積體電路製造是資本密集、技術密集的產業，在半導體生產中，因為有著許多不同製程，以半導體生產製程分別有擴散、黃光、薄膜、研磨、蝕刻、植入六大步驟，生產過生會在這六種製程機台中交錯進機，進而生成整個積體電路的電路系統製程，因此工廠內每部機台在半導體生產流程中均有其特定功能，並且依據功能使用大量不同具危險性之酸性化學藥劑。為了減少人為操作失誤與提升機台生產率，工廠會透過排程系統來估算產品進機時間，選擇正確功能的機台，及減少產線機台等待來提升產能。而目前大部分的排程系統皆以機台及產品的一般資訊作為排程依據，無法在第一時間使用精確的機台酸性化學溶液資訊，導致機台換酸排程精確度低，時常需透過人為介入處理，藉由工程師個人經驗作判斷，執行更換酸性化學溶液的動作，但有時會造成錯誤判斷，導致產品延誤進機，甚而報廢，且亦增加人為工作量，並將工廠與人員暴露在風險之下。

本研究將對半導體工廠製造流程進行改善，以半導體生產流程中其一流程進行改善，該生產流程使用之機台作業主要為晶圓清洗為主要目的，是以二十五片為一批次或單一晶圓片，藉由化學藥品與超純水浸泡或沖洗來去除髒污與雜質，主要作用是清除晶圓片上的污染物，例如微塵粒(Particle)、有機物(Organic)、無機物、金屬離子(Metal -Ions)等雜質，研究利用數據挖掘應用在排程系統上，分佈式處理各產線數據，從數據中提取知識的方法和實踐的指南，利用數據分析技術的輸出，做為決策產線生產流程，並將虛擬排程系統與實際產線機台狀態連接起來，可靠，安全，穩定，高效地運行。利用排程系統作為改善的工具，透過轉換演算更改機台狀態，提升生產效率，並且在不影響生產上，維持一定的品質，降低酸液的生產成本，避免人為介入產生的突發事件。
研究實驗主要分為五大因素,機台(Equipment)、製程、貨(Wafer)、人、排程系統,思考各項因素條件限制,利用數據計算，撰寫轉換演算，配合排程系統,提高工廠生產效益與減少人力與降低成本,而更往工業4.0、工廠無人化邁進。

Semiconductor manufacturing is a capital and technology intensive industry. In a factory, each machine has its special function in the semiconductor production process, and uses a lot of dangerous chemicals of various kinds. In order to avoid human errors in operations and increase the yield rate of machines, factories usually use some scheduling system to estimate the timings for product flows to enter machines, to choose machines with right functions, and to reduce machines’ waiting time to increase the production capacity. For the time being most scheduling systems uses only general information of products and machines as the basis for the final schedule. The chemical information of each machine is not used precisely on the first hand in the scheduling process, which causes the system to generate obviously imprecise schedules for changing machines’ chemicals. Engineers need to intervene from time to time to adjust timings for changing machines’ chemicals based on their experiences. Error judgements do happen, which causes products scraped because of the delay to entering to machines. Engineers are sometime overloaded, not to mention factories are also put under risks.
This study focuses on improving one of the manufacturing procedures, i.e. washing the wafers in a machine, in the scheduling system of a semiconductor factory. This procedure in a machine is to wash the wafer in the unit of a batch of wafers or a single wafer in the machine. Possible contaminants on a wafer is removed by soaking in or by spraying chemicals on the wafer, followed by ultrapure water washing to remove impurities. This is to clean the contaminants such as the particle, organic, inorganic, metal-ions, etc.
There are five factors to consider in this research, including equipment, process, wafer, human, and schedule system. Taking into account the limitation of these factors, and using calculated data of the factors, the improvement on a schedule system can increase product efficiency of a factory and reduce its total cost and human resource requirement. It can make the future of the industry 4.0 and unmanned factory possible

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