本研究目的在探討添加的Sb(0、2.18及3.86 Wt.%)對Sn-Ag無鉛銲料微結構的影響，以及冷卻速率(慢冷,1.68℃/sec、快冷,5.03℃/sec)對Cu/Ni-P/Au UBM及Cu基板銲點的界面微結構變化；同時利用單邊搭接試件及150℃高溫儲存試驗來評估銲點剪切強度與抗熱性的影響。
　　實驗結果顯示，銲料熔點隨著Sb的添加而提升。Sn-Ag銲料添加Sb低於3.86%時，Sb會固溶在-Sn中，而微結構為環狀分佈的Ag3Sn及-Sn所構成共晶結構為主；當Sb添加量至3.86%時，則在β-Sn內生成層狀的Sn4Sb3化合物。而銲接點在較快的冷卻速率之下，Ag3Sn化合物及β-Sn枝晶結構均產生細化的效果，且細緻的Ag3Sn會嵌入界面IMC中，進而抑制界面IMC成長速率。Ag3Sn化合物在經高溫儲存後會成長粗大，而Sb添加可以減緩Ag3Sn粗大化的現象，但在添加至3.86％Sb時對減緩Ag3Sn粗大並不明顯。
　　在機械測試方面，與Cu基板接合的銲點，未添加Sb的銲點剪切強度隨著150℃熱儲存時間的增加而下降，而含Sb的銲點剪切強度並沒有隨著熱儲存時間的增加而下降；然而所有與Cu/Ni-P/Au UBM接合的銲點，在熱儲存600小時後，其剪切強度均有明顯回升的趨勢。且低Sb含量的銲接點可利用較快冷卻速率，而達到高Sb含量銲點所表現出的強度。於快速冷卻下的Sn-3.15Ag-2.18Sb 與Cu/Ni-P/Au UBM銲點所到的剪切強度為61.4 MPa，而慢冷之Sn-2.92Ag-3.86Sb銲點剪切強度則為64.7 MPa。
　　由觀察破斷面可知，所有的銲點破斷位置均是斷裂在銲接點內。由Cu/Ni-P/Au UBM的銲點破斷面顯示，韌窩組織隨著熱儲時間的增加而呈現先粗大再細緻的變化模式，而銲點接合強度亦隨著韌窩尺寸的縮小而提升。綜合銲料熔點、金相微結構、銲點剪切強度及延展性而言，Sn-3.15Ag-2.18 Sb銲料與Cu/Ni-P/AuUBM接合的銲點於快冷之下，則可有較佳的性質。

　　This study is to discuss the effect of Sb additions (0~3.86 wt%) as well as the cooling rate(slowly cooling, 1.68℃/sec、fast cooling, 5.03℃/sec) upon the microstructure ad the interfacial metallic compound variations of Sn-Ag solder joints combined with Cu/Ni-P/Au UBM and Cu substrates. The Single Lap specimens and high temperature storage at 150℃ are also performed to evaluate the shear strength and thermal resistance of solder joints.
　　The experimental results show that melting points of Sn-Ag-xSb solders increased with the addition of Sb. When the amounts of Sb is lower than 3.86%, Sb will solve into beta-Sn matrix, and the microstructures is composed of the eutectic phase of beta-Sn with Ag3Sn dispersion surrounding primary beta-Sn. When Sb is reached to 3.86%, the laminar-like Sn4Sb3 compounds are dispersed in beta-Sn matrix. Ag3Sn compounds and beta-Sn dendrite will become finer by fast cooling of the solder joints. Meanwhile the finer fibrous Ag3Sn will be bound into interfacial surface to suppress the growth rate of IMC layer. Sb additions reduce the coarseness of the Ag3Sn at high temperature, however, this effect is not evident as the amount of Sb reaches 3.86%.
　　The shear strength of Sn3.5Ag solder joints combined with Cu substrates decreased by increasing the thermal storage time at 150℃. But this did not occur by the results of the Sn-Ag solder joints with Sb addition. Shear strength of whole solder joints combined with Cu/Ni-P/Au UBM on the contrary increased after thermal storage for 600 hours. In Sn-Ag-xSb solder, fast cooling by specimen of low Sb addition has the same effect on strength performance as that by more Sb addition. The shear strength of Sn-3.15Ag-2.18Sb solder joints combined with Cu/Ni-P/Au UBM under fast cooling is 61.4 MPa, and Sn-2.92Ag-3.86Sb solder joints under slowly cooling is 64.7 MPa.
Fracture observation reveals that all the specimen fractured at solder joints matrix. Fractographical observation show that the fracture dimples become finer as the duration of thermal storage increased. The adhesion strength of solder joints also increased as dimple size decreased. Evaluation on based this study show that, the Sn-3.15Ag-2.18Sb solder joints combined with Cu/Ni-P/Au UBM under fast cooling has a better reliability and performance among the all.

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