從前對於覆晶封裝元件的模擬中，僅僅考慮不同材料間之熱膨脹係數(Coefficient of Thermal Expansion, CTE)的差異所造成的翹曲(warpage)，卻忽略了因為底部填膠材料之固化反應而造成的熟化收縮(cured-induced shrinkage)所造成的翹曲量，往往無法準確估計出封裝產品的內應力分佈與翹曲型態，影響估計成品的可靠度的準確性。
在本論文中，嘗試使用一種具有實用性的方法來描述底部填膠材料在固化過程中的體積收縮變化進程。並且配合統計的技巧建立出一個壓力－體積－溫度－熟化度的關係式(P-V-T-C關係式)。
此方法包括三個流程。首先，利用微差掃描熱卡計(DSC)配合統計之技巧來求得底膠材料之反應動力學模式。第二，使用本研究室開發之P-V-T-C實驗機來記錄底膠材料於等溫等壓下的體積變化。第三，整合體積變化與等溫熟化度的資料，並且建立出P-V-T-C關係式。

In general, different coefficients of thermal expansion (CTE) values of constitutive materials are considered as the main cause of warpage for flip chip packages. Accordingly, during the past years, the cure-induced volume shrinkage in IC packages has been neglected in warpage simulation. However, in recent years, there are more and more evidences showing that it is not sufficient to predict the amount of warpage if considering only the CTE values of different component materials in a package.
In this study, the behavior evolution of volume shrinkage during the curing process was described by a pressure-volume-temperature-cure (P-V-T-C) equation. The P-V-T-C equation of underfill encapsulant was developed by employing the thermal analyzer and statistical technique.
Three successive procedures were conducted for the measurement of the P-V-T-C relation. First, the reaction kinetics and isothermal conversion of underfill was determined by employing DSC and a statistical technique. Second, isobaric and isothermal volume shrinkage of underfill was monitored with a pressure-temperature-controlled dilatometer. Third, the P-V-T-C equation was established by combining the data of volume shrinkage and conversion.

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