacturing processes, the thermal conductivity of the EMC samples filled with two kinds of size of particles can be higher than those filled with one size of particles in the condition of the particle size distribution of larger and smaller particles are concentrated. Adding solvent to mixing epoxy and fillers is advantageous to disperse fillers and fill the space between particles with epoxy. The thermal conductivity of the EMC samples made by this way is higher than those made without adding solvent. But the solvent is hard to be exclude, and the exist solvent will make bubbles inside the sample to limit the enhancement of thermal conductivity. The large enhancement of thermal conductivity of the EMC samples filled with two kinds of particle size of fllers shows excellent thermal conductive properties of Aluminum nitride powders synthesized by our lab. . When using the powders to make high thermal conductive composites, the thermal conductive properties will be better than before.

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