本文利用三維有限元素法來模擬覆晶陣列錫球構裝體之熱應力、熱應變及熱傳行為。構裝體含有六個組件，分別是凸塊、錫球、填膠、IC晶片、基版及印刷電路板。對於熱應力應變的模擬，凸塊及錫球材料的黏塑特質以亞蘭德模型來表示，填膠材料的黏彈特質以麥斯威爾模型表示，IC晶片、基板及印刷電路板是假設為彈性體，以虎克定理來表示其材料性質。在循環溫度負載下模擬構裝體變型情況。熱傳行為方面，假設IC晶片上產生穩定發熱量 ，封裝體與周圍大氣初始溫度假設為 ，當溫度變化達穩態後，量測總熱阻值 。
　　田口方法提供一個簡單、有效、系統化的方法，來達到最佳化設計。為了使封裝體達到最佳設計，我們同時考慮與改善三個品質目標(最小凸塊應變、最小錫球應變及最佳熱傳性能)。本文使用模糊理論配合田口方法來達到此種多目標品質的最佳化設計。其中，考慮的影響因子主要是以尺寸為研究對象，它們是凸塊的間距、錫球的間距、熱通孔的間距、晶片至基板的距離、基板至印刷電路板的距離、基板厚度與熱通孔半徑等七個影響因子。

　　The 3-D viscoelastic-plastic finite element analysis using the commercial code ANSYS has been performed to study the thermal-mechanical and heat-transfer behavior in the FC-PBGA. There are six components in the package: Solder Bump, Solder Ball, Under Fill, IC Chip, Substrate and PCB Board. The viscoelastic behavior of the underfill is modeled by the Maxwell constitutive equation, while the viscoplastic behavior of solder balls is modeled by the Anand model. The chip, substrate and PCB are assumed to be the linear elastic material modeled by the Hooke's law. Heat dissipation arise from IC chip and ambient temperature are used for studying the performance of the package by the code. Stress and strain distributions and the heat transfer behavior of package structures are presented for chip, underfill, substrate, solder-balls and PCB.
　　A study of a flip-chip package performance under the Taguchi methods was also presented. There are two design goals. One is to minimize the maximum equivalent strain on solder balls, and the other is to maximum the heat transfer performance. The use of fuzzy logic with the Taguchi method to optimize the performance of the package with multiple performance characteristics is reported in this study. The seven affecting factors, including solder bump pitch, solder ball pitch, thermal via pitch, the distance between IC chip to substrate, the thickness of substrate, and the diameter of thermal via are choiced for the optimization study.

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