近年來奈米銀漿料被廣泛的應用在低溫銅對銅接合。奈米顆粒相較於塊狀體，具有較低的熔融溫度，使得奈米顆粒的懸浮液能夠在一般環境下進行轉移及圖案化。在本研究中，利用高能物質過氧化氫異丙苯改質商用的奈米銀漿料來進行銅對銅的接合實驗。高能物質在熱裂解時會放出額外的焦耳熱，可定點加熱周圍的奈米顆粒，從XPS的化學組合分析中可知，CHP可加速清除原本附在奈米銀顆粒表面的保護基，最重要的是，在剪切強度測試中，以200度C的熱壓條件下，銅對銅的接合強度可從8.8MPa大幅上升至14.6MPa。另外也利用SEM, XRD以及掃描式熱顯微鏡(SThM)來分析微結構。電性的部分利用凱文結構來量測接觸電阻，從結果可以發現不管有沒有添加CHP，其接觸電阻都維持一樣。 從這些實驗的結果可知，以高能物質CHP改質奈米銀漿料，可以在200°C的熱壓環境下提升銅對銅的接合強度，且仍保持其電性值。

Silver nanopastes have recently demonstrated their promising uses in the low-temperature copper-to-copper (Cu-to-Cu) bonding. Suspension solutions of these nanoparticles allows the ambient process in the material transferring and patterning, while the nanoscales particles exhibit the lower fusion temperature as compared with the bulk counterpart. In this research, an energetic reagent, cumene hydroperoxide (CHP), is incorporated in the formulation of commercial silver nanopastes for the Cu-to-Cu bonding. The thermal decomposition of CHP provides the additional joule heat that is in-situ released among silver nanoparticles. XPS composition analysis indicates that the presence of CHP accelerates the removal of surfactants originally surrounding the silver nanoparticles. More importantly, the shear strength measurements reveal the remarkable enhancement in the Cu-to-Cu bonding from 8.8 MPa to 14.6 MPa under the hot pressing at 200oC. Microstructures were also examined and analyzed by SEM, XRD, and the scanning thermal microscopy (SThM). Electric properties based on the Kelvin structure reveal the contact resistance of the Cu-to-Cu bonding remains the same between samples with and without CHP addition. These results concluded the formulation of silver nanopastes with the addition of energetic CHP significantly enhanced the Cu-to-Cu bonding strength at the hot pressing temperature of 200oC with no loss in the electric performance.

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