環氧樹脂封裝材料(EMC)廣泛用以保護IC晶片,主要成分係填充劑達70%以上,是主要影響EMC品質的關鍵因素,為了確認填充劑影響程度，本論文以三種填充劑於不同添加量進行研究,包含鈍角砂(Edgeless silica)、結晶砂(Crystal silica)、熔融砂(Fused silica), 結果顯示流動性、玻璃轉化溫度(Tg)、熱膨脹係數、吸水率等隨著填充劑添加量增加而降低, 但熱傳導率和曲折強度隨填充劑添加量增加而增加,其中鈍角砂有較好的流動性、成型性、較高的熱傳導、較大的曲折強度及較小的吸水率。
除上述不同添加量影響品質以外,其填充劑的粒度大小、種類和形狀的影響進行調查,其結果指出填充劑粒度較大時EMC有較小的黏度、較好的流動性,並且熱傳導及熱膨脹係數都輕微增加,另,球形砂比多邊形砂亦有如上的較小黏度及較佳流動性優勢,結晶砂系EMC的熱傳導和熱膨脹係數約是熔融砂系的2倍,多邊形較球形有較好的熱傳導,另一方面,熱膨脹係數與填充劑形狀無關,與種類相關,就固化度而言,多邊形大於球形,熔融砂大於球形砂。
另將EMC成型於銅導線架(Leadframe)上調查黏著力結果顯示較高的模溫有較佳的黏著力,銅導線架氧化初期有黏著力上升隨氧化時間延長後年著力急遽向降,含水率與成型溫度交互作用亦會影響黏著力升降趨勢。
環保阻燃劑用以保護元件耐燃、人員健康以及降低環境衝擊,在本論文研究以三苯基氧化磷(Triphenyl phosphine oxide)、三聚氰胺氰尿酸(Melamine cyanurate)、氫氧化鋁(Aluminum hydroxide)影響EMC品質之調查, 前述三種阻燃劑以T,M,A代表, 防焰測試結果T添加量1.5%以上, M 添加量2.0%以上可以符合UL94-V0要求的防焰特性,但是A無法滿足,同時,T添加量增加使成型性變差及漏電流增加,M添加量增加亦使成型性變差,但漏電流沒有變差,綜關上述其T添加量1.5%-2%及M添加量2%-3%可以被採用。
由於EMC內金屬粒子的存在可能導致金屬粒子跨接於二引腳之間導致短路失效發生,故探討沖蝕速度和沖蝕角度影響金屬粒子關係,結果顯示磨耗率與前述二者相關,較高的速度及較小的沖蝕角度產生較大的磨耗,特別是在較高的沖蝕速度影響更為明顯,磨耗產生金屬粒子外觀形貌不規則,較小的沖蝕角度會產生較長的金屬粒子。
最後要特別提及由於EMC主要是以矽砂當填充材, 故製程中必然產生磨耗金屬粒子混入, 因此必須要在封裝以前除去, 實務上通常使用釹鐵硼(Nd-Fe-B)永久磁鐵來分離金屬粒子, 研究結果顯示金屬粒子累積量隨著時間增加,並可由磁鐵有效的去除, 去除效率與磁鐵的磁通密度及流場相關, 在磁鐵後部的尾流是相對低速的回流區域, 金屬粒子容易被吸附, 所以吸附比較多的金屬粒子發生在磁鐵的下游, 因此, 低速的回流區可以更有效的利用，以提升金屬粒子的去除效率。

Encapsulation molding compounds are commonly used to protect IC chips. Their composition always contains fillers of a large amount (about 70%) and will affect the properties of the compounds. Thus, in order to clarify the filler effects, three types of silica fillers including crystal silica, edgeless silica, and fused silica were studied experimentally to explore their effects on the compounds. The results show that all of the flow spiral length, glass transition temperature (Tg), coefficient of thermal expansion, and water absorption rate of the encapsulation molding compounds decrease as the filler amount increases, In contrast, both thermal conductivity and flexural strength of the compounds increase as the filler amount increases, For the three fillers, the edgeless silica filler has the advantage of a large flow spiral length and can be molded better. It also has a larger thermal conductivity, larger flexural strength, and lower water absorption rate。
When consider the effects of its size, type, and shape, The results show that the filler with a larger particle size will have a smaller viscosity and will flow better; the spherical filler is better than the polygonal one in this respect. In contrast, both thermal conductivity and coefficient of thermal expansion increase slightly as the filler particle size increases ; the values of these two properties of crystal silica are about twice those of fused silica; the thermal conductivity of polygonal silica is larger than that of spherical silica. On the other hand, the dependence of the coefficient of thermal expansion on filler shape is not significant, but is significant on filler type. Also, the degree of curing of the compound with polygonal silica is higher than that with either spherical or crystal silica. That is, curing is affected by both filler type and shape, and can be tuned accordingly to suit the need.
EMCs were molded to Cu leadframes to experimentally quantify the effect of mold temperature, resin viscosity, leadframe oxidation, and powder moisture on the adhesion force. Component reliability was assessed by PCT, A higher mold temperature result in a larger adhesion force. The mold temperature of 175℃ provides the largest process window. Leadframe oxidation can increase adhesion first, but then decrease adhesion drastically with further oxidation. The powder moisture content has mixed effect on adhesion.
Green flame retardants are required for protecting the electronic components, human health, and the environments. In this study, the effects of three green flame retardants of Triphenyl phosphine oxide, Melamine cyanurate (MCA), and Aluminum hydroxide on the properties of encapsulation molding components were examined by experiments. The results show that their amounts in weight percentage affect the encapsulation and flammability properties. The flammability test results indicate that both Triphenyl phosphine oxide (with the added amount reaching 1.5% or more) and MCA (of 2% or more) can meet the UL94-V0 flammability requirement; but Aluminum hydroxide could not. By adding more Triphenyl phosphine oxide, the EMC moldability becomes poor and also induces large leakage current. Adding more MCA will also lead to poor moldability, but not increasing the leakage current. Overall comparison indicates that either Triphenyl phosphine of 1.5 to 2 wt% or MCA of 2 to 3 wt% can be adopted as green flame retardants for encapsulation molding compounds for practical applications.
The metal particles embedded in the molding compound, it is possible that the input/output pin of the IC can become electrically short due to particle bridging, An experimental facility is built up to investigate the abrasive wear behavior of EMC particles. The parameters explored include particle impacting velocity and impacting angle. The results show that the erosion rate depends on both the particle impacting velocity and impacting angle. A higher velocity will cause more erosion whereas a smaller impacting angle will cause more erosion, especially at higher impacting velocities. Furthermore, the morphology of the eroded particles is irregular in shape and a smaller impacting angle will result in a larger dimension of the eroded particles.
Finally, Especially to mention that the metal debris are always present in the EMC powders due to the hard silica fillers in the compound, therefore have to be removed before molding. Nd-Fe-B permanent magnets are used to remove these debris. The results show that the metal debris can be removed effectively as the rate of accumulation of the metal debris increases as time proceeds in the removing operation. The removal effectiveness of the debris is affected by both the magnetic flux density and the flow around the magnet. The wake flow behind the magnet is a relatively low speed recirculation region which facilities the attraction of metal debris in the powders. Thus, the largest amount of the accumulated EMC powders occurs downstream of the magnet. Hence, this low speed recirculation region should be better utilized to enhance the removal efficiency of the metal debris.

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