本研究主要探討錫銀以及錫銀銅無鉛銲錫合金與鎳基材在迴焊初期階段焊錫反應期間，液態銲錫與固態鎳界面反應行為，進一步瞭解界面介金屬化合物生成機制。
錫銀與錫銀銅銲錫合金分別與電鍍鎳層在250 ℃下以短時間迴焊接合後，再利用液態氮將接合試片進行快速急冷，以保持銲錫與鎳基材液/固相反應時的狀態。錫銀銲錫與鎳基材在5秒鐘以及15秒鐘迴焊反應期間，Ni-Sn非晶質擴散區形成在銲錫與鎳基材之間界面，在這個非晶質擴散區內部並且形成奈米尺寸的介穩態NiSn介金屬化合物，此NiSn介金屬化物也會形成在接觸鎳層的界面上；錫銀銅銲錫與電鍍鎳層經由5秒鐘短時間迴焊反應後，在錫銀銅與鎳基材界面間會生成三元Ni-Sn-Cu非晶質擴散區，這層非晶質擴散區內部會形成NiSn與Cu6Sn5兩種介金屬奈米晶，本研究也觀察非晶質擴散區內部微結構組織，進一步探討介金屬化合物在凝核期間的結構演進。另外，在三元非晶質擴散區與鎳基材之間界面會形成NiSn凝核區，介穩態NiSn介金屬化合物生成在接觸鎳層界面上。
因此，當液態錫銀與錫銀銅和固態鎳反應時，首先會在銲錫與鎳基材界面形成一層非晶質擴散區，擴散區內部會有介金屬奈米晶胞的生成，介金屬化合物也會形成在接觸鎳層界面上，介金屬化合物形成的機制可能同時藉由異質成核與均質成核的方式。當銲錫與鎳基材進行迴焊反應時，鎳晶格呈現之字形途徑溶解到液態銲錫中。
另外，本研究也藉由TEM臨場即時觀察Ni-Sn非晶質擴散區在100℃加熱期間的結構變化。在加熱期間，非晶質中的奈米晶胞會成長，非晶質內部的基本結構也會因為原子的變動而造成基本結構形狀的改變，甚至瓦解，而基本結構中原子與原子之間的鍵結所形成的dangling bond，會造成原子鍵結發生彎曲、拉長的現象。

This study focused on the behaviors of Sn-3.5Ag/Ni and Sn-3.0Ag-0.5Cu/Ni interfacial reactions during the early stage soldering process. The formation mechanism of the interfacial intermetallic compounds and the dissolution behavior of Ni substrate were further investigated in this study.
Soldering of the Sn-Ag and Sn-Ag-Cu solders on the electroplated Ni were performed at 250℃ for the short reaction time. In order to reserve the status of the reaction between liquid solder and solid Ni, the soldered specimens were quenched rapidly by the liquid nitrogen. An amorphous Ni-Sn diffusion zone formed at the interface between solder and Ni in the periods of reflow for 5s and 15s. The formation of metastable NiSn with the nano size was observed within an amorphous diffusion zone as well as in contact with Ni layer. In addition, the ternary Ni-Sn-Cu amorphous diffusion zone formed at the interface between Sn-Ag-Cu solder and Ni layer after reflow for 5s. The formation of nanocrystalline NiSn and Cu6Sn5 intermetallic compounds was observed within the ternary amorphous diffusion zone. To analyze further the amorphous diffusion zone finds the possible evolution of intermetallic structure during nucleation. Metastable NiSn compound formed in contact with Ni layer and resulted in the formation of NiSn nucleation zone between an amorphous zone and Ni layer.
When the liquid Sn-Ag and Sn-Ag-Cu solders reacted with solid Ni, an amorphous diffusion zone formed at the solder/Ni interface. Nanocrystalline intermetallic compounds formed not only in the amorphous diffusion zone but also in contact with the Ni layer. The formation of interfacial intermetallic compounds may take place through the homogeneous nucleation and heterogeneous nucleation. The Ni substrate dissolved into the molten solder during reflow. The formation of zigzag structure shows the dissolution behavior of Ni substrate.
In addition, the behavior of Ni-Sn amorphous diffusion zone was investigated with in-situ TEM observations during heating at 100℃. The growth of the nano cell took place within an amorphous diffusion zone during heating. The atomic interactions resulted in the transition and disintegration of base structure. The formation of dangling bond induced the deformation of the bonding between the atoms in the base structure.

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