在電子IC封裝製程中，封膠材料在熟化成型過程會與模具表面產生沾黏的現象，影響脫模作業過程，進而可能造成封膠失敗、生產良率降低與可靠度不佳等結果。因此封裝模具與封膠之間的脫模能力直接與模具表面與封膠之間表面自由能有絕對關係。利用封閉式非平衡磁控濺鍍TiN、TiMoS、ZrN、CrC、CrN、NiCr、NiCrN、CrTiAlN、CrNiTiAlN 薄膜，發展一個以抗沾黏(低表面自由能)為系統的功能性薄膜，作為電子封裝模具之表面披覆層，接下來利用接觸角量測儀(Dataphysics OCA-20 contact angle analyzer)並利用Owens-Wendt 幾何近似平均方法讀取薄膜在溫度20-170℃的表面自由能值。薄膜表面粗糙度經由原子力顯微鏡 (Atomic force microscopy)量測，薄膜對封膠材料的抗沾黏能力由黏模力測試儀讀取。實驗的結果顯現NiCrN、CrN、NiCrTiAlN薄膜對於抗沾黏能力優於TiN、ZrN、 NiCr、CrTiAlN、CrC、TiMoS薄膜，因此它們有潛在的能力成為工業設備上須要抗沾黏環境的工作層，特別是在半導體IC封裝的應用。

Semiconductor IC packaging molding dies require wear resistance, corrosion resistance and non-sticking (with a low surface free energy). The molding releasing capability and performance are directly associated with the surface free energy between the coating and product material. The serious sticking problem reduces productivity and reliability. Depositing TiN, TiMoS, ZrN, CrC, CrN, NiCr, NiCrN, CrTiAlN and CrNiTiAlN coatings using closed field unbalanced magnetron sputter ion plating, and characterizing their surface free energy are the main object in developing a non-stick coating system for semiconductor IC molding tools. The contact angle of water, diiodomethane and ethylene glycol on the coated surfaces were measured at temperature in 20 ℃ using a Dataphysics OCA-20 contact angle analyzer. The surface free energy of the coatings and their components (dispersion and polar) were calculated using the Owens-Wendt geometric mean approach. The surface roughness were investigated by atomic force microscopy (AFM). The adhesion force of these coatings were measured using direct tensile pull-off test apparatus. The experimental results showed that NiCrN, CrN and NiCrTiAlN coatings outperformed TiN, ZrN, NiCr, CiTiAlN, CrC and TiMoS coatings in terms of non-sticking, and thus have the potential as working layers for injection molding industrial equipment, especially in semiconductor IC packaging molding applications.

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