半導體製程技術一直以超乎預期的速度不斷地進步。在新的晶圓製程的上線上的評估，已不再似0.18μm以前。在現今新的晶圓中，每一個製程的參數上的改變，往往對最後的晶圓生產上的良率（Yield）有重大的影響。所以在晶圓的製程中新的製程上線前的評定方式就顯的非常的重要了。在以往的新製程的上線往往只重視，本身製程上的改善，而忽略了重要的整體整合上的影響，本身的參數的改善很有可能對整體製程整合的參數改變有了重大的影響，而變成在晶圓良率上的重大的損失。
　　本研究就是以平衡計卡的方法來針對，在先進的半導體中新的製程的上線中的參數加以探討。以在半導體製程中的一項比較新且較複雜的技術- 銅金屬化學機械研磨（Copper Chemical Mechanical Polishing, CMP）來說明如何將其結合平衡計分法的應用，使得製程的上線利用本方法可以提供一種更有效的方式。並利用平衡計分卡的方法，再加依參數在整體製程整合中的重要性與影響程度，給予不同的權重。依據新製程的參數結果再以權重來取得的綜合成效。如此再將計分卡予以分析，將可以清楚的瞭解到新製程對整體整合的影響程度。

　Semi-conductor process technology is advancing promptly unexpected. The new evaluation procedures on wafer production is unlike what it used to be with 0.18μprocess. In the new age of process technology, production yield is eventually influenced by the parameters changed in process. Therefore, the methods in evaluating the changes in new process technology on production line are essentially important. The focus of new process is primarily on the changes in process in the past; it is normally neglected with its effects to overall process integration. The changed parameters in new process may give great effects to process integration parameters, thereby; a great loss may be resulted in wafer yields.
　The research on new process technology will adapt the use of balanced scorecard to investigate the possible effects from the process changes. In semi-conductor processes, an advanced and complicated technology, Copper Chemical Mechanical Polishing (CMP), will demonstrate the application with the scorecard, which provides an effective way for new process changes on the production line. The use of balanced scorecard provides a various emphasis to the process integration parameters. Performance measurement is achieved based the result of the balanced scorecard. A thorough analysis on the scorecard result can easily realize on how new process changes influence overall process integration.

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