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研究生：	鄭詠隆 Jheng, Yong-Long
論文名稱：	接觸式球鏡輔助Nd-YAG雷射熱裂法之玻璃切割裂紋分析 The analysis of glass cracks propagation in Nd-YAG laser thermal cleavage with a contact ball-lens
指導教授：	林震銘 Lin, Jehn-Ming
學位類別：	碩士 Master
系所名稱：	工學院 - 機械工程學系 Department of Mechanical Engineering
論文出版年：	2014
畢業學年度：	102
語文別：	中文
論文頁數：	114
中文關鍵詞：	雷射切割、球透鏡、裂紋生長
外文關鍵詞：	Laser cleavage, Ball-lens, Crack propagation
相關次數：	點閱：129 下載：0
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摘要

本文在討論雷射熱裂法輔玻璃球鏡加壓之玻璃切割，觀察切割路徑位於轉折處之裂紋變化現象，並透過改變不同的加工參數，例如，雷射功率、雷射速度、球鏡大小、球鏡加壓的力量等等，控制裂紋的生長情形，並找到適合的加工參數。

數值模擬部分，首先先利用光學軟體ZEMAX確認雷射光斑直徑，接著將此光斑代入ANSYS內部計算出試件的溫度場，接著在給予試件赫茲應力，並且將計算完畢的溫度場代入疊加在一起，而獲得整體試件的應力場，其中包含了熱應力以及赫茲應力。

實驗加工部分，本研究係利用Nd-YAG雷射加工鈉鈣玻璃，預先將鈉鈣玻璃表面上燻上一層碳質層，接著將試件置入夾治具，利用Z軸昇降平台上昇使試片與球透鏡之間產生一個接觸力，也因為邊界拘束條件的影響，整體試件會產生一個彎矩的效應，最後雷射於試件內加工一個封閉正方形路徑。

實驗結果顯示出，隨著雷射功率提高，交叉裂紋的數量會隨之增加，若提高球透鏡加壓力量，可以有效的減少側向裂紋，若雷射速度較慢，可以有效的使直線裂紋穩定的生長，所以使用適當的雷射速度、雷射功率以及加壓的力量，可以獲得較優良的裂紋品質。

關鍵字 : 雷射切割；球透鏡；裂紋生長

SUMMARY

The crack propagation of the soda-lime glass in laser cleavage under a loading from a contact ball-lens was investigated in this study. In order to control the crack propagation with proper processing parameters, the crack growth was observed experimentally when cutting in a square loop with various processing parameters such as laser power, laser velocity, ball-lens diameter and contact force.

In the numerical simulation, the laser spot diameter was simulated by ZEMAX software. The temperature and thermal stress were calculated by the finite element method with ANSYS software. Based on the Hertz theory, the contact stress on the glass sheet was determined and superposed on the thermal stress from the laser heating. Therefore the stress fields contain the thermal and mechanical stresses to enhance the crack control.

A 1064 nm Nd-YAG laser was used to cut a closed-loop square path in soda-lime glass specimen experimentally. The glass sheet was coated with a layer of the carbon film to improve the absorption on the surface without the contact ball lens. Therefore a tensile stress state could be generated with the bending force in a proper edge fixture of the glass specimen.

The results show that the increase of laser power will increase the length of the side crack, and the increase of the contact force of the ball-lens will reduce the length of side cracks effectively. If the laser velocity was decreased, it will stabilize the crack propagation in the turning points. With appropriate laser power and contact force, the cutting quality might be improved.

Keywords: Laser cleavage;Ball-lens;Crack propagation.

目錄
中文摘要....................................................I
英文摘要...................................................II
誌謝....................................................VIII
目錄......................................................IX
表目錄...................................................XIII
圖目錄.....................................................XV
符號說明................................................XXIV
第一章 前言.................................................1
1-1 研究動機................................................1
1-2 文獻回顧................................................3
1.2.1雷射路徑改變與裂紋生長之研究...............................3
1.2.2雷射切割脆性材料技術.....................................5
1-3 本文架構................................................8
第二章 應用理論.............................................10
2-1赫茲應力介紹.............................................10
2-2球透鏡相關光學...........................................12 
2-2.1球透鏡的相關公式與計算...................................12
2-2.2具擴散角之光束通過球透鏡之折射............................14
2-3脆性材料破裂機制介紹......................................16
2-3.1 雷射點熱源作用下之裂紋生長之方向性預測.....................17
2-3.2 裂紋尖端之應力分佈.....................................18
2-3.3 裂紋生長之應變能因子...................................19
2-3.4 高斯熱源所造成之熱應力場................................21
第三章 數值分析.............................................23 
3-1 ZEMAX 光學模擬.........................................23
3-1.1 ZEMAX之軟體簡介......................................23 
3-1.2 實驗光路與模擬結果.....................................24
3-2 ANSYS APDL 數值模擬....................................26 
3-2.1 ANSYS APDL之軟體簡介.................................26
3-2.2模型設計與網格設定......................................27 
3-2.3 材料參數設定..........................................29
3-2.4 邊界條件與加工參數.....................................31
3-3模擬結果與討論...........................................33
3-3.1溫度場模擬結果與討論....................................34 
3-3.2改變不同雷射速度所造成之應力結果...........................36
3-3.3改變不同雷射功率所造成之應力結果...........................40
3-3.4改變不同球鏡加壓力量所造成之應力結果.......................45
3-3.5改變不同球鏡直徑所造成之應力結果...........................49
3-3.6改變底部界面所造成之應力結果..............................54
3-3.7邊界拘束對於加工區域不同所造成之應力結果....................60
3-3.8改變不同球鏡相關加工參數於試件深度方向所造成之應力結果.........63
3-4 總結..................................................65 
3-4.1加工製程之差異對於裂紋生長之影響...........................65 
3-4.2加工參數對於裂紋生長之影響...............................67 
第四章 實驗加工.............................................69
4-1 實驗前置作業............................................69 
4-1.1 力量量測實驗..........................................69
4-1.2 雷射功率量測實驗.......................................71
4-1.2試件吸收率量測實驗......................................73
4-2 實驗設備與實驗流程.......................................75 
4-2.1球鏡之夾具介紹.........................................75
4-2.2 玻璃試件之夾具介紹.....................................77 
4-2.3 全實驗流程介紹........................................78
4-3實驗結果與討論...........................................80
4-3.1裂紋介紹..............................................80
4-3.2改變不同雷射功率之切割結果比較............................83
4-3.3改變不同雷射速度之切割結果比較............................85
4-3.4改變不同球鏡加壓力量之切割結果比較.........................87
4-3.5改變不同球鏡直徑之切割結果比較............................89
4-3.6改變底部界面之切割結果比較...............................91
  4-4實驗總結論............................................94
4-4.1數值模擬結果與實驗加工之結果之比較.........................94
4-4.2接觸式球鏡輔助雷射熱裂法切割加工總結......................101
第五章 結論...............................................103
5-1本文回顧與總結..........................................103
5-2改善建議以及未來發展.....................................107
參考文獻..................................................108
附錄.....................................................110
                                    

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校內：2024-09-01公開
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