| 研究生: |
范鈞隆 Fan, Chun-Lung |
|---|---|
| 論文名稱: |
結構型超級電容器串/並聯封裝之電化學及機械性質探討 Investigation on Electrochemical and Mechanical Properties of Structural Supercapacitor in Series and Parallel Encapsulation |
| 指導教授: |
楊文彬
Young, Wen-Bin |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 航空太空工程學系 Department of Aeronautics & Astronautics |
| 論文出版年: | 2025 |
| 畢業學年度: | 113 |
| 語文別: | 中文 |
| 論文頁數: | 142 |
| 中文關鍵詞: | SSC 封裝 、結構型超級電容器串/並聯 、PVA-KOH 凝膠電解液 、VARTM 製程 、電化學性質量測 、機械性質量測 、微結構觀測 |
| 外文關鍵詞: | structural supercapacitor, encapsulation, series-parallel configuration, PVA-KOH gel electrolyte, vacuum-assisted resin transfer molding |
| 相關次數: | 點閱:16 下載:0 |
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結構型超級電容器(SSC)因其高比電容、優異的機械強度及長循環壽命,近年來備受關注,並成為便攜式設備、電動車與航太產業中極具發展潛力的儲能技術。本研究針對一種新型 SSC 進行探討,其電極採用雙向編織碳纖維,介電層則選用雙向編織玻璃纖維,電解液使用 PVA-KOH 鹼性聚合物,基材則由環氧樹脂與硬化劑組成。透過真空輔助樹脂轉注成型(VARTM)製作樹脂含量 15wt% 之 SSC,旨在製作出電化學性質及機械性質兼具之成品。為了延長 SSC 之使用壽命,本研究進一步開發封裝技術,採用雙層碳纖維與單層玻璃纖維預浸料作為封裝材料,並利用銅箔與導電銀膠將電極延伸,以提升機械強度並減少水分流失,從而提高 SSC 之穩定性。此外,為提升 SSC 之應用效能,亦開發出電容器串/並聯之封裝方式。實驗結果表明,透過對 SSC 進行封裝,成功達到於 50 日仍保有 97.2% 的比電容值,展現出優異之長期穩定性,進一步分析發現,串聯封裝可有效提升電容器之最大操作電壓,而並聯封裝則可提高總電容量,並顯著降低等效串聯電阻(ESR)之影響。綜上所述,本研究成功開發出穩定成型的 SSC 封裝製程,有效延長 SSC 的使用壽命,同時,提出了有效的電容器串/並聯方式,提升了其應用的多樣性,這將解決 SSC 在過去研究上所面臨到時間的挑戰,並提升實際運用之可行性。
This study investigates structural supercapacitors (SSC) with high specific capacitance, fast charge-discharge capability, and enhanced mechanical strength. The SSC utilizes woven carbon fiber electrodes, an alkaline electrolyte, and are fabricated using vacuum-assisted resin transfer molding (VARTM) with a resin content of 15 wt%, achieving a balance between electrochemical and mechanical performance. To improve durability, a dual-layer carbon fiber and single-layer glass fiber prepreg encapsulation is introduced, with copper foil and conductive silver paste extending the electrodes. This enhances mechanical integrity and minimizes moisture loss. Encapsulation enables 97.2% capacitance retention after 50 days, while series connections increase operating voltage, and parallel connections increase total capacitance while reducing equivalent series resistance (ESR). This study establishes a stable SSC encapsulation process that extends lifespan and improves practical feasibility, addressing key challenges in SSC development.
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校內:2027-07-01公開