隨著電子產品需求演變，印刷電路板產業技術已從以往低技術層次的單面板走向需高技術才能生產的增層板。由於台灣電路板為客制化產業，生產的產品會隨著圖形佈局、鑽孔或結構設計的變化而產生不同品質結果，而其中尤以分層造成的信賴性問題最受重視。

本論文主要探討圖形佈局與設計項目對於電路板壓合後信賴性影響關係併進行改善研究。實驗上分為三個階段，首先了解鑽孔密集度、板厚度、板框圖形與通孔方式等設計因子與分層的關係，再嘗試以均勻電路板吸熱分佈與提供散熱通道方式進行改善，最後將可行的改善方法導入產品觀察實務上的效果。

實驗結果發現內通孔的鑽孔密度對於電路板信賴性有明顯負面影響，增強電路板結構強度或設計散熱通道則有助於改善，此結果也在實際產品上獲得驗證。

With the demand evolution of electronic products, the printed circuit board (PCB) industry technology has been improved from the previous low-tech single-sided board to the high-tech HDI one. Because Taiwan PCB industry is a customized one, the different layout, drill or stack design will have different production qualities, in which especially the reliability problems caused by delamination obtain the greatest attention.
This work is primary to study the effects of PCB layout on delamination, from which the improved methods are brought up. The research is divided into three stages. In the first stage, the influences of drill hole density, board thickness, board frame pattern and drill hole type on delamination are investigated. In the second stage, two improved methods are proposed for the delamination problem, which are copper dots and through holes applied to the board. The former one is to make the heat transfer uniform over the board and the latter one is to enhance the heat transfer. The effects of these methods and their mixed scheme are analyzed in this stage. In the last stage, a feasible way is found from the results of the first two stages. This method is applied to a real PCB product and its effects are checked.
From the experimental results, it can be found that the buried hole has the negative effect on the PCB reliability. Enhancing the structural strength of PCB or designing the proper heat dissipating tunnels is helpful to improve the reliability, which is verified by applying the modified method to a practical product.

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