| 研究生: |
陳建明 Chen, Chien-Ming |
|---|---|
| 論文名稱: |
LCM表面粘著熱壓設備內部積熱散熱系統之效益研究 Study On Heat-Dissipation Performance For Accumulated Heat In LCM Superficial Coherence Thermo-Compression Equipment |
| 指導教授: |
趙隆山
Chao, Long-Sun |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 工程科學系碩士在職專班 Department of Engineering Science (on the job class) |
| 論文出版年: | 2008 |
| 畢業學年度: | 96 |
| 語文別: | 中文 |
| 論文頁數: | 95 |
| 中文關鍵詞: | 固定與移動式熱源 、風扇 、鰭片 、水冷散熱模 |
| 外文關鍵詞: | water-cooling module, fin, fan, fixed and moving heat sources |
| 相關次數: | 點閱:129 下載:3 |
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電子零件或化學材料長期處於高溫的環境下,其零件運作夀命及機台內化學材料之平衡穩定將會受到影響。目前於實際散熱應用上,大部份以氣冷及水冷較為普遍,搭配散熱鰭片增加其散熱面積做為散熱方式也相當常用。本文希望經由散熱鰭片之較多表面積特性,運用在水冷系統上,以期待能幫助機台內部積熱之散熱。本研究分為四個主題來做探討:(1) 自製水冷散熱系統對冷卻水溫及水冷散熱器高度位置子對散熱效益的影響力比較;(2) 搭配不同的水冷散熱模組(外購與自製),比較其散熱效益;(3) 強制風扇氣冷與水冷散熱模組搭配風扇之散熱效益比較;(4) 移動熱源的散熱效益實驗。
本研究結果發現,各控制因子對散熱效益的影響力順序為:水冷機構+風扇>氣冷(挖洞+風扇)>水冷機構。比較其相同條件下,對於水冷機構加入風扇之熱阻值比沒有風扇作用之下熱阻值,其差異約1倍;若是比較機殼內空間溫度差異,在風扇作用下,其機殼內空間溫度差異可降低6倍之多。其差異在於散熱過程中,因鰭片表面有冷凝水滴附著,造成散熱不良,如果加裝風扇,可以有效清除鰭片表面水滴,並增加空間之熱對流。另外,熱源之移動與否之差異,在相同散熱條件下,其對於散熱效益之差異並無明顯的影響。
When electronic components or chemical materials are subjected to a high temperature environment for a long period of time, the operation lives of the components and the balance stability of the chemical materials inside a working machine will be affected. Currently, the air or water cooling is commonly used in the practical application of heat dissipation. Fins, which can increase the cooling area, are often utilized to raise the heat-dissipation efficient of these two cooling methods. In this thesis, water cooling with fins is used to transfer the heat accumulated in a working machine and the heat-dissipating performance is evaluated.
In this work, an experimental model is built, which is a close system of cuboid shape. A heater, which is used to simulate the heat source, is fixed on or moved up and down repeatedly along an internal vertical surface of the cuboid. Four primary subjects are studied: (1) the comparison of heat-dissipating performances for different inlet water temperatures and heights of homemade water cooling module, (2) the comparison of heat-dissipating performances for homemade and bought water cooling modules, (3) the comparison of heat-dissipating performances for the water cooling module with electrical fans installed on the vertical surface of the cuboid or a fan on the module, (4) Evaluation of heat-dissipating performances for a heater moving up and down repeatedly.
From the evaluation results of the heat-dissipating performance, it can be found that the cooling module with a fan on it is the best, the cooling module with fans installed on the vertical surface of the cuboid is the second best and the cooling module alone is the worst. Under the same working conditions, the thermal resistance of the best one is one half of that for the worst one and the best one is six times the decrease in air temperature of the cuboid of the worst one. In the heat-dissipation process, the condensed water is attached to the fins, which hinders the heat transfer in the worst one. The condensed water can be removed by the fan installed on the module so that the best one has the highest performance. With the same working conditions, the performance of the fixed heater is almost the same as that of the moving heater.
[1]陳信文, 陳立軒, 林永森與陳志銘, “微系統構裝基礎原理,” 高立圖書, 2002/12初版, pp.221.
[2]Tummala.Rao R.,“Fundamentals of microsystems packaging” Advances in Electronic Packaging, 2001, p 1795-1797
[3]王志耀 , “淺談微冷卻器之技術發展”, 電子月刊 , 2001年1月號 , pp.124-134.
[4]張漢忠, “散熱座之熱傳分析,” 大同大學機械系90級專題研究摘要彙編, 2001.
[5]陳旗正, “個人電腦交換式電源供應器之熱管散熱模組研製,” 國立成功大學工程科學研究所碩士論文, 2004.
[6]王志耀 , “淺談微冷卻器之技術開發”, 電子月刊 , 2001年1月號 , pp.124-134.
[7]吳啟榮,”機車引擎散熱罩與風扇之流場與散熱效果改良,” 國立台灣科技大學機械工程研究所碩士論文, 2004.
[8]Chu.Richard C.,Hwang.Un Pah,and Simons. Robert E., “Conduction Cooling for an LSI Package: A One-Dimensional Approach,” IBM J. RES. Develop., Vol.26, NO.1, January, 1982.
[9]Avram Bar-Cohen, “Thermal Management of Air- and Liquid-Cooled Multichip Modules,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. Chmt-10, NO.2, June, 1987.
[10]H. Y. Zhang, D. Pinjala and P. S. Teo, “Thermal Management of High Power Dissipation Electronic Packages; from Air Cooling to Liquid Cooling” , 2003 Electronics Packaging Technology Conference.
[11]S.Gima, T. Rominura, X. Zhang and M. Fujii, “An Experimental Study on Liquid Cooling of High-Power IC Chips”,EEP-Vol.26.2,Advances in Electronic Packaging-1999 Vol.2 ASME 1999.
[12]M.R. Vogel , “Liquid Cooling Performance for a 3D Multichip Module and Miniature” , Components, Packaging, and Manufacturing Technology, Part A, IEEE Transaction on [ see also Components, Hybrids, and Manufacturing Technology, IEEE Transaction on] Vol:18, Issue: 1 , March 1995 pp.68-73.
[13]鄭昱韋, “晶片用環型水冷器之研究,” 國立中山大學機械與機電工程研究所碩士論文, 2004.
[14]陳律安, “電腦水冷散熱系統之效益研究,” 國立成功大學工程科學研究所碩士論文, 2006.
[15]吳德洋, “散熱座應用於水冷系統之效能評估,” 大同大學機械工研究所碩士論文, 2003.
[16]陳賢仁, “散熱鰭片使用於自然對流、強制氣冷與水冷之散熱效能比較,” 國立成功大學工程科學研究所碩士論文, 2006.
[17]趙谷峰, “液冷散熱模組散熱效益之研究,” 國立成功大學工程科學研究所碩士論文, 2004.
[18]D. B. Tuckerman , and R. F. W. Peace, “High-Performance Heat Sinking for VLSI” , IEEE Electron Device Letters, Vol.2, No.5 , 1981 pp.126-129.
[19]W. Nakayama, “Enhanced Heat Transfer in Tight Space-A Frontier for Thermal Management of Microelectronic Equipment,” Enhanced Heat Transfer, Vol.6, pp.121-133, 1999.
[20]S. G. Kandlikar and W. J. Grande, “Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling-Thermohydraulic Performance Enhancement and Fabrication Technology,” Heat Transfer Engineering, Vol.25, No.8, pp.5-16, 2004.
[21]R.D. Dickinson , S. Novotny, M. Vogel,, and J. Dunn,“A System Approach to Liquid-Cooled Microprocessors” , Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. Itherm 2002. The Eighth Inthersociety Conference on, 30 May-1 June 2002 pp.413-420.
[22]簡嘉興, “两相熱虹吸循環迴路型電子散熱系統研究,” 國立雲林科技大學機械工程系碩士論文, 2007.
[23]斐善永, “液冷式晶片散熱器之管內對流沸騰熱傳增強技術研究,” 國立台北科技大學能源與冷凍空調工程系碩士論文, 2007.
[24]S.W. Kang. L.J. Yang. J.Y. Hung. J.S. Chen, , “Orientation Silicon Based Micro Heat Exchanger Channel” ,The 11th International Symposium on Transport Phenomena, 1998 , pp.512-515.
[25]康尚文、楊龍杰、黃德麟、蕭聰鑫 , “微冷卻器簡介”, 微機電專輯 , 1991年11月號 , pp.343-353.
[26]吳貽, “煤的有效利用與電能轉化,” 科學月刊, 1976年5月, 第77期.