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研究生：	謝育倉 Hsieh, Yu-Tsang
論文名稱：	銲線機維護與服務之整合法 Integration Methods for Maintenance and Service of Wire Bonder
指導教授：	張仁宗 Chang, Ren-Jung
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系碩士在職專班 Department of Mechanical Engineering (on the job class)
論文出版年：	2007
畢業學年度：	95
語文別：	英文
論文頁數：	158
中文關鍵詞：	維護、機電整合、公設理論、田口方法、價值工程
外文關鍵詞：	Mechatronics, Taguchi method, Axiomatic design, Maintenance, Value Engineering
相關次數：	點閱：113 下載：2
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摘要
在現今產品研發與製造的研究領域中，越來越多的注意力在於致力工業上的成就，來減少技術領先的時間、減少研發與製造的成本、增加產品的品質與性能，與降低全部的生命週期成本。本論文的討論核心主要是針對使用公設理論結合其他方法論來研究有關於銲線機的維護與服務，在公設理論中的兩個原理中，包括獨立原理與資訊原理，確定皆可用來檢查共有的元素而提出對銲線機的設計，資訊原理在本論文中將主要應用於品質確認的強健方法中。
在銲線機的維護與服務中，我們將使用品質功能展開、機電整合、公設理論、田口方法、與價值工程所整合出來的方法論，用來提出創立系統的知識，與整合應用於機台診斷與製程的優化的公設理論，也可將把這些維護工作的資訊與知識彙整成文件;文中提出設備故障與維護工程之間的關係作模型化，所提出的現有方法的好處不只是增強工程師的維護能力，也可以針對複雜的封裝產品及其演化的應用來幫助銲線機的研發工作。
在工業的商場上維護管理之最終價值可利用文中整合的方法加以說明，維護與服務中量化的評估提供了生命週期成本的標準，進而增加客戶的滿意度與客戶的價值。

Abstract
The current research area of product development and manufacturing is increasingly paying attention to address industry efforts to reduce lead time, cut development and manufacturing costs, increase quality and product performance, and lower total life cycle cost. The study of Axiomatic design integrated with other methodologies concerning the maintenance and service for wire bonder is the core of this thesis. Two axioms including the independence and information axioms were identified by examining the common elements that are present in designing a wire bonder. The information axiom will be applied to the verification of quality by the robust method in this thesis.
The integration methods by employing quality function deployment, mechatronics, axiomatic design, Taguchi method, and value engineering are proposed to construct system knowledge and integrate with axiomatic design for machine diagnostics and process optimizations in maintenance and service for wire bonder. These information and knowledge also are to be documented for the maintenance practice. The model of equipment failure and maintenance has been proposed. The benefits by the present methods are not only to improve the engineering ability but also can help to develop the wire bonder to meet the complex applications of IC packaging in evolution.
The ultimate value of maintenance management in the industrial business by the present integration methods is illustrated. The quantitative evaluation in maintenance and service provide the criterion of the life cycle
cost to improve the acceptance or worth by customers.

Contents

Chinese Abstracts 	.......................................Ⅰ
Abstracts        	.......................................Ⅱ
Acknowledgements	.......................................Ⅲ
Contents        	.......................................Ⅳ
Graph Contents   	.......................................Ⅸ
Table Contents   	.....................................ⅩⅢ
Symbol Table    	.....................................ⅩⅤ
Chapter One  Introduction	...............................1
1-1  Introduction	........................................1
1-2  Literature Review	...............................1
1-2.1  Wire Boner History	...............................2
1-2.2  Axiomatic Design and its Applications	.............3
1-3  Research Motivation	...............................5
1-4  Research Methods	...............................5
1-4.1  Quality Function Deployment	......................7
1-4.2  Mechatronics Enigeering	......................7
1-4.3  Axiomatic Design	...............................8
1-4.4  Taguchi Method	...............................8
1-4.5  Value Engineering	...............................9
1-5  The Structure of Thesis	.....................10

Chapter Two  Wire Bonding in IC Packaging Technology	...12
2-1 Introduction 	.......................................12
2-1.1  Brief History of Microelectronic Packaging  
       Technology 	.......................................12
2-1.2  IC Packaging Evolution	.....................14
2-2  The Process of Semiconductor Packaging	............15
2-3  Types of IC Packages	..............................19
2-4  Wire Bonding Techniques	.....................21
2-4.1  The Process of Ball Bonding	.....................22
2-4.2  The Techniques of Wire Bonder and Sub-Systems	...24
2-4.2.1  Console System	..............................25
2-4.2.2  Bond Head Assembly	..............................25
2-4.2.2.1  Electrical Flame-Off (EFO) Assembly	...26
2-4.2.2.2  Wire Clamp Mechanism	.....................26
2-4.2.2.3  Ultrasonic System	.....................27
2-4.2.2.4  Z-Axis Servo System	.....................27
2-4.2.2.5  Bond Itegrity Test System	.....................28
2-4.2.2.6  Flexure Bearing Assembly	.....................29
2-4.2.3  Material Handling System	.....................30
2-4.2.4  Vision System	..............................30
2-4.2.5  XY Table	.......................................31

Chapter Three  Mechatronics Approach for Wire Bonder	...32
3-1 Mechatronics Engineering	.....................32
3-2 System Design and System Framework for Wire Bonder ...36
3-3 Design Flowchart and Process Design for Wire Bonder...38

Chapter Four  Axiomatic Design for Wire Bonder	...41
4-1 Fundamental Axioms of Axiomatic Design	............41
4-1.1 An Industry of Wire Bonder Concerning the 
      Characteristic Domains of Manufacturing, 
      Organization, and Business	.....................41
4-1.2 Design Axioms for Wire Bonder	.....................43
4-2 Decomposition and Functional Requirements	............44
4-2.1 Console System	..............................44
4-2.2 Bond Head Assembly	..............................45
4-2.3 Vision System	..............................45
4-2.4 Marerial Handling System	.....................46
4-2.5 XY Table Assembly	..............................46
4-3 Functional Requirements and Design Parameters for Wire 
    Bonder	.......................................46
4-3.1 Console System	..............................46
4-3.2 Bond Head Assembly	..............................48
4-3.2.1  Electrical Flame-Off (EFO) Assembly	............49
4-3.2.2  Wire Clamp Mechanism	.....................49
4-3.2.3  Ultrasonic System	..............................49
4-3.2.4  Z-Axis Servo System	.....................50
4-3.2.5  Bond Itegrity Test System	.....................50
4-3.2.6  Flexure Bearing Assembly	.....................51
4-3.3 Vision System	..............................52
4-3.4 Marerial Handling System	.....................52
4-3.5 XY Table Assembly	..............................54
4-4 The Physical Survey of Design Parameters	............56

ChapterFive  Maintenance and Failure Mode and Effects 
             Analysis	..............................59
5-1 Maintenance Engineering and Service Operation	...59
5-1.1 Definition of Maitenance and Service Management 	...59
5-1.2 Maintenance and Service Engineering	............62
5-2 Failure Mode and Effects Analysis (FMEA)	............63
5-2.1 FMEA for Engineering	..............................63
5-2.2 FMEA Procedure	..............................65
5-3 Wire Bonding Failure Modes	.....................67
5-3.1 First Bond Failure Modes	.....................69
5-3.1.1  Analysis of First Bond Failure Modes	............71
5-3.1.2  Troubleshooting Analysis for First Bond Process..72
5-3.2 Second Bond Failure Modes	.....................73
5-3.2.1  Analysis of Second Bond Failure Modes  ..........74
5-3.2.2  Troubleshooting Analysis for Second Bond Process.74
5-3.3 Looping Failure Modes	..............................75
5-3.3.1  Analysis of Looping Failure Modes	............77
5-3.3.2  Troubleshooting Analysis for Looping Process 	...78
5-3.4 Ball Formation Failure Modes	.....................78
5-3.4.1  Analysis of Bond Formation Failure Modes	...80
5-3.4.2  Troubleshooting Analysis for Bond Formation 
         Process..........................................80
5-3.5 Bond Integrity Test System Failure Modes	...81
5-3.5.1  Analysis of Bond Integrity Test System Failure 
         Modes	.......................................81
5-3.5.2  Troubleshooting Analysis for Bond Integrity Test 
         System ..........................................82

Chapter Six  Quality Analysis for Wire Bonder	............83
6-1 Analysis of Porcess Variables through Robust Methods..83
6-1.1 Taguchi Method in Extension	.....................83
6-1.2 The Relationship of S/N Ratio and Information Axiom	................................................84
6-2 Quality Analysis for the Porcess of Wire Bonding	...86
6-2.1 Process Variables of Wire Bonding	............86
6-2.2 Process Variables for Quality Analysis	............87
6-3 Quality Optimization of Bond Ball	............88
6-3.1 Quality Characteristics and Ideal Functions	...88
6-3.2 Factorisl Effects and Control Factors	............89
6-3.3 Orthoganal Arrays and Experimental Data	............91
6-3.4 Factor Response Analysis	.....................93
6-3.5 Optimal Design	..............................96
6-3.6 Predicted Values	..............................97
6-3.7 Confirmation Experiemnts	....................100

Chapter Seven  Integration and Implementation of 
        Maintenance   and Service	....................108
7-1 Integration of Axiomatic Design, Robust Method, and  
    Maintenance Engineering	.............................108
7-1.1 The Integration Methods	....................108
7-1.2 Quantitative Evaluation for Wire Bonder	...........110
7-1.3 The Implementation of Maintenance for Wire Bonder
	...............................................114
7-2 Value Engineering for Wire Bonding	...........117
7-2.1 Value and Cost in Life Cycle	....................117
7-2.2 Value Analysis for the Maintenance and Service	..118

Chapter Eight  Conclusions and Future Development	..132
8-1  Conclusions	......................................132
8-2  Future Development	.............................133
Reference       	 .....................................135
Appendix       	......................................139
                                    

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校外：2007-08-07公開

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