本研究探討銅對於Zn-25Sn-xCu(x=0~0.3)與銅基板間的潤濕性、界面反應動力學與界面微結構之影響，也研究此銲錫合金的抗氧化性。潤濕性研究結果顯示銅的添加能促進Zn-25Sn銲錫與銅基板間的潤濕性，其中Zn-25Sn-0.15Cu的潤濕效果最好，潤濕性的提升是由於銅的添加降低銲錫表面張力、銲錫與基板間界面張力和潤濕反應活化能。銅的添加對於不同階段的界面反應造成不一樣的結果，在潤濕反應初期促進界面反應，使介金屬化合物CuZn5與Cu5Zn8成長，而在長時間浸鍍(液/固反應)與熱時效(固/固反應)過程，銅的添加均能抑制介金屬化合物的成長速率，減少界面化合物層厚度與銅基板的消耗。長時間浸鍍(液/固反應)後界面仍會維持雙層CuZn5與Cu5Zn8，而熱時效(固/固反應)後則只剩單層Cu5Zn8。Zn-25Sn銲錫在高溫氧化生成的氧化層會破裂與成長氧化鋅鬚晶，造成內部銲錫裸露繼續氧化，而銅的添加可以生成緻密氧化層進而提升銲錫的抗氧化性。

The wetting behavior of Zn-25Sn-xCu(x = 0, 0.05, 0.1, 0.15 and 0.3) with Cu substrate, interfacial microstructure, growth kinetics of intermetallic compounds and oxidation resistance were investigated in this study. The result of wetting tests show that adding Cu in Zn-25Sn can improve the wettability by decreasing surface tension, interfacial tension and activation energy of wetting. Zn-25Sn-0.15Cu has the best wettability. At the initial stage of interfacial reaction, both Cu5Zn8 and CuZn5 thickness increase as the Cu content increase. However, after long term reaction(solid/liquid reaction) and thermal aging test(solid/solid reaction), Cu addition retards the IMC growth rate and substrate dissolution which decreases the IMC thickness. There are two IMCs(Cu5Zn8 and CuZn5) in the interface during solid/liquid reaction. After solid/solid reaction, only Cu5Zn8 was observed at the interface. The oxidation test indicate that the addition of Cu lowers the oxidation rate and improves the oxidation resistance. During oxidation reaction, Zn-25Sn solder releases surface stress by oxide whiskers growth and oxide layer crack. Adding Cu in Zn-25Sn solder makes ZnO oxide layer become thinner and denser which prevents solder continued oxidizing.

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